Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
08/2004
08/31/2004US6783426 Method and apparatus for detection of chemical mechanical planarization endpoint and device planarity
08/31/2004US6782760 Method for the finishing treatment of workpieces
08/26/2004WO2004071750A2 Method and device for mechanically buffing worn-down tires
08/26/2004WO2004027837B1 Temperature-controlled substrate holder
08/26/2004US20040166783 Polishing apparatus and method
08/26/2004US20040166782 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
08/26/2004US20040166778 Method for lapping and a lapping apparatus
08/26/2004US20040166776 Surface finishing apparatus and related method
08/26/2004US20040166773 Polishing apparatus
08/26/2004US20040166772 Method of reducing thermal distortion in grinding machines
08/26/2004US20040166771 Methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer
08/26/2004US20040166770 Grinding apparatus and method
08/26/2004US20040166769 Apparatus and method for abrading a workpiece
08/26/2004US20040166767 Lapping apparatus and lapping method
08/26/2004US20040166685 Methods and apparatus for polishing control
08/26/2004US20040165177 System and method of broad band optical end point detection for film change indication
08/26/2004US20040163946 Pad assembly for electrochemical mechanical processing
08/25/2004CN1524027A Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
08/25/2004CN1522833A Method of and apparatus for lapping magnetic head slider
08/25/2004CN1163746C Method and apparatus for ultrasonically detecting flaw on surface of circular cylinder, and method of grinding roll utilizing same
08/24/2004US6780086 Determining an endpoint in a polishing process
08/24/2004US6780085 Fiber optical sensor embedded into the polishing pad for in-situ, real-time, monitoring of thin films during the chemical mechanical planarization process
08/24/2004US6780082 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
08/19/2004WO2004070806A1 Substrate holding apparatus and polishing apparatus
08/19/2004WO2004069477A1 Modeling an abrasive process to achieve controlled material removal
08/19/2004WO2004069471A2 Method for calibrating a grinding machine
08/19/2004WO2004058449A3 Reel mower conditioner
08/19/2004US20040162005 Method of and apparatus for lapping magnetic head slider
08/19/2004US20040161939 Method and apparatus for applying downward force on wafer during CMP
08/19/2004DE10303407A1 Verfahren und Vorrichtung zur hochgenauen Bearbeitung der Oberfläche eines Objektes, insbesondere zum Polieren und Läppen von Halbleitersubstraten Method and device for highly accurate machining of the surface of an object, in particular for polishing and lapping of semiconductor substrates,
08/18/2004EP1447171A1 Surface finishing apparatus and method
08/18/2004EP1447170A1 Surface finishing apparatus and related method
08/18/2004CN1520962A Surface finishing apparatus and related method
08/18/2004CN1520960A Lapping apparatus and lapping method
08/17/2004US6776692 Closed-loop control of wafer polishing in a chemical mechanical polishing system
08/12/2004WO2004067228A1 Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates
08/12/2004US20040157531 End-point detection apparatus
08/12/2004US20040157529 Apparatus for maintaining constant force between a finishing tool and a workpiece
08/11/2004EP1445065A1 Eyeglass lens processing apparatus
08/11/2004CN1520348A End point detection system for mechanical polishing applications
08/10/2004US6774660 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing
08/10/2004US6773939 Method and apparatus for determining critical dimension variation in a line structure
08/10/2004US6773338 Polishing head and chemical mechanical polishing apparatus including the same
08/10/2004US6773332 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
08/10/2004US6772784 Proportional pressure regulator having positive and negative pressure delivery capability
08/05/2004WO2004014603A3 Polishing pad with window
08/05/2004US20040153285 Apparatus and method for checking the machining process of a machine tool
08/05/2004US20040153197 Modeling an abrasive process to achieve controlled material removal
08/05/2004US20040152396 Substrate monitoring during chemical mechanical polishing
08/05/2004US20040152316 Method of manufacturing semiconductor device
08/05/2004US20040152310 Signal improvement in eddy current sensing
08/05/2004US20040149690 Computer integrated manufacturing control system for oxide chemical mechanical polishing
08/04/2004EP1442840A1 Anti-scattering layer for polishing pad windows
08/03/2004US6769967 Apparatus and method for refurbishing polishing pads used in chemical-mechanical planarization of semiconductor wafers
08/03/2004US6769966 Workpiece holder for polishing, polishing apparatus and polishing method
08/03/2004US6769960 System for manufacturing a semiconductor device, polishing slurry feeder and method for manufacturing a semiconductor device
08/03/2004US6769957 Creeping wave technique for mill roll inspection
07/2004
07/29/2004WO2004027411A8 System and method for metal residue detection and mapping within a multi-step sequence
07/29/2004US20040147116 Novel method to reduce stress for copper CMP
07/29/2004US20040146712 Polishing pad resistant to delamination
07/29/2004US20040144160 Pad conditioning head offline testing kit
07/28/2004CN1515900A Ultrasonic flaw detection method on cylinder surface
07/28/2004CN1159134C Device and method for measuring amount of grinding in magnetic head producing process
07/27/2004US6767273 Crankpin grinding method
07/22/2004WO2004060611A1 Grinding wheel monitoring
07/22/2004WO2004060610A2 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
07/22/2004WO2004060609A1 Modular method for chemical mechanical planarization
07/22/2004US20040142642 Automatic or semi-automatic device for trimming an ophthalmic lens
07/22/2004US20040142636 Slurry pump control system
07/22/2004US20040142635 Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces
07/22/2004US20040142563 Methods and systems for exchanging messages in a controller for a substrate processing system
07/22/2004CA2491745A1 Grinding wheel monitoring
07/21/2004EP1439031A1 Method and apparatus for dressing polishing cloth
07/21/2004EP1439030A1 Process for processing a lens
07/21/2004EP0954407B1 Polishing apparatus
07/21/2004CN1514760A Adjustable force applying air platen, spindle system and its use
07/20/2004US6764868 Use of slurry waste composition to determine the amount of metal removed during chemical mechanical polishing, and system for accomplishing same
07/20/2004US6764387 Control of a multi-chamber carrier head
07/20/2004US6764381 Polishing apparatus
07/20/2004US6764380 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
07/20/2004US6764379 Method and system for endpoint detection
07/20/2004US6764378 Point-of-use fluid regulating system for use in the chemical-mechanical planarization of semiconductor wafers
07/15/2004WO2004058452A2 Apparatus and method for manufacturing or working optical elements and/or optical forming elements, and such element.
07/15/2004WO2004058449A2 Reel mower conditioner
07/15/2004US20040137829 Polishing apparatus and related polishing methods
07/15/2004US20040137824 Apparatus for the diameter checking of eccentric portions of a mechanical piece in the course of the machining in a grinding machine
07/15/2004US20040137738 Backside integrated circuit die surface finishing technique and tool
07/15/2004DE10258128A1 Semiconductor wafer polishing method, by pressing semiconductor wafer against polishing disc with two respective pressures, and two respective concentrations of polishing agent
07/14/2004EP1437197A1 Apparatus and method for chemical-mechanical polishing (CMP) using a head having a direct pneumatic wafer polishing pressure system
07/13/2004US6763208 Photoreceptor regenerating apparatus and image forming apparatus using regenerated photoreceptor and method of regenerating photoreceptor
07/13/2004US6762604 Standalone eddy current measuring system for thickness estimation of conductive films
07/08/2004WO2004056531A1 The structure of tool head unit of polishing maching
07/08/2004US20040133299 Method for simultaneous machining and measuring parameters of a surface being subjected to machining
07/08/2004US20040128812 Reel mower conditioner
07/08/2004DE19952805B4 Verfahren und Vorrichtung zur Finishbearbeitung von Werkstücken Method and apparatus for finish machining of workpieces
07/06/2004US6758723 Substrate polishing apparatus
07/06/2004US6758721 Apparatus and method for lapping magnetic heads
07/01/2004WO2004037491A3 Apparatus for sharpening blades
07/01/2004US20040127144 Method and apparatus for controlling CMP pad surface finish
06/2004
06/30/2004CN1508593A Apparatus and method for measuring griading quantity of liquid crystal display panel
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