| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 05/04/2005 | EP1526948A2 Uniform thin films produced by magnetorheological finishing |
| 05/03/2005 | US6887136 Apparatus and methods for multi-step chemical mechanical polishing |
| 05/03/2005 | US6887129 Chemical mechanical polishing with friction-based control |
| 05/03/2005 | US6887128 Method of reducing thermal distortion in grinding machines |
| 05/03/2005 | US6887127 Polishing apparatus |
| 04/28/2005 | US20050090186 Apparatus and method for fabricating liquid crystal display panel |
| 04/28/2005 | US20050090185 Method of dressing polishing pad and polishing apparatus |
| 04/28/2005 | US20050090105 Methods and systems for planarizing workpieces, e.g., Microelectronic workpieces |
| 04/27/2005 | CN1610960A Methods and apparatus for conditioning and temperature control of a processing surface |
| 04/27/2005 | CN1198705C Mirror surface plate polishing equipment and leveling method for the same |
| 04/26/2005 | US6884204 Machine tool |
| 04/26/2005 | US6884150 Polishing pad sensor assembly with a damping pad |
| 04/26/2005 | US6884149 Combining an abrasive with an ultraviolet absorption spectra, diluting and analyzing; chemical mechanical polishing |
| 04/26/2005 | US6884146 Systems and methods for characterizing a polishing process |
| 04/26/2005 | US6884145 High selectivity slurry delivery system |
| 04/26/2005 | US6884144 Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers |
| 04/21/2005 | WO2005035191A1 Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoring |
| 04/21/2005 | WO2005035188A1 Grinding machine |
| 04/21/2005 | US20050085170 End face polishing machine and end face polishing system |
| 04/21/2005 | US20050085163 Method for preventing edge peeling defect |
| 04/20/2005 | EP1524072A1 Grinding machine |
| 04/20/2005 | EP1189730B1 Abrasive processing apparatus and method employing encoded abrasive product |
| 04/20/2005 | CN1607994A Method and apparatus for applying downward force on wafer during cmp |
| 04/20/2005 | CN1607069A Method of dressing polishing pad and polishing apparatus |
| 04/19/2005 | US6881133 Method of grinding for a vertical type of double disc surface grinding machine for a brake disc |
| 04/19/2005 | US6881130 Edge grinding |
| 04/19/2005 | US6881125 Apparatus for processing a lens |
| 04/14/2005 | WO2005012195A3 Pressure feed grinding of amlcd substrate edges |
| 04/14/2005 | US20050079799 Method and apparatus for circular grinding |
| 04/14/2005 | US20050077188 Establishing electrically conductive path through electrolyte between exposed layer of barrier material on substrate and electrode, electrochemically removing portion of exposed layer during first processing step in barrier processing station, detecting endpoint, processing exposed barrier layer |
| 04/14/2005 | DE10345335A1 Planar grinding machine has optical device for determining position of its upper part relative to a base frame so that an evaluation unit can calculate a set position prior to commencement of machining |
| 04/14/2005 | DE10343611A1 Numerical control of movement path of grinding head of machine tool, whereby tools and workpieces are assigned digital coordinate elements with each element defined a 0 or 1 collision parameter |
| 04/13/2005 | CN1606720A Cmp process involving frequency analysis-based monitoring |
| 04/13/2005 | CN1196564C Hand tool |
| 04/12/2005 | US6878302 Method of polishing wafers |
| 04/12/2005 | US6878038 Combined eddy current sensing and optical monitoring for chemical mechanical polishing |
| 04/12/2005 | US6878037 Slurry pump control system |
| 04/12/2005 | US6878036 Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal |
| 04/12/2005 | US6878035 Tool sharpener |
| 04/07/2005 | WO2005030437A1 Grinding machine with a concentricity correction system |
| 04/07/2005 | US20050075055 Chemical mechanical polishing optical endpoint detection |
| 04/07/2005 | US20050075052 Method and system for planarizing integrated circuit material |
| 04/07/2005 | US20050075051 Apparatus for pressure based blocking process for lens manufacturing |
| 04/07/2005 | US20050071986 Apparatus and method for closed loop feedback during lapping of magnetic heads |
| 04/06/2005 | EP1520281A2 Low-force electrochemical mechanical processing method and apparatus |
| 04/06/2005 | CN1196182C Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer |
| 04/05/2005 | US6876899 Method for automatic riser gate removal compensating for variance in casting |
| 04/05/2005 | US6876454 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| 04/05/2005 | US6875090 Apparatus for finishing optical surfaces, including a pad compensation device |
| 04/05/2005 | US6875079 Methods of working, especially polishing, inhomogeneous materials |
| 04/05/2005 | US6875078 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| 03/31/2005 | US20050070209 Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner |
| 03/31/2005 | US20050070208 System and apparatus for achieving very high crown-to-camber ratios on magnetic sliders |
| 03/31/2005 | US20050070207 Method of achieving very high crown-to-camber ratios on magnetic sliders |
| 03/31/2005 | US20050070206 Slider fabrication system for sliders with integrated electrical lapping guides |
| 03/31/2005 | US20050070205 Integrated pressure control system for workpiece carrier |
| 03/31/2005 | US20050066739 Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoring |
| 03/30/2005 | EP1517767A1 Apparatus for checking the dimensional and geometric features of pins |
| 03/30/2005 | CN1602547A Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| 03/30/2005 | CN1602546A In situ sensor based control of semiconductor processing procedure |
| 03/29/2005 | US6872662 Method for detecting the endpoint of a chemical mechanical polishing (CMP) process |
| 03/29/2005 | US6872132 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
| 03/29/2005 | US6872123 Method of and apparatus for lapping magnetic head slider |
| 03/29/2005 | US6872122 Apparatus and method of detecting a substrate in a carrier head |
| 03/24/2005 | WO2005025804A1 Polished state monitoring apparatus and polishing apparatus using the same |
| 03/24/2005 | US20050064804 Surface preparation device and method |
| 03/24/2005 | US20050064802 Polishing pad with window |
| 03/24/2005 | US20050064795 Grinding machine comprising a measuring system and control for providing a master blade and method for providing a bar blade |
| 03/24/2005 | US20050064793 Apparatus and method for polishing row bars |
| 03/24/2005 | US20050064792 Pad conditioner setup |
| 03/24/2005 | US20050064703 Substrate processing method |
| 03/24/2005 | US20050063103 Method of forming an embedded read element |
| 03/24/2005 | US20050062926 Indicator for deciding grinding amount of liquid crystal display panel and method for detecting grinding failure using the same |
| 03/24/2005 | US20050061674 Endpoint compensation in electroprocessing |
| 03/24/2005 | DE19738818B4 Verfahren und Vorrichtung zur formgeregelten Feinstbearbeitung eines Werkstücks Method and apparatus for controlled form microfinishing a workpiece |
| 03/23/2005 | EP1516700A2 Method of dressing polishing pad and polishing apparatus |
| 03/23/2005 | CN2686808Y Ball cardinal plane grinding machine |
| 03/22/2005 | US6869498 Chemical mechanical polishing with shear force measurement |
| 03/22/2005 | US6869347 Fabrication of devices with fibers engaged to grooves on substrates |
| 03/22/2005 | US6869337 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
| 03/22/2005 | US6869332 Chemical mechanical polishing of a metal layer with polishing rate monitoring |
| 03/17/2005 | US20050059323 System and apparatus for predicting plate lapping properties to improve slider fabrication yield |
| 03/17/2005 | US20050059322 Method of predicting plate lapping properties to improve slider fabrication yield |
| 03/16/2005 | EP1513652A1 Polishing pad with optical sensor |
| 03/16/2005 | EP1224056B1 Workpiece grinding method which achieves a constant stock removal rate |
| 03/16/2005 | CN1593849A Grinding machine data acquisition and failure diagnosis apparatus based on network |
| 03/16/2005 | CN1192853C Device and method for cutting magnetic element |
| 03/15/2005 | US6866559 Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad |
| 03/10/2005 | US20050054269 End face polishing machine and end face polishing system |
| 03/10/2005 | US20050054268 Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
| 03/10/2005 | US20050054266 Pressure control system and polishing apparatus |
| 03/10/2005 | US20050051266 Rotating pad on support surfaces; for semiconductor |
| 03/09/2005 | CN1590024A Apparatus and method for preheating |
| 03/09/2005 | CN1191916C Double-edge automatic processing machine for processing edges of glass or stone plate materials |
| 03/08/2005 | US6864176 Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method |
| 03/08/2005 | US6863771 Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods |
| 03/08/2005 | US6863590 Wafer planarization apparatus |
| 03/03/2005 | WO2005018878A2 Cnc abrasive fluid-jet m illing |
| 03/03/2005 | WO2005018876A1 Control of a grinding device with grinding rollers on winding shafts |
| 03/03/2005 | WO2004091856A3 Grinding apparatus and method |