| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 04/29/2004 | US20040082271 Polishing pad with window |
| 04/29/2004 | US20040080757 Integrated surface metrology |
| 04/28/2004 | CN1492228A Grinding method of drum using supersonic flaw detection method and device |
| 04/28/2004 | CN1147379C Automated drill bit re-sharpening and verification system |
| 04/27/2004 | US6727107 Method of testing the processing of a semiconductor wafer on a CMP apparatus |
| 04/27/2004 | US6726544 Method and apparatus for superfinishing tapered roller bearing |
| 04/27/2004 | US6726530 End-point detection system for chemical mechanical polishing applications |
| 04/27/2004 | US6726529 Low temperature chemical mechanical polishing of dielectric materials |
| 04/27/2004 | US6726528 Polishing pad with optical sensor |
| 04/22/2004 | WO2004033148A1 Both side grinding method and both side grinder of thin disc-like work |
| 04/22/2004 | US20040074599 Methods and apparatus for conditioning and temperature control of a processing surface |
| 04/22/2004 | DE10150443B4 Verfahren und Vorrichtung zur Herstellung eines Endlosmetallriemens und nach dem Verfahren hergestellter Endlosmetallriemen Method and apparatus for manufacturing an endless metal belt and prepared according to the procedure endless metal belt |
| 04/21/2004 | EP1410118A1 Method and system for endpoint detection |
| 04/21/2004 | EP1250215B1 System and method for controlled polishing and planarization of semiconductor wafers |
| 04/20/2004 | US6725120 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 04/20/2004 | US6722965 Carrier head with flexible membranes to provide controllable pressure and loading area |
| 04/20/2004 | US6722964 Polishing apparatus and method |
| 04/20/2004 | US6722962 Polishing system, polishing method, polishing pad, and method of forming polishing pad |
| 04/20/2004 | US6722951 Eliminates damage; performs intermittently low speed polishing under low torque prior to high speed continuous polishing at high torque |
| 04/20/2004 | US6722948 Pad conditioning monitor |
| 04/20/2004 | US6722946 Advanced chemical mechanical polishing system with smart endpoint detection |
| 04/20/2004 | US6722945 Endface polishing method and endface polishing apparatus |
| 04/20/2004 | US6722249 Method of fabricating a polishing pad having an optical window |
| 04/15/2004 | WO2004030866A1 Grinding liquid feeding method and grinding device |
| 04/15/2004 | WO2004030865A1 Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization |
| 04/15/2004 | US20040072501 Polishing method and polishing apparatus used for the same |
| 04/15/2004 | US20040072500 Chemical mechanical polishing with friction-based control |
| 04/15/2004 | US20040069406 CMP apparatus polishing head with concentric pressure zones |
| 04/15/2004 | DE10245610A1 Verfahren zum selektiven Entfernen von Metallresten von einer dielektrischen Schicht mittels chemischen mechanischen Polierens A method for the selective removal of metal residues from a dielectric layer by chemical mechanical polishing |
| 04/15/2004 | DE10245548A1 Semiconductor wafer polishing device, |
| 04/14/2004 | EP1407855A1 Method and machine to grind workpieces with a mechanism to compensate for the wear |
| 04/14/2004 | EP1407854A2 Method for machining a surface and simultaneously measuring parameters of the surface being machined |
| 04/14/2004 | EP1406746A2 Micromachining system |
| 04/14/2004 | EP1251997B1 Polishing head for a polishing machine |
| 04/14/2004 | CN1489509A Polishing pad with built-in optical sensor |
| 04/13/2004 | US6721622 Method of compensating profile data, and numerical controller and machine tool for practicing the method |
| 04/13/2004 | US6720266 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 04/13/2004 | US6719818 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| 04/13/2004 | US6719609 Eyeglass lens processing apparatus |
| 04/13/2004 | US6719608 Fabrication of devices with fibers engaged to grooves on substrates |
| 04/08/2004 | WO2002064315A8 Polishing disk with end-point detection port |
| 04/08/2004 | US20040067719 Apparatus and method of detecting a substrate in a carrier head |
| 04/08/2004 | US20040067718 Polishing apparatus |
| 04/08/2004 | US20040067717 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
| 04/07/2004 | EP1405336A2 Substrate processing method |
| 04/07/2004 | EP1404486A1 Apparatus and method for checking the machining process of a machine tool |
| 04/07/2004 | CN2609713Y Crankshaft connecting rod measuring instrument |
| 04/06/2004 | US6716364 Method and apparatus for detecting presence of residual polishing slurry subsequent to polishing of a semiconductor wafer |
| 04/06/2004 | US6716089 Method for controlling pH during planarization and cleaning of microelectronic substrates |
| 04/01/2004 | WO2004027837A1 Temperature-controlled substrate holder |
| 04/01/2004 | WO2004027411A1 System and method for metal residue detection and mapping within a multi-step sequence |
| 04/01/2004 | US20040063385 Method of controlling carrier head with multiple chambers |
| 04/01/2004 | US20040063318 Method of selectively removing metal residues from a dielectric layer by chemical mechanical polishing |
| 04/01/2004 | US20040063224 Feedback control of a chemical mechanical polishing process for multi-layered films |
| 03/31/2004 | EP1401614A1 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| 03/31/2004 | EP1200228B1 Improvement in and relating to edge grinding |
| 03/30/2004 | US6712673 Polishing apparatus, polishing head and method |
| 03/30/2004 | US6712670 Method and apparatus for applying downward force on wafer during CMP |
| 03/30/2004 | US6711829 Method for measuring work portion and machining method |
| 03/25/2004 | WO2004024394A1 Control of removal profile in electrochemically assisted cmp |
| 03/25/2004 | WO2004024393A1 A polishing pad support that improves polishing performance and longevity |
| 03/25/2004 | WO2004024392A1 Measuring the surface properties of polishing pads using ultrasonic reflectance |
| 03/25/2004 | US20040058622 Polish cleaning apparatus and method in manufacture of HGA |
| 03/25/2004 | US20040058621 Endpoint detection with multiple light beams |
| 03/25/2004 | US20040058620 System and method for metal residue detection and mapping within a multi-step sequence |
| 03/25/2004 | US20040058543 Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection |
| 03/25/2004 | US20040055172 Apparatus for checking dimensional and geometrical features of pins |
| 03/25/2004 | DE10241155A1 Device for finishing thinning of a workpiece used in the production of integrated circuits and transistors comprises a radiation emitting unit which directs radiation onto a region, a radiation receiving unit, and an evaluation unit |
| 03/24/2004 | EP1401010A1 Device and method for measuring and compensating for the wear of brushes in brushing machines |
| 03/24/2004 | EP1399962A1 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| 03/24/2004 | EP1399961A2 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| 03/24/2004 | EP1399960A1 In situ sensor based control of semiconductor processing procedure |
| 03/24/2004 | EP1399295A1 Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| 03/24/2004 | EP1399294A1 End point detection system for chemical mechanical polishing applications |
| 03/24/2004 | EP1399291A1 Apparatus and method for measuring tool degradation |
| 03/24/2004 | CN1484568A Polishing disk with end-point detection port |
| 03/24/2004 | CN1484567A System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad |
| 03/24/2004 | CN1484566A Crosslinked polyethylene polishing pad for chemical mechnical polishing polishing apparatus and polishing method |
| 03/24/2004 | CN1142844C Glass product machining apparatus |
| 03/23/2004 | US6709314 Chemical mechanical polishing endpoinat detection |
| 03/23/2004 | US6709312 Method and apparatus for monitoring a polishing condition of a surface of a wafer in a polishing process |
| 03/18/2004 | US20040053559 Polishing apparatus and method of bonding and removing expendable replacement components thereof |
| 03/18/2004 | US20040053512 Process control in electrochemically assisted planarization |
| 03/18/2004 | US20040053500 Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device |
| 03/16/2004 | US6706383 Polishing pad support that improves polishing performance and longevity |
| 03/16/2004 | US6706140 Control system for in-situ feeding back a polish profile |
| 03/16/2004 | US6705930 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
| 03/11/2004 | WO2004020147A1 Grinding device and method for operating a grinding device of this type |
| 03/11/2004 | US20040048555 Apparatus for processing a lens and process for processing a lens |
| 03/11/2004 | US20040048550 Modular method for chemical mechanical planarization |
| 03/11/2004 | US20040045181 Apparatus for the in-process dimensional checking of orbitally rotating crankpins |
| 03/11/2004 | DE20314465U1 Machine tool, especially with orbiting tools, has workpiece fixed into position on platform which can move in tool press direction |
| 03/10/2004 | EP1119441A4 Automated drill bit re-sharpening and verification system |
| 03/09/2004 | US6702648 Use of scatterometry/reflectometry to measure thin film delamination during CMP |
| 03/09/2004 | US6702647 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 03/09/2004 | US6702646 Method and apparatus for monitoring polishing plate condition |
| 03/04/2004 | WO2003070427A3 Method for re-grinding and polishing free-form surfaces, especially rotationally symmetrical aspherical optical lenses |
| 03/04/2004 | WO2002053320A9 Wafer support for chemical mechanical planarization |
| 03/04/2004 | WO2002049805A8 Polishing platen with pressurized membrane |
| 03/04/2004 | US20040043709 Process for machining a wafer-like workpiece |