| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 01/07/2004 | EP1207981B1 Spindle assembly for force controlled polishing |
| 01/07/2004 | CN1466676A In-situ method and apparatus for end point detection in chemical mechanical polishing |
| 01/06/2004 | US6673634 Wafer protection method |
| 01/06/2004 | US6672947 Method for global die thinning and polishing of flip-chip packaged integrated circuits |
| 01/06/2004 | US6672945 Polishing apparatus and dressing method |
| 01/06/2004 | US6672944 Initial position setting method for grinding device |
| 01/06/2004 | US6672941 Method and apparatus for chemical/mechanical planarization (CMP) of a semiconductor substrate having shallow trench isolation |
| 01/06/2004 | US6672940 Surface polishing slurry cooling system |
| 01/02/2004 | EP1224058B1 Constant spindle power grinding method |
| 01/01/2004 | US20040002289 Method and apparatus for monitoring a polishing condition of a surface of a wafer in a polishing process |
| 12/31/2003 | WO2003077309A3 Method of predicting post-polishing waviness characteristics of a semiconductor wafer |
| 12/31/2003 | WO2003066282A3 Systems and methods for characterizing a polishing process |
| 12/31/2003 | CN2595823Y Card grinder with wire height planeness measuring and controlling device |
| 12/31/2003 | CN2595822Y Wrapped mill cover plate card clothing machine with root difference measuring and control device |
| 12/31/2003 | CN1132720C Apparatus and method for working |
| 12/30/2003 | US6671051 Apparatus and methods for detecting killer particles during chemical mechanical polishing |
| 12/30/2003 | US6670200 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same |
| 12/30/2003 | US6669539 System for in-situ monitoring of removal rate/thickness of top layer during planarization |
| 12/30/2003 | US6669532 Device and method for cool air cooling type machining |
| 12/30/2003 | CA2259240C Microfinishing machine |
| 12/25/2003 | US20030236055 Polishing pad for endpoint detection and related methods |
| 12/24/2003 | WO2003106108A1 Apparatus for checking the dimensional and geometric features of pins |
| 12/23/2003 | US6667239 Chemical mechanical polishing of copper-oxide damascene structures |
| 12/23/2003 | US6666756 Wafer carrier head assembly |
| 12/23/2003 | US6666754 Method and apparatus for determining CMP pad conditioner effectiveness |
| 12/23/2003 | US6666749 Apparatus and method for enhanced processing of microelectronic workpieces |
| 12/23/2003 | US6666061 Apparatus for deep rolling of recesses and radii of crankshaft journal bearings |
| 12/18/2003 | WO2003103898A1 Residual film monitoring device, polishing device, method for manufacturing semiconductor device, and semiconductor device |
| 12/18/2003 | WO2003080291A3 Polisher with a load control system |
| 12/18/2003 | WO2003006205A3 Barrier removal at low polish pressure |
| 12/18/2003 | WO2002079887A3 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 12/18/2003 | US20030232576 Apparatus for polishing a substrate |
| 12/18/2003 | US20030232575 Method and system for in-situ monitoring of mixing ratio of high selectivity slurry |
| 12/17/2003 | EP1371449A2 Chemical mechanical polishing head having floating retaining ring and carrier with multi-zone polishing pressure control |
| 12/17/2003 | EP1370393A1 Method of reducing thermal distortion in grinding machines |
| 12/17/2003 | EP1370391A1 Apparatus for checking dimensional and geometrical features of pins |
| 12/17/2003 | EP1019218B1 Sharpening of fittings |
| 12/16/2003 | US6664557 In-situ detection of thin-metal interface using optical interference |
| 12/16/2003 | US6663469 Polishing method and apparatus |
| 12/16/2003 | US6663466 Carrier head with a substrate detector |
| 12/11/2003 | WO2002103778A3 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| 12/11/2003 | US20030229468 Chemical mechanical polishing apparatus having a measuring device for measuring a guide ring |
| 12/11/2003 | US20030228830 System for manufacturing a semiconductor device, polishing slurry feeder and method for manufacturing a semiconductor device |
| 12/11/2003 | US20030226764 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 12/10/2003 | EP1368157A1 Polishing disk with end-point detection port |
| 12/10/2003 | CN1461251A Semiconductor wafer, polishing apparatus and method |
| 12/09/2003 | US6659850 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
| 12/09/2003 | US6659847 Polishing surface of probe pin of probe card by moving cleaning wafer to contact surface of pin with first acceleration rate for plurality of times, smoothing surface by moving cleaning wafer with second, faster, acceleration rate |
| 12/09/2003 | US6659843 Substrate dicing method |
| 12/09/2003 | US6659842 Method and apparatus for optical monitoring in chemical mechanical polishing |
| 12/04/2003 | WO2003099516A1 Method for producing thin, plate-like elements having plane-parallel plane surfaces and a predetermined thickness |
| 12/04/2003 | WO2003083522A3 System and method of broad band optical end point detection for film change indication |
| 12/04/2003 | WO2003057404A3 Method and apparatus for applying downward force on wafer during cmp |
| 12/04/2003 | US20030224701 Process for grinding an ophthalmic lens, including a plotting operation without contact |
| 12/04/2003 | US20030224610 Fabrication process for bonded wafer precision layer thickness control and its non-destructructive measurement method |
| 12/03/2003 | EP1366860A1 Non-destructive method for measuring the thickness of a bonded wafer |
| 12/03/2003 | EP1366856A2 Apparatus for processing a lens and a process for processing a lens |
| 12/03/2003 | CN1129507C Rotary abrasive tool |
| 12/03/2003 | CN1129505C Abrasive machine |
| 12/02/2003 | USRE38340 Multi-point bending of bars during fabrication of magnetic recording heads |
| 12/02/2003 | US6657726 In situ measurement of slurry distribution |
| 12/02/2003 | US6656755 Method for manufacturing semiconductor device by polishing |
| 12/02/2003 | US6656026 Wafer polishing apparatus |
| 12/02/2003 | US6656023 In situ control with lubricant and tracking |
| 12/02/2003 | US6656015 Point-of-use fluid regulating system for use in the chemical-mechanical planarization of semiconductor wafers |
| 11/27/2003 | WO2003097300A1 Polishing pad with optical sensor |
| 11/27/2003 | US20030220054 Process for bevelling an ohthalmic lens including a plotting stage without contact |
| 11/27/2003 | US20030220050 Removable lapping guide for magnetic recording haed and method of use |
| 11/27/2003 | US20030219962 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 11/26/2003 | CN1457959A Positioning block height difference and grinding quantity measuring machine |
| 11/25/2003 | US6654132 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers |
| 11/25/2003 | US6654108 Test structure for metal CMP process control |
| 11/25/2003 | US6652708 Methods and apparatus for conditioning and temperature control of a processing surface |
| 11/25/2003 | US6652358 Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machine |
| 11/25/2003 | US6652357 Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing |
| 11/25/2003 | US6652355 Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
| 11/25/2003 | US6651474 Device for the fixed-rolling of crankshafts |
| 11/25/2003 | US6651299 Method and apparatus for manufacturing endless metallic belt, and the endless metallic belt manufactured by the method |
| 11/20/2003 | WO2003096124A1 Lens consisting of a crystalline material |
| 11/20/2003 | US20030216108 Polishing pad sensor assembly with a damping pad |
| 11/20/2003 | US20030216107 Polishing pad with optical sensor |
| 11/20/2003 | US20030216106 Method and apparatus for polishing, and lapping jig |
| 11/20/2003 | US20030216105 Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal |
| 11/20/2003 | US20030216104 Method for processing a work piece in a multi-zonal processing apparatus |
| 11/20/2003 | US20030213558 Chemical mechanical polishing endpoint detection |
| 11/19/2003 | EP1362378A2 Chemical mechanical polishing of copper-oxide damascene structures |
| 11/18/2003 | US6650408 Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus |
| 11/18/2003 | US6648740 Carrier head with a flexible membrane to form multiple chambers |
| 11/18/2003 | US6648735 Method of abrading both faces of work piece |
| 11/18/2003 | US6648731 Polishing pad conditioning apparatus in chemical mechanical polishing apparatus |
| 11/18/2003 | US6648729 Wafer pressure regulation system for polishing machine |
| 11/18/2003 | US6648728 Polishing system |
| 11/18/2003 | CA2264106C Method and apparatus for computer numerically controlled pin grinder gauge |
| 11/13/2003 | US20030211811 Adaptable multi zone carrier |
| 11/13/2003 | US20030210042 Standalone eddy current measuring system for thickness estimation of conductive films |
| 11/13/2003 | US20030210041 Eddy current measuring system for monitoring and controlling a chemical vapor deposition (CVD) process |
| 11/12/2003 | CN1455717A Initial position setting method for grinding device and milling device thereof |
| 11/12/2003 | CN1454748A Centerless grinding machine precision monitoring apparatus |
| 11/11/2003 | US6645865 Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
| 11/11/2003 | US6645308 Polish cleaning apparatus and method in manufacture of HGA |