Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
03/2005
03/03/2005US20050048882 Polishing apparatus and method
03/03/2005US20050048875 Chemical mechanical polishing apparatus
03/03/2005US20050048874 System and method for in-line metal profile measurement
03/03/2005US20050048873 CNC abrasive fluid-jet milling
03/02/2005EP1419030B1 Method and device for centerless cylindrical grinding
03/01/2005US6861360 Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers
03/01/2005US6860793 Window portion with an adjusted rate of wear
03/01/2005US6860792 Hand tool comprising a sensor for emitting a signal when the tool attachment is replaced
03/01/2005US6860791 Polishing pad for in-situ endpoint detection
02/2005
02/24/2005WO2005016595A1 Grinding apparatus, semiconductor device producing method using the same, and semiconductor device produced by the method
02/24/2005US20050042975 Platen and head rotation rates for monitoring chemical mechanical polishing
02/23/2005CN1583364A Grinding machine parameter testing and analytical system
02/23/2005CN1583363A Method for determining overgrinding time in chemical machinery polshing
02/22/2005US6859678 Method and apparatus for manufacturing magnetoresistive element, software and system for controlling manufacturing of magnetoresistive element, software for estimating resistance value of magnetoresistive element, and computer system
02/22/2005US6858538 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
02/22/2005US6857950 Polishing apparatus, semiconductor device manufacturing method using the polishing apparatus, and semiconductor device manufactured by the manufacturing method
02/22/2005US6857947 Advanced chemical mechanical polishing system with smart endpoint detection
02/22/2005US6857946 Carrier head with a flexure
02/22/2005US6857945 Multi-chamber carrier head with a flexible membrane
02/22/2005US6857938 Lot-to-lot feed forward CMP process
02/22/2005US6857931 Method of detecting a substrate in a carrier head
02/17/2005WO2004103636A3 Substrate polishing apparatus
02/17/2005US20050037698 Carrier head with a flexible membrane
02/17/2005US20050037696 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates
02/17/2005US20050037695 Polishing head for a polishing machine
02/17/2005US20050037690 Substrate retainer wear detection method and apparatus
02/16/2005CN1189924C System for controlling instant-compensuted grinded curved surface
02/15/2005US6855035 Apparatus and method for producing substrate with electrical wire thereon
02/15/2005US6855031 Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer
02/15/2005US6855030 Modular method for chemical mechanical planarization
02/10/2005WO2005012195A2 Pressure feed grinding of amlcd substrate edges
02/10/2005US20050032466 Workpiece grinding method which achieves a constant stock removal rate
02/10/2005US20050032461 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
02/10/2005US20050032459 Technique for process-qualifying a semiconductor manufacturing tool using metrology data
02/10/2005US20050030457 Apparatus and method for rubbing LCD substrate
02/10/2005US20050028354 Device and method for measuring amount of grinding in magnetic head producing process
02/10/2005DE19543626B4 Meßlehreinrichtung für eine Schleifmaschine Meßlehreinrichtung for a grinding machine
02/09/2005CN1577759A Method for managing polishing apparatus
02/09/2005CN1188249C Initial position setting method for grinding device milling device thereof
02/08/2005US6853873 Enhanced throughput of a metrology tool
02/08/2005US6852629 Backside integrated circuit die surface finishing technique and tool
02/08/2005US6852015 Method and apparatus for grinding workpiece surfaces to super-finish surface with micro oil pockets
02/08/2005US6852005 Device for processing the finish of work pieces
02/08/2005US6852003 Method of manufacturing glass substrate for data recording medium
02/08/2005CA2364476C Quick-change system for measuring probe assembly
02/03/2005WO2003028048A3 Low-force electrochemical mechanical processing method and apparatus
02/03/2005US20050026550 Grinder with adjustable tool rest
02/03/2005US20050026548 Constant spindle power grinding method
02/03/2005US20050026547 Semiconductor processor control systems, semiconductor processor systems, and systems configured to provide a semiconductor workpiece process fluid
02/03/2005US20050026546 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
02/03/2005US20050026545 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
02/03/2005US20050026544 Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces
02/03/2005US20050026543 Apparatus and method for chemical mechanical polishing process
02/03/2005US20050026542 Detection system for chemical-mechanical planarization tool
02/03/2005US20050026541 Pressure feed grinding of AMLCD substrate edges
02/03/2005US20050026439 Semiconductor device fabrication method
02/03/2005DE10324146A1 Verfahren und Vorrichtung zum Formbearbeiten von Brillengläsern Method and device for machining spectacle lenses
02/02/2005CN1574241A Semiconductor device fabrication method and semiconductor device fabrication system
02/01/2005US6848976 Chemical mechanical polishing with multiple polishing pads
02/01/2005US6848971 Electronic bevel angle indicator for a hollow grinder
02/01/2005US6848970 Process control in electrochemically assisted planarization
02/01/2005US6848969 Method and device for treating spectacle glasses by means of a CNC-controlled spectacle glass treatment machine
02/01/2005US6848194 Apparatus for monitoring a semiconductor wafer during a spin drying operation
02/01/2005US6848190 Apparatus for the in-process dimensional checking of orbitally rotating crankpins
01/2005
01/27/2005WO2005007342A1 Polishing apparatus
01/27/2005US20050020185 Closed-loop control of wafer polishing in a chemical mechanical polishing system
01/27/2005US20050017712 Thickness Estimation Using Conductively Related Calibration Samples
01/26/2005CN1571015A Multi-chambered, compliant apparatus for restraining workpiece and applying variable pressure thereto during lapping to improve flatness characteristics of workpiece
01/25/2005US6846225 Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
01/25/2005US6846222 Multi-chambered, compliant apparatus for restraining workpiece and applying variable pressure thereto during lapping to improve flatness characteristics of workpiece
01/25/2005CA2288590C Method and apparatus for lapping of workpieces
01/20/2005WO2004090502A3 Whole-substrate spectral imaging system for cmp
01/20/2005US20050014377 Semiconductor device fabrication method and semiconductor device fabrication system
01/20/2005US20050014373 Method for managing polishing apparatus
01/20/2005DE19616663B4 Meßgerät Gauge
01/19/2005EP1497076A1 Method and apparatus for heating polishing pad
01/18/2005US6843709 Chemical mechanical polishing method for reducing slurry reflux
01/18/2005US6843706 Polishing apparatus
01/18/2005US6843705 Apparatus for finishing a magnetic slider
01/18/2005US6843704 Method and apparatus for automatically loading a double-sided polishing machine with wafer crystals
01/13/2005WO2005004218A1 Polishing apparatus and polishing method
01/13/2005US20050009450 Apparatus for optical inspection of wafers during processing
01/13/2005US20050009449 Polishing pad with built-in optical sensor
01/13/2005US20050009448 Customized polish pads for chemical mechanical planarization
01/13/2005US20050009447 Method and apparatus for polishing a workpiece surface
01/12/2005CN2670055Y Grinder with alarming effect
01/11/2005US6840845 Wafer polishing apparatus
01/11/2005US6840840 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
01/06/2005US20050003737 Method and apparatus to process substrates with megasonic energy
01/06/2005US20050000801 Method and apparatus for electrochemical mechanical processing
01/05/2005EP1222056A4 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
01/05/2005DE19511882B4 Verfahren zum Verfestigen von Werkstückoberflächen A method of solidifying workpiece surfaces
01/05/2005DE10325977A1 Flat grinding fixture has tensioning device having several chucks for holding and fixing workpiece in grinding fixture, and measuring device for determining evenness of ground surface of workpiece
01/04/2005US6838382 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates
01/04/2005US6838169 Comprising a thermoplastic backing film and a pressure sensitive adhesive of silicone and acrylic polymer to couple the backing of a chemical mechanical polishing pad to a platen support; antipeeling agents; durability; semiconductor wafers
01/04/2005US6837983 Endpoint detection for electro chemical mechanical polishing and electropolishing processes
01/04/2005US6837774 Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using
01/04/2005US6837773 Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
12/2004
12/30/2004US20040266320 Abrasive flow machining apparatus and method
12/30/2004US20040266319 Method and apparatus for measuring and controlling solids composition of a magnetorheological fluid
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