Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
11/2004
11/02/2004US6811473 Process for machining a wafer-like workpiece
11/02/2004US6811466 System and method for in-line metal profile measurement
11/02/2004US6811465 Workpiece grinding method which achieves a constant stock removal rate
10/2004
10/28/2004WO2004091857A1 Device for cleaning and/or deburring workpieces
10/28/2004WO2004091856A2 Grinding apparatus and method
10/28/2004WO2004071750A3 Method and device for mechanically buffing worn-down tires
10/28/2004US20040214509 Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
10/27/2004CN1173334C Terminal test in chemical machinery polishing of cloisonnee structure
10/27/2004CN1172774C Method for working ultrafine conical rolling bearing and appts. thereof
10/26/2004US6809032 Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniques
10/26/2004US6808438 Constant spindle power grinding method
10/26/2004CA2294479C Machining apparatus and method
10/21/2004WO2004090502A2 Whole-substrate spectral imaging system for cmp
10/21/2004WO2004069471A3 Method for calibrating a grinding machine
10/21/2004US20040209558 Method and device for centerless cylindrical grinding
10/21/2004US20040209546 Lapping machine, lapping method, and method of manufacturing magnetic head
10/20/2004EP1467840A1 Process control in electro-chemical mechanical polishing
10/20/2004EP1467839A2 Method and apparatus for applying downward force on wafer during cmp
10/19/2004US6806948 System and method of broad band optical end point detection for film change indication
10/19/2004US6806098 Method and device for assessing surface uniformity of semiconductor device treated by CMP
10/19/2004US6805613 Multiprobe detection system for chemical-mechanical planarization tool
10/14/2004WO2004087375A1 Chip customized polish pads for chemical mechanical planarization (cmp)
10/14/2004WO2004087372A1 Finishing method and finishing device
10/14/2004WO2004087371A1 Machining method and machining device
10/14/2004US20040203328 Measuring apparatus
10/14/2004US20040203322 Method and system for in-situ monitoring of mixing ratio of high selectivity slurry
10/14/2004US20040203321 Manufacturing method of semiconductor device, automatic operation method and automatic operation system of semiconductor manufacturing apparatus, and automatic operation method of CMP apparatus
10/14/2004US20040201093 Evaluating pattern for measuring and erosion of a semiconductor wafer polished by a chemical mechanical polishing
10/14/2004DE10315218A1 Fine processing of workpiece surface involves regulating at least one parameter describing surface quality by varying influencing parameter(s) using defined function if maximum deviation exceeded
10/14/2004CA2519942A1 Chip customized polish pads for chemical mechanical planarization (cmp)
10/13/2004EP1467105A1 Proportional pressure regulator having positive and negative pressure delivery capability
10/13/2004EP1324859A4 Polishing pad with built-in optical sensor
10/13/2004CN1537324A Polising method and device
10/13/2004CN1537038A Apparatus and method for controlling wafer temp. in chemical mechanical polishing
10/13/2004CN1170656C Method for grinding non-axial-symmetry and non-ball-surface mirror
10/12/2004US6802763 Apparatus for sharpening blades
10/12/2004US6802759 Grinder
10/07/2004US20040198196 Grinding apparatus and method
10/07/2004US20040198193 Method of manufacturing glass substrate for data recording medium
10/07/2004US20040198186 Polishing apparatus
10/07/2004US20040198185 Linear polishing sheet with window
10/07/2004US20040198183 Turbidity monitoring methods, apparatuses, and sensors
10/07/2004US20040198182 Apparatus and method for rubbing LCD substrate
10/07/2004US20040198181 Polishing apparatus with abrasive tape, polishing method using abrasive tape and manufacturing method for magnetic disk
10/06/2004EP1368157B1 Polishing disk with end-point detection port
10/06/2004CN1535196A Feed and feedback control of chemical mechanical polishing pad conditioning
10/05/2004US6801326 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects
10/05/2004US6801322 Method and apparatus for IN SITU measuring a required feature of a layer during a polishing process
09/2004
09/30/2004WO2002087825A8 Integrated endpoint detection system with optical and eddy current monitoring
09/30/2004US20040192174 Method for controlling PH during planarization and cleaning of microelectronic substrates
09/30/2004US20040192173 Carrier head with flexible membrane to provide controllable pressure and loading area
09/30/2004US20040192171 Method of producing a glass substrate for a mask blank and method of producing a mask blank
09/30/2004US20040192170 Eyeglass lens processing apparatus
09/30/2004US20040192169 Chemical mechanical polishing endpoint detection system and method
09/30/2004US20040192168 Arrangement and method for conditioning a polishing pad
09/30/2004US20040192063 Method of producing a glass substrate for a mask blank and method of producing a mask blank
09/30/2004US20040188273 Measurement electrical resistance of electroconductive coatings on substrate; detection of end-points
09/30/2004DE102004014335A1 Vorrichtung zur Bearbeitung von Werkstücken mit gekrümmter Oberfläche Apparatus for machining of workpieces with a curved surface
09/29/2004CN2644097Y Grinding head altitude controlling and grinding material detecting device of rock polisher
09/29/2004CN2644081Y Gripper and positioner of digital controlled internal grinder
09/29/2004CN1533595A Polishing method and grinding fluid
09/28/2004US6799136 Method of estimation of wafer polish rates
09/28/2004US6798529 In-situ method and apparatus for end point detection in chemical mechanical polishing
09/28/2004US6796880 Linear polishing sheet with window
09/28/2004US6796878 NC machine tool with tiltable spindle unit
09/23/2004US20040185752 Fixture for attaching indicator to grinding machine
09/23/2004US20040182721 Process control in electro-chemical mechanical polishing
09/23/2004DE10306741B3 Verfahren und Vorrichtung zum maschinellen Abrauhen von abgenutzten Reifen Method and apparatus for the mechanical roughening of worn tires
09/23/2004DE10304430B3 Verfahren zum Kalibrieren einer Schleifmaschine A method of calibrating a grinding machine
09/22/2004EP1459358A1 Methods and apparatus for conditioning and temperature control of a processing surface
09/22/2004EP1458522A1 Apparatus and methods for controlling wafer temperature in chemical mechanical polishing
09/22/2004CN1530205A Reflective resistant layer for polsihig pad window
09/21/2004US6794206 Method of polishing a film
09/21/2004US6793557 Removable lapping guide for magnetic recording head and method of use
09/21/2004CA2300611C Sharpening apparatus
09/16/2004WO2004078411A2 Method and apparatus for local polishing control
09/16/2004US20040179310 Embedded lapping guide
09/15/2004CN2640701Y Siemens digital control system applied in roller grinder work piece measuring device
09/14/2004US6790763 Substrate processing method
09/14/2004US6790125 Backside integrated circuit die surface finishing technique and tool
09/14/2004US6790123 Method for processing a work piece in a multi-zonal processing apparatus
09/09/2004US20040177297 Apparatus with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer
09/09/2004US20040176018 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
09/09/2004US20040176015 Method of determining the endpoint of a planarization process
09/09/2004US20040176014 Chemical mechanical polishing apparatus with non-conductive elements
09/09/2004US20040176013 Multi-chambered, compliant apparatus for restraining workpiece and applying variable pressure thereto during lapping to improve flatness characteristics of workpiece
09/09/2004US20040173461 Method and apparatus for local polishing control
09/08/2004CN2638925Y Infrared outline detector of stone polishing machine
09/07/2004US6786810 Curing abrasive coating having a backing to make transparent to visible light
09/07/2004US6786800 Grinding stone with motor coupled capable to cause rotation; lock and engageable receiver
09/07/2004US6786799 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
09/02/2004US20040171336 End face polishing apparatus
09/02/2004US20040171332 End face polishing apparatus
09/02/2004US20040171331 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
09/02/2004US20040171329 Fabrication of devices with fibers engaged to grooves on substrates
09/02/2004US20040171269 Substrate processing method
09/01/2004CN1525899A Centreless grinding process of cylindrical surfaces and apparatus for making the same
09/01/2004CN1525216A Liquid crystal panel surface grinding unit and grinding method
08/2004
08/31/2004US6785585 Method for marking or drilling holes in glass lenses and device for realizing the same
08/31/2004US6785010 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus
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