Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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08/31/2004 | US6783426 Method and apparatus for detection of chemical mechanical planarization endpoint and device planarity |
08/31/2004 | US6782760 Method for the finishing treatment of workpieces |
08/26/2004 | WO2004071750A2 Method and device for mechanically buffing worn-down tires |
08/26/2004 | WO2004027837B1 Temperature-controlled substrate holder |
08/26/2004 | US20040166783 Polishing apparatus and method |
08/26/2004 | US20040166782 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
08/26/2004 | US20040166778 Method for lapping and a lapping apparatus |
08/26/2004 | US20040166776 Surface finishing apparatus and related method |
08/26/2004 | US20040166773 Polishing apparatus |
08/26/2004 | US20040166772 Method of reducing thermal distortion in grinding machines |
08/26/2004 | US20040166771 Methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
08/26/2004 | US20040166770 Grinding apparatus and method |
08/26/2004 | US20040166769 Apparatus and method for abrading a workpiece |
08/26/2004 | US20040166767 Lapping apparatus and lapping method |
08/26/2004 | US20040166685 Methods and apparatus for polishing control |
08/26/2004 | US20040165177 System and method of broad band optical end point detection for film change indication |
08/26/2004 | US20040163946 Pad assembly for electrochemical mechanical processing |
08/25/2004 | CN1524027A Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
08/25/2004 | CN1522833A Method of and apparatus for lapping magnetic head slider |
08/25/2004 | CN1163746C Method and apparatus for ultrasonically detecting flaw on surface of circular cylinder, and method of grinding roll utilizing same |
08/24/2004 | US6780086 Determining an endpoint in a polishing process |
08/24/2004 | US6780085 Fiber optical sensor embedded into the polishing pad for in-situ, real-time, monitoring of thin films during the chemical mechanical planarization process |
08/24/2004 | US6780082 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
08/19/2004 | WO2004070806A1 Substrate holding apparatus and polishing apparatus |
08/19/2004 | WO2004069477A1 Modeling an abrasive process to achieve controlled material removal |
08/19/2004 | WO2004069471A2 Method for calibrating a grinding machine |
08/19/2004 | WO2004058449A3 Reel mower conditioner |
08/19/2004 | US20040162005 Method of and apparatus for lapping magnetic head slider |
08/19/2004 | US20040161939 Method and apparatus for applying downward force on wafer during CMP |
08/19/2004 | DE10303407A1 Verfahren und Vorrichtung zur hochgenauen Bearbeitung der Oberfläche eines Objektes, insbesondere zum Polieren und Läppen von Halbleitersubstraten Method and device for highly accurate machining of the surface of an object, in particular for polishing and lapping of semiconductor substrates, |
08/18/2004 | EP1447171A1 Surface finishing apparatus and method |
08/18/2004 | EP1447170A1 Surface finishing apparatus and related method |
08/18/2004 | CN1520962A Surface finishing apparatus and related method |
08/18/2004 | CN1520960A Lapping apparatus and lapping method |
08/17/2004 | US6776692 Closed-loop control of wafer polishing in a chemical mechanical polishing system |
08/12/2004 | WO2004067228A1 Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates |
08/12/2004 | US20040157531 End-point detection apparatus |
08/12/2004 | US20040157529 Apparatus for maintaining constant force between a finishing tool and a workpiece |
08/11/2004 | EP1445065A1 Eyeglass lens processing apparatus |
08/11/2004 | CN1520348A End point detection system for mechanical polishing applications |
08/10/2004 | US6774660 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing |
08/10/2004 | US6773939 Method and apparatus for determining critical dimension variation in a line structure |
08/10/2004 | US6773338 Polishing head and chemical mechanical polishing apparatus including the same |
08/10/2004 | US6773332 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
08/10/2004 | US6772784 Proportional pressure regulator having positive and negative pressure delivery capability |
08/05/2004 | WO2004014603A3 Polishing pad with window |
08/05/2004 | US20040153285 Apparatus and method for checking the machining process of a machine tool |
08/05/2004 | US20040153197 Modeling an abrasive process to achieve controlled material removal |
08/05/2004 | US20040152396 Substrate monitoring during chemical mechanical polishing |
08/05/2004 | US20040152316 Method of manufacturing semiconductor device |
08/05/2004 | US20040152310 Signal improvement in eddy current sensing |
08/05/2004 | US20040149690 Computer integrated manufacturing control system for oxide chemical mechanical polishing |
08/04/2004 | EP1442840A1 Anti-scattering layer for polishing pad windows |
08/03/2004 | US6769967 Apparatus and method for refurbishing polishing pads used in chemical-mechanical planarization of semiconductor wafers |
08/03/2004 | US6769966 Workpiece holder for polishing, polishing apparatus and polishing method |
08/03/2004 | US6769960 System for manufacturing a semiconductor device, polishing slurry feeder and method for manufacturing a semiconductor device |
08/03/2004 | US6769957 Creeping wave technique for mill roll inspection |
07/29/2004 | WO2004027411A8 System and method for metal residue detection and mapping within a multi-step sequence |
07/29/2004 | US20040147116 Novel method to reduce stress for copper CMP |
07/29/2004 | US20040146712 Polishing pad resistant to delamination |
07/29/2004 | US20040144160 Pad conditioning head offline testing kit |
07/28/2004 | CN1515900A Ultrasonic flaw detection method on cylinder surface |
07/28/2004 | CN1159134C Device and method for measuring amount of grinding in magnetic head producing process |
07/27/2004 | US6767273 Crankpin grinding method |
07/22/2004 | WO2004060611A1 Grinding wheel monitoring |
07/22/2004 | WO2004060610A2 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method |
07/22/2004 | WO2004060609A1 Modular method for chemical mechanical planarization |
07/22/2004 | US20040142642 Automatic or semi-automatic device for trimming an ophthalmic lens |
07/22/2004 | US20040142636 Slurry pump control system |
07/22/2004 | US20040142635 Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces |
07/22/2004 | US20040142563 Methods and systems for exchanging messages in a controller for a substrate processing system |
07/22/2004 | CA2491745A1 Grinding wheel monitoring |
07/21/2004 | EP1439031A1 Method and apparatus for dressing polishing cloth |
07/21/2004 | EP1439030A1 Process for processing a lens |
07/21/2004 | EP0954407B1 Polishing apparatus |
07/21/2004 | CN1514760A Adjustable force applying air platen, spindle system and its use |
07/20/2004 | US6764868 Use of slurry waste composition to determine the amount of metal removed during chemical mechanical polishing, and system for accomplishing same |
07/20/2004 | US6764387 Control of a multi-chamber carrier head |
07/20/2004 | US6764381 Polishing apparatus |
07/20/2004 | US6764380 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
07/20/2004 | US6764379 Method and system for endpoint detection |
07/20/2004 | US6764378 Point-of-use fluid regulating system for use in the chemical-mechanical planarization of semiconductor wafers |
07/15/2004 | WO2004058452A2 Apparatus and method for manufacturing or working optical elements and/or optical forming elements, and such element. |
07/15/2004 | WO2004058449A2 Reel mower conditioner |
07/15/2004 | US20040137829 Polishing apparatus and related polishing methods |
07/15/2004 | US20040137824 Apparatus for the diameter checking of eccentric portions of a mechanical piece in the course of the machining in a grinding machine |
07/15/2004 | US20040137738 Backside integrated circuit die surface finishing technique and tool |
07/15/2004 | DE10258128A1 Semiconductor wafer polishing method, by pressing semiconductor wafer against polishing disc with two respective pressures, and two respective concentrations of polishing agent |
07/14/2004 | EP1437197A1 Apparatus and method for chemical-mechanical polishing (CMP) using a head having a direct pneumatic wafer polishing pressure system |
07/13/2004 | US6763208 Photoreceptor regenerating apparatus and image forming apparatus using regenerated photoreceptor and method of regenerating photoreceptor |
07/13/2004 | US6762604 Standalone eddy current measuring system for thickness estimation of conductive films |
07/08/2004 | WO2004056531A1 The structure of tool head unit of polishing maching |
07/08/2004 | US20040133299 Method for simultaneous machining and measuring parameters of a surface being subjected to machining |
07/08/2004 | US20040128812 Reel mower conditioner |
07/08/2004 | DE19952805B4 Verfahren und Vorrichtung zur Finishbearbeitung von Werkstücken Method and apparatus for finish machining of workpieces |
07/06/2004 | US6758723 Substrate polishing apparatus |
07/06/2004 | US6758721 Apparatus and method for lapping magnetic heads |
07/01/2004 | WO2004037491A3 Apparatus for sharpening blades |
07/01/2004 | US20040127144 Method and apparatus for controlling CMP pad surface finish |
06/30/2004 | CN1508593A Apparatus and method for measuring griading quantity of liquid crystal display panel |