| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 06/29/2004 | US6755719 End surface polishing device and end surface polishing method |
| 06/29/2004 | US6755718 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 06/24/2004 | WO2004053942A2 Measuring alignment between a wafer chuck and polishing/plating receptacle |
| 06/24/2004 | US20040121708 Pad assembly for electrochemical mechanical processing |
| 06/23/2004 | EP1429893A1 A method and apparatus for inline measurement of material removal during a polishing or grinding process |
| 06/23/2004 | EP1224060B1 Polishing pad |
| 06/22/2004 | US6752694 Apparatus for and method of wafer grinding |
| 06/22/2004 | US6752693 Afferent-based polishing media for chemical mechanical planarization |
| 06/22/2004 | US6752689 Apparatus for optical inspection of wafers during polishing |
| 06/22/2004 | CA2297241C Grinding arrangement |
| 06/17/2004 | WO2004050301A2 Method for automatic riser gate removal compensating for variance in casting |
| 06/17/2004 | US20040117146 Method to measure oxide thickness by FTIR to improve an in-line CMP endpoint determination |
| 06/17/2004 | US20040116047 Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
| 06/17/2004 | US20040115841 In situ finishing aid control |
| 06/17/2004 | US20040112360 Substrate dicing method |
| 06/16/2004 | CN1505554A Integrated endpoint detection system with optical and eddy current monitoring |
| 06/16/2004 | CN1504812A Apparatus and method for rubbing LCD substrate |
| 06/16/2004 | CN1153997C Lens shape display device, lens shape data processing device and apparatus having these device for working lens edge |
| 06/15/2004 | US6749487 Method of polishing glass substrate for information recording media, and glass substrate for information recording media |
| 06/15/2004 | US6749484 Chemical mechanical polishing (CMP) apparatus with temperature control |
| 06/15/2004 | US6749483 Chemical mechanical planarization (CMP) system and method for determining an endpoint in a CMP operation |
| 06/15/2004 | US6749377 Process for edge-machining of optical lenses |
| 06/10/2004 | WO2004049417A1 Polishing pad and method for manufacturing semiconductor device |
| 06/10/2004 | WO2004048038A1 Methods and apparatus for polishing control |
| 06/10/2004 | WO2004048035A1 Method and device for grinding work in the form of non-circular rotary body, and cam shaft |
| 06/10/2004 | WO2004048030A1 Method for measuring with a machining machine-tool, tool adapted therefor and software product managing same |
| 06/10/2004 | WO2003106108A8 Apparatus for checking the dimensional and geometric features of pins |
| 06/10/2004 | US20040111175 Method of and apparatus for controlling the chemical mechanical polishing of multiple layers on a substrate |
| 06/10/2004 | US20040110449 Measuring the surface properties of polishing pads using ultrasonic reflectance |
| 06/10/2004 | US20040109174 Method and apparatus for optical film measurements in a controlled environment |
| 06/10/2004 | US20040108065 Apparatus methods for controlling wafer temperature in chemical mechanical polishing |
| 06/10/2004 | US20040108064 Methods for polishing semiconductor device structures by differentially applying pressure to substrates that carry the semiconductor device structures |
| 06/09/2004 | EP1425135A1 Method and apparatus for polishing a workpiece surface |
| 06/09/2004 | EP1235662B1 Computer controlled grinding machine |
| 06/08/2004 | US6747283 In-situ detection of thin-metal interface using high resolution spectral analysis of optical interference |
| 06/08/2004 | US6746319 Measuring apparatus |
| 06/08/2004 | US6746318 Workpiece carrier with adjustable pressure zones and barriers |
| 06/08/2004 | US6746308 Dynamic lot allocation based upon wafer state characteristics, and system for accomplishing same |
| 06/08/2004 | US6745631 Using planar ultrasound sensor; forming relational image |
| 06/03/2004 | US20040106358 Method and apparatus for global die thinning and polishing of flip-chip packaged integrated circuits |
| 06/03/2004 | US20040106357 Polishing pad for in-situ endpoint detection |
| 06/03/2004 | US20040106356 Tool sharpener |
| 06/03/2004 | US20040106355 High selectivity slurry delivery system |
| 06/03/2004 | US20040106283 Comparison of chemical-mechanical polishing processes |
| 06/03/2004 | US20040104128 Filling concave portions formed on wafer surface; determining electropolishing end point of metal film in accordance with change of current waveform |
| 06/02/2004 | EP1075351B1 Apparatus and method for chemical-mechanical polishing (cmp) using a head having direct pneumatic wafer polishing pressure system |
| 06/02/2004 | CN2618724Y Precision monitor for grnider without core |
| 06/02/2004 | CN1501451A Method of fabricating semiconductor device |
| 06/01/2004 | US6742273 Workpiece measuring apparatus |
| 05/27/2004 | WO2004043647A1 Apparatus for and method of wafer grinding |
| 05/27/2004 | US20040102144 Polishing systems for use with semiconductor substrates including differential pressure application apparatus |
| 05/26/2004 | EP1422024A1 Method for controlling the operating position of a grinding wheel used in a machine for machining edges of plates of glass, marble and similar stony materials, and machine for implementing said method |
| 05/26/2004 | EP1421453A2 Cmp process involving frequency analysis-based monitoring |
| 05/26/2004 | CN1500290A Monitoring method of polishing state, monitor of polishing state, polishing appts, processed wafer, semiconductor device mfg. method, and semiconductor device |
| 05/26/2004 | CN1500030A Method and appts. for end point triggering with integrated steering |
| 05/26/2004 | CN1499580A Cutting appts. |
| 05/25/2004 | US6741913 Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection system |
| 05/25/2004 | US6741337 End face polishing apparatus and method of polishing end face |
| 05/25/2004 | US6741076 Eddy current measuring system for monitoring and controlling a CMP process |
| 05/25/2004 | US6739953 Mechanical stress free processing method |
| 05/25/2004 | US6739951 Method and apparatus for electrochemical-mechanical planarization |
| 05/25/2004 | US6739947 In situ friction detector method and apparatus |
| 05/25/2004 | US6739946 Thermal-chemical polishing device and method thereof |
| 05/25/2004 | US6739945 Polishing pad with built-in optical sensor |
| 05/25/2004 | US6739944 System for real-time control of semiconductor wafer polishing |
| 05/21/2004 | WO2004041479A1 Polishing apparatus |
| 05/20/2004 | US20040097169 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 05/20/2004 | US20040094269 Methods for determining amounts and locations of differential pressure to be applied to semiconductor substrates during polishing of semiconductor device structures carried thereby and for subsequently polishing similar semiconductor device structures |
| 05/19/2004 | EP1419853A1 Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations |
| 05/19/2004 | EP1419030A1 Method and device for centerless cylindrical grinding |
| 05/19/2004 | CN1498415A Infrared end-point detecting system |
| 05/19/2004 | CN1496788A Method for simultaneous processing and measuring paramenter for processed surface |
| 05/19/2004 | CN1150601C Polishing equipment and method for producing semiconductor device |
| 05/18/2004 | US6736720 Apparatus and methods for controlling wafer temperature in chemical mechanical polishing |
| 05/18/2004 | US6736702 End face polishing machine |
| 05/18/2004 | US6736700 Process and device for the registration of the state of wear of tools employed in gear manufacture |
| 05/18/2004 | US6736699 Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing |
| 05/18/2004 | US6736698 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 05/18/2004 | US6736551 End face polishing apparatus |
| 05/13/2004 | WO2004039538A1 Glass pane machining device |
| 05/13/2004 | US20040092209 Apparatus for and method of wafer grinding |
| 05/13/2004 | DE10249358A1 Positioning method for rotary tool, e.g. grinding disc, using measuring probe which comes into contact with positioning disc when tool is correctly positioned |
| 05/12/2004 | EP1222057A4 Automated drill bit re-sharpening and verification system |
| 05/12/2004 | CN1496295A Cutting device |
| 05/11/2004 | US6733364 Computer controlled grinding machine |
| 05/11/2004 | US6733363 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 05/06/2004 | WO2004037491A2 Apparatus for sharpening blades |
| 05/06/2004 | WO2004037490A1 Transparent microporous materials for cmp |
| 05/06/2004 | US20040087248 Polishing method and apparatus |
| 05/06/2004 | US20040084143 Temperature-controlled substrate holder for processing in fluids |
| 05/06/2004 | US20040083868 Cutting device |
| 05/06/2004 | EP1230068A4 Method and apparatus for lapping of workpieces |
| 05/04/2004 | US6732009 Machining error correction method adapted for numerically controlled machine tool and grinding machine using the same |
| 05/04/2004 | US6730603 System and method of determining a polishing endpoint by monitoring signal intensity |
| 05/04/2004 | US6729943 System and method for controlled polishing and planarization of semiconductor wafers |
| 05/04/2004 | US6729936 Apparatus for measuring dimensional errors of eccentric cylinder by utilizing movement of measuring member held in contact with such eccentric cylinder |
| 05/04/2004 | US6729935 Method and system for in-situ monitoring of mixing ratio of high selectivity slurry |
| 04/29/2004 | WO2004035265A1 Polishing state monitoring apparatus and polishing apparatus and method |
| 04/29/2004 | US20040082289 Conductive polishing article for electrochemical mechanical polishing |
| 04/29/2004 | US20040082276 Transparent microporous materials for CMP |