Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
07/2005
07/13/2005EP1117506B1 Cmp polishing head with three chambers and method for using the same
07/13/2005CN1638057A Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same
07/12/2005US6916525 Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection
07/12/2005US6916230 Abrasive belt and machining process associated therewith
07/12/2005US6916225 Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer
07/12/2005CA2352965C Apparatus for monitoring tread thickness during tire buffing
07/07/2005WO2005061178A1 Chemical mechanical polishing method for reducing slurry reflux
07/07/2005WO2005061177A1 Pad assembly for electrochemical mechanical processing
07/07/2005WO2004111314B1 Algorithm for real-time process control of electro-polishing
07/07/2005US20050148288 Centerless grinder
07/07/2005US20050148286 Grinding method for vertical type of double disk surface grinding
07/07/2005DE10392943T5 Numerische Steuervorrichtung A numerical control device
07/06/2005EP1549465A1 Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization
07/06/2005CN1636272A Method for preventing damage to wafers in a sequential multiple steps polishing process
07/05/2005US6914000 Polishing method, polishing system and process-managing system
07/05/2005US6913525 CMP device and production method for semiconductor device
07/05/2005US6913523 Method for controlling pH during planarization and cleaning of microelectronic substrates
07/05/2005US6913515 System and apparatus for achieving very high crown-to-camber ratios on magnetic sliders
07/05/2005US6913514 Chemical mechanical polishing endpoint detection system and method
07/05/2005US6913513 Polishing apparatus
07/05/2005US6913512 Material removal monitor
07/05/2005US6913511 Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
07/05/2005US6913509 Method and apparatus for polishing, and lapping jig
06/2005
06/30/2005WO2005059970A2 Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication
06/30/2005US20050142995 Method of controlling carrier head with multiple chambers
06/30/2005US20050142993 Multi-chamber carrier head with a flexible membrane
06/30/2005US20050142991 Substrate polishing apparatus
06/30/2005US20050142987 Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor
06/30/2005US20050142807 Differential pressure application apparatus for use in polishing layers of semiconductor device structures and method
06/29/2005CN1631616A Optical fiber side edge polishing and grinding apparatus and its processing method
06/29/2005CN1208812C Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device
06/28/2005US6911662 Chemical-mechanical polishing apparatus and method for controlling the same
06/28/2005US6910947 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
06/28/2005US6910944 Method of forming a transparent window in a polishing pad
06/28/2005US6910943 Planarization apparatus and method
06/28/2005US6910942 Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus
06/23/2005US20050136800 Polishing endpoint detection system and method using friction sensor
06/22/2005EP1543921A1 Method and apparatus for polishing a substrate
06/22/2005CN2705264Y Computer auxiliary detector facing to grinding process optimum
06/22/2005CN1628934A Method for lapping and a lapping apparatus
06/21/2005US6909935 Methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer
06/21/2005US6908512 Temperature-controlled substrate holder for processing in fluids
06/21/2005US6908374 Chemical mechanical polishing endpoint detection
06/16/2005US20050130562 Polishing apparatus and method for detecting foreign matter on polishing surface
06/16/2005US20050130561 Polishing method and apparatus
06/16/2005US20050128490 Apparatus for imaging metrology
06/15/2005EP1541284A1 Planarization method
06/15/2005EP1540327A1 System and method for mental residue detection and mapping within a multi-step sequence
06/15/2005EP1539423A1 A polishing pad support that improves polishing performance and longevity
06/15/2005EP1490898A4 System and method of broad band optical end point detection for film change indication
06/15/2005CN1206081C Method for processing disc-shaped workpieces
06/14/2005US6905957 Polishing method and polishing apparatus permitting control of polishing time at a high accuracy
06/14/2005US6905400 Method and apparatus for dressing polishing cloth
06/14/2005US6905397 Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity
06/14/2005US6905395 Abrasive flow machining apparatus and method
06/14/2005US6905394 Apparatus and method for polishing row bars
06/14/2005US6905393 Method for simultaneous machining and measuring parameters of a surface being subjected to machining
06/09/2005WO2004111314A3 Algorithm for real-time process control of electro-polishing
06/09/2005US20050124273 Method of forming a polishing pad for endpoint detection
06/09/2005DE10325977B4 Flachschleifvorrichtung mit einer Spannvorrichtung sowie Verfahren zum Schleifbearbeiten eines Werkstücks in einer Flachschleifvorrichtung Surface grinding device with a clamping device and method for abrasive machining of a workpiece in a flat grinding device
06/08/2005EP1537949A2 Polishing apparatus including attitude controller for wafer carrier and turntable
06/08/2005EP1296800B1 Polishing pad with built-in optical sensor
06/08/2005EP0925148B1 Method for computer numerically controlled pin grinder gauge
06/08/2005CN1625718A Lens consisting of a crystalline material
06/07/2005US6902467 Apparatus for processing a lens and process for processing a lens
06/02/2005US20050118932 Adjustable gap chemical mechanical polishing method and apparatus
06/02/2005US20050118930 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
06/02/2005US20050118839 Chemical mechanical polish process control method using thermal imaging of polishing pad
06/02/2005US20050117164 Method and apparatus for measuring thickness of thin film and device manufacturing method using same
06/01/2005EP1370391B1 Apparatus for checking dimensional and geometrical features of pins
06/01/2005EP1268127B1 Method and apparatus for shaping edges
05/2005
05/31/2005US6899607 Polishing systems for use with semiconductor substrates including differential pressure application apparatus
05/31/2005US6899604 Dressing apparatus and polishing apparatus
05/31/2005US6899594 Relative lateral motion in linear CMP
05/26/2005WO2005046935A1 Materials and methods for low pressure chemical-mechanical planarization
05/26/2005US20050112998 Polishing apparatus
05/25/2005CN2701579Y High speed precise numerical-control grinding and processing device based on PMAC
05/25/2005CN1620357A Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
05/25/2005CN1620355A Chemical mechanical polishing of copper-oxide damascene structures
05/25/2005CN1618570A Chemical mechanical grinding device and its control system and regulating method of grinding pad profile
05/25/2005CN1203528C Improved method and apparatus for chemical mechanical planarization (CMP) of semiconductor wafer
05/24/2005US6897079 Method of detecting and measuring endpoint of polishing processing and its apparatus and method of manufacturing semiconductor device using the same
05/24/2005US6896588 Chemical mechanical polishing optical endpoint detection
05/24/2005US6896587 Process for grinding an ophthalmic lens, including a plotting operation without contact
05/24/2005US6896586 Method and apparatus for heating polishing pad
05/24/2005US6896585 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
05/24/2005US6896584 Method of controlling carrier head with multiple chambers
05/24/2005US6896583 Method and apparatus for conditioning a polishing pad
05/19/2005WO2005044513A1 Method for supplying lens of eyeglasses
05/19/2005US20050106998 Method of determining shape data
05/19/2005US20050105103 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers
05/17/2005US6895360 Method to measure oxide thickness by FTIR to improve an in-line CMP endpoint determination
05/17/2005US6893329 Polishing apparatus with abrasive tape, polishing method using abrasive tape and manufacturing method for magnetic disk
05/17/2005US6893323 Method of and apparatus for removing material
05/17/2005US6893322 Method and apparatus for measuring and controlling solids composition of a magnetorheological fluid
05/12/2005WO2005043132A1 Polishing endpoint detection system and method using friction sensor
05/12/2005US20050101227 Materials and methods for low pressure chemical-mechanical planarization
05/12/2005US20050101224 Combined eddy current sensing and optical monitoring for chemical mechanical polishing
05/11/2005CN1613606A Grinding device and method for determining thickness of grinded material
05/05/2005US20050095865 Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
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