Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
12/2004
12/30/2004US20040266318 Electronic bevel angle indicator for a hollow grinder
12/30/2004US20040263868 Method for measuring thickness of thin film-like material during surface polishing, and surface polishing method and surface polishing apparatus
12/30/2004DE10326956A1 Vorrichtung und Verfahren zur automatisierten Bearbeitung von Brillengläsern für die Verwendung in sg Bohrbrillen oder randlosen Brillengestellen Apparatus and method for automated processing of eyeglass lenses for use in sg rimless or rimless eyeglass frames
12/30/2004DE10324429A1 Verfahren und System zum Steuern des chemisch-mechanischen Polierens mittels eines Sensorsignals eines Polierkissenkonditionierers A method and system for controlling the chemical mechanical polishing by means of a sensor signal of a Polierkissenkonditionierers
12/29/2004WO2004113021A1 Data processing for monitoring chemical mechanical polishing
12/29/2004WO2004113020A1 Substrate polishing apparatus and substrate polishing method
12/29/2004EP1491289A1 Rotor-grinding machine comprising a rotary head with two grinding wheels
12/29/2004EP1491288A1 Method for chamfering a plate-like member
12/29/2004EP1490898A2 System and method of broad band optical end point detection for film change indication
12/28/2004US6835119 Method for lapping and a lapping apparatus
12/28/2004US6835117 Endpoint detection in chemical-mechanical polishing of patterned wafers having a low pattern density
12/28/2004US6835116 Polishing apparatus
12/28/2004US6835115 Grinding method
12/23/2004WO2004112093A2 Method and apparatus to process substrates with megasonic energy
12/23/2004WO2004111314A2 Algorithm for real-time process control of electro-polishing
12/23/2004WO2004110700A1 Method and device for the automated treatment of spectacle lenses and corresponding spectacle lens
12/23/2004WO2004098829A3 Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
12/23/2004US20040259477 Pad conditioner control using feedback from a measured polishing pad roughness level
12/23/2004US20040259476 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
12/23/2004US20040259475 Automatic machine for grinding the borders of glass panes
12/23/2004US20040259472 Whole-substrate spectral imaging system for CMP
12/23/2004US20040259471 Articulating constant force finishing tool actuator
12/23/2004US20040259470 Data processing for monitoring chemical mechanical polishing
12/23/2004DE20320644U1 Vorrichtung zur Flankenbearbeitung von Schneidewerkzeugen Apparatus for edge processing of cutting tools
12/22/2004EP1488886A1 Automatic machine for grinding the borders of glass panes
12/22/2004EP1487611A1 Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
12/16/2004WO2004109758A2 Back pressure control system for cmp and wafer polishing
12/16/2004WO2004014603B1 Polishing pad with window
12/15/2004CN1179821C Pneuamtic diaphragm polishing head having independent retaining ring and multi-region pressure contorl structure, and method to use the same
12/15/2004CN1179820C Double abrasive wheel
12/14/2004US6831277 Method for measuring dimensions and alignment of thin film magnetic head and apparatus therefor
12/09/2004WO2004106000A1 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
12/09/2004WO2004105998A1 Floor sanding machine
12/09/2004WO2004087375A8 Chip customized polish pads for chemical mechanical planarization (cmp)
12/09/2004WO2003082522A8 Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
12/09/2004US20040249614 Method and system for endpoint detection
12/09/2004US20040248415 Polishing method and polishing liquid
12/08/2004EP1483785A1 Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers
12/08/2004CN1554118A Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
12/08/2004CN1178766C Magnetic head grinding device and method
12/07/2004US6829054 Integrated surface metrology
12/07/2004US6828225 Substrate processing method
12/07/2004US6827638 Polishing device and method
12/07/2004US6827630 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
12/07/2004US6827629 Method of and apparatus for controlling the chemical mechanical polishing of multiple layers on a substrate
12/02/2004WO2004105112A1 Substrate holding apparatus and polishing apparatus
12/02/2004WO2004103637A1 Method and device for machining spectacle lenses
12/02/2004WO2004103636A2 Substrate polishing apparatus
12/02/2004WO2004058452A3 Apparatus and method for manufacturing or working optical elements and/or optical forming elements, and such element.
12/02/2004US20040242135 Back pressure control system for CMP and wafer polishing
12/02/2004US20040242124 Apparatus methods for controlling wafer temperature in chemical mechanical polishing
12/02/2004US20040242123 Method for monitoring a substrate during chemical mechanical polishing
12/02/2004US20040242122 Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
12/02/2004US20040242121 Substrate polishing apparatus
12/02/2004DE10060219B4 Schnellwechselsystem für Messtaster-Baugruppe Quick change system for probe assembly
12/01/2004EP1480784A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
11/2004
11/30/2004US6825897 Indicator for deciding grinding amount of liquid crystal display panel and method for detecting grinding failure using the same
11/30/2004US6824454 Polishing apparatus
11/30/2004US6824446 Method and apparatus for polishing an outer edge ring on a semiconductor wafer
11/25/2004WO2004102290A1 Numeric controller
11/25/2004WO2004101223A1 Substrate polishing apparatus
11/25/2004WO2004060610A3 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
11/25/2004US20040235393 Substrate polishing apparatus
11/25/2004US20040235391 Material removal monitor
11/25/2004US20040235301 Method and device for polishing
11/25/2004DE102004010839A1 Verfahren zum Bestimmen des Endprodukts eines Planarisierungsprozesses A method for determining the final product a planarization process
11/24/2004EP1478908A1 Acoustic sensor for monitoring machining processes in machining tools
11/24/2004EP1478494A1 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
11/24/2004EP1478490A2 Method for re-grinding and polishing free-form surfaces, especially rotationally symmetrical aspherical optical lenses
11/24/2004CN1176787C Centerless grinding machine precision monitoring apparatus
11/23/2004US6821881 Method for chemical mechanical polishing of semiconductor substrates
11/23/2004US6821570 Method for preparing a polymer for chemical mechanical polishing
11/18/2004WO2004098829A2 Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
11/18/2004US20040229546 Method and apparatus for inline measurement of material removal during a polishing or grinding process
11/18/2004US20040229545 Endpoint detection system for wafer polishing
11/17/2004EP1478012A1 Polishing method and polishing fluid
11/17/2004EP1478011A1 Method and device for polishing
11/16/2004US6818301 Thermoconductive polymer of a substrate and filler particle of a group ii salt and within; planarizing a surface on a semiconductor wafer
11/16/2004US6817924 Chemical mechanical polishing apparatus, profile control system and conditioning method thereof
11/11/2004WO2004050301A3 Method for automatic riser gate removal compensating for variance in casting
11/11/2004US20040224613 Polishing apparatus
11/11/2004US20040223166 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus
11/11/2004DE10322396A1 Vorrichtung zum Reinigen und/oder Entgraten von Werkstücken Device for cleaning and / or deburring of workpieces
11/11/2004DE10214333B4 Verfahren und System zur numerisch gesteuerten Politur eines Werkstückes Method and system for numerically controlled polishing of a workpiece
11/10/2004EP1475187A2 Spectacle lens production
11/10/2004CN1174833C Apparatus for polishing magnetic head and polishing method
11/09/2004US6816806 Method of characterizing a semiconductor surface
11/09/2004US6816748 Smart automatic recording system and method for monitoring wafer fragmentation
11/09/2004US6814651 End face polishing machine and method of polishing rod-shaped member
11/04/2004WO2004094105A1 Vacuum suction holding apparatus and method, grinding apparatus using the holding apparatus, and device producing method using the grinding apparatus
11/04/2004US20040219865 Substrate polishing apparatus
11/04/2004DE10230146B4 Verfahren zum Bearbeiten eines scheibenförmigen Werkstückes A method for processing a disk-shaped workpiece
11/04/2004DE102004014953A1 Verfahren zur Herstellung eines Glassubstrats für einen Maskenrohling und Verfahren zur Herstellung eines Maskenrohlings A process for producing a glass substrate for a mask blank and process for the production of a mask blank
11/03/2004EP1473113A1 Workpiece grinding method which achieves a constant stock removal rate
11/03/2004EP1472047A1 Advanced chemical mechanical polishing system with smart endpoint detection
11/03/2004CN2652599Y Internal hole end face grinding depth adaptive controller
11/03/2004CN1543595A Apparatus with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer
11/03/2004CN1542580A Proportional pressure regulator having positive and negative pressure delivery capability
11/03/2004CN1173802C Abrasive belt grinding machine
11/02/2004US6812478 In-situ detection of thin-metal interface using optical interference via a dynamically updated reference
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