| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 03/04/2004 | US20040040168 Workpiece measuring apparatus |
| 03/03/2004 | EP1393853A2 Machine tool |
| 03/03/2004 | EP1392472A2 Automatic or semi-automatic device for trimming an ophthalmic lens |
| 03/03/2004 | CN1479942A Method for determinating endpoint and semiconductor wafer |
| 03/02/2004 | US6699791 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 03/02/2004 | US6699102 Lapping monitor for monitoring the lapping of transducers |
| 03/02/2004 | US6699101 Method for removing a damaged substrate region beneath a coating |
| 02/26/2004 | US20040038787 Machine tool |
| 02/26/2004 | US20040038625 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces |
| 02/26/2004 | US20040038624 Multiprobe detection system for chemical-mechanical planarization tool |
| 02/26/2004 | US20040038623 Methods and systems for conditioning planarizing pads used in planarizing substrates |
| 02/26/2004 | US20040038502 Method of detecting chemical mechanical polishing endpoints in thin film head processes |
| 02/26/2004 | DE10324530A1 Schleifverfahren für eine Doppelscheibenflächenschleifmaschine mit vertikalem Vorschub Grinding method for a double disc surface grinding machine with vertical feed |
| 02/26/2004 | DE10201680B4 Verfahren zum Bearbeiten von Möbelstücken Method for processing pieces of furniture |
| 02/25/2004 | EP1390820A2 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 02/25/2004 | EP1390176A1 Integrated endpoint detection system with optical and eddy current monitoring |
| 02/24/2004 | US6695682 Polishing method and polishing apparatus |
| 02/24/2004 | US6695681 Endpoint detection system for wafer polishing |
| 02/19/2004 | WO2004014603A2 Polishing pad with window |
| 02/19/2004 | US20040033769 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 02/19/2004 | US20040033762 Method of detecting a substrate in a carrier head |
| 02/19/2004 | US20040033761 Polishing apparatus |
| 02/19/2004 | US20040033760 Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile |
| 02/19/2004 | US20040033759 Platen and manifold for polishing workpieces |
| 02/19/2004 | US20040033758 Polishing pad with window |
| 02/19/2004 | US20040033757 Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers |
| 02/19/2004 | US20040032256 Frequency measuring device, polishing device using the same and eddy current sensor |
| 02/18/2004 | CN1476368A Abrasive article having window system for polishing wafers, and methods |
| 02/18/2004 | CN1138615C Automated drill bit re-sharpening and verification system |
| 02/18/2004 | CN1138612C Wafer edge polishing method and apparatus |
| 02/12/2004 | US20040029503 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
| 02/12/2004 | US20040029500 Method of grinding for a vertical type of double disc surface grinding machine for a brake disc |
| 02/12/2004 | US20040029499 Process and device for the machining by abrasive belt of a bearing surface on a component, particularly for superfinishing a cam surface on a cam shaft |
| 02/12/2004 | US20040029490 Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 02/12/2004 | US20040029489 Polishing apparatus |
| 02/12/2004 | US20040029487 Grinding method |
| 02/12/2004 | US20040029333 Polishing device and method of manufacturing semiconductor device |
| 02/11/2004 | EP1214174B1 Windowless belt and method for in-situ wafer monitoring |
| 02/11/2004 | CN1474734A Method of chemical polishing |
| 02/10/2004 | US6690991 Machine control gage system performing roundness measuring function |
| 02/10/2004 | US6690473 Integrated surface metrology |
| 02/10/2004 | US6688945 CMP endpoint detection system |
| 02/05/2004 | WO2004012249A1 Polishing device |
| 02/05/2004 | WO2003032374A3 Workpiece carrier with adjustable pressure zones and barriers |
| 02/05/2004 | US20040023607 Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers |
| 02/05/2004 | US20040023606 Advanced chemical mechanical polishing system with smart endpoint detection |
| 02/05/2004 | US20040020295 Method of measuring pore depth on the surface of a polishing pad |
| 02/05/2004 | DE10034116B4 Verfahren zum Messen des Abtrags bei der Innenrundfeinbearbeitung einer Bohrung A method for measuring the abrasion at the inner round fine machining of a bore |
| 02/04/2004 | EP1386694A1 Method of polishing and polishing machine |
| 02/04/2004 | EP1385669A1 Apparatus for the diameter checking of eccentric portions of a mechanical piece in the course of the machining in a grinding machine |
| 02/04/2004 | CN1473358A Abrasive cloth, polishing device and method for manufacturing semiconductor device |
| 02/04/2004 | CN1473357A Substrate processing method |
| 02/04/2004 | CN1472638A Modular assistant visualizing system |
| 02/04/2004 | CN1137504C Piezoelectric actuated chemical mechanical polishing tray |
| 02/03/2004 | US6684704 Measuring the surface properties of polishing pads using ultrasonic reflectance |
| 01/29/2004 | WO2004009291A1 Polishing pad for endpoint detection and related methods |
| 01/29/2004 | WO2003019627A3 Cmp process involving frequency analysis-based monitoring |
| 01/29/2004 | US20040016895 In-situ detection of thin-metal interface using optical interference via a dynamically updated reference |
| 01/28/2004 | CN1471726A Polishing device and method of manufacturing semiconductor device |
| 01/28/2004 | CN1471725A Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device |
| 01/27/2004 | US6682628 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 01/27/2004 | US6682404 Method for controlling a temperature of a polishing pad used in planarizing substrates |
| 01/27/2004 | US6682403 Grinding machine with two grinding wheels |
| 01/27/2004 | US6682399 Pressure monitoring system for chemical-mechanical polishing |
| 01/22/2004 | US20040014401 Method for backside die thinning and polishing of packaged integrated circuits |
| 01/22/2004 | US20040014399 Selective barrier removal slurry |
| 01/22/2004 | US20040014396 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
| 01/22/2004 | US20040014395 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| 01/22/2004 | US20040012795 Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates |
| 01/22/2004 | US20040011461 Apparatus and method of controlling the temperature of polishing pads used in planarizing micro-device workpieces |
| 01/22/2004 | DE10230146A1 Verfahren zum Bearbeiten eines scheibenförmigen Werkstückes A method for processing a disk-shaped workpiece |
| 01/21/2004 | EP1381492A1 A chemical mechanical planarization system with an adjustable force applying air platen |
| 01/21/2004 | CN1468685A Method for processing disc-shaped workpieces |
| 01/20/2004 | US6681143 Match grinding of spool to control valve body of oil activated fuel injector |
| 01/20/2004 | US6679762 Recession control via thermal expansion coefficient differences in recording heads during lapping |
| 01/20/2004 | US6679756 Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device |
| 01/15/2004 | WO2002047139A3 Methode of forming a copper film on a substrate |
| 01/15/2004 | US20040010380 Method of detecting a polishing end point in a chemical mechanical polishing process |
| 01/15/2004 | US20040009736 Grinding tool, and method and apparatus for inspection conditions of grinding surface of the same |
| 01/15/2004 | US20040009637 CMP device and production method for semiconductor device |
| 01/14/2004 | EP1379356A1 Method and apparatus for end point triggering with integrated steering |
| 01/14/2004 | EP1278613B1 Apparatus and methods for mesuring the pins diameter of a crankshaft at the place of grinding |
| 01/14/2004 | CN1468162A Polishing pad comprising a filled translucent region |
| 01/14/2004 | CN1467052A Minute surface plate polishing equipment and leveling method for the same |
| 01/13/2004 | US6676801 Pressure suppression device for chemical mechanical polishing machine and method thereof |
| 01/13/2004 | US6676717 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| 01/13/2004 | US6676491 Cutting to form grooves, grinding a back of the semiconductor wafer to reduce a thickness |
| 01/13/2004 | US6676489 Sound enhanced lapping apparatus |
| 01/13/2004 | US6676483 Anti-scattering layer for polishing pad windows |
| 01/13/2004 | US6676482 Learning method and apparatus for predictive determination of endpoint during chemical mechanical planarization using sparse sampling |
| 01/08/2004 | WO2004002681A1 Method of judging life and quality of abrasive pad etc, method of conditioning abrasive pad, polishing device, semiconductor device, and method of producing the semiconductor device |
| 01/08/2004 | WO2004002680A1 Apparatus and method for endpoint detection and monitoring for chemical mechanical polishing operations |
| 01/08/2004 | WO2003021641A3 Method and apparatus for sensing a wafer in a carrier |
| 01/08/2004 | WO2002050893A3 Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process |
| 01/08/2004 | US20040005845 Polishing method and apparatus |
| 01/08/2004 | US20040005842 Carrier head with flexible membrane |
| 01/08/2004 | US20040005769 Method and apparatus for endpoint detection |
| 01/08/2004 | US20040004710 End face polishing apparatus and method of polishing end face |
| 01/08/2004 | US20040003689 System and method for forming a non-rotationally symmetric portion of a workpiece |
| 01/08/2004 | DE10227336A1 Verfahren und Vorrichtung zur Verschleißüberwachung eines Werkzeuges Method and apparatus for monitoring wear of a tool |