| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 09/01/2005 | US20050191946 Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field |
| 09/01/2005 | US20050191944 Truing method and apparatus |
| 09/01/2005 | US20050191942 CMP apparatus and process sequence method |
| 09/01/2005 | US20050191859 Method of evaluating film thickness, method of detecting polishing terminal, and device-manufacturing apparatus |
| 09/01/2005 | US20050191858 Substrate processing method and apparatus |
| 09/01/2005 | US20050189065 Method of forming a layered polishing pad |
| 09/01/2005 | DE102005005050A1 Verfahren zum Maximieren der Lebensdauer eines beschichteten Schleifrades A method for maximizing the life of a coated abrasive wheel |
| 09/01/2005 | DE102004005741A1 Polishing cloth refining method, involves rubbing off surface of cloth with tool, compiling refining conditions of cloth using parameters, monitoring conditions and terminating refining of cloth when specified condition is achieved |
| 08/31/2005 | EP1567306A1 Transparent microporous materials for cmp |
| 08/31/2005 | CN1662344A Polishing pad with optical sensor |
| 08/31/2005 | CN1661780A CMP apparatus and polishing method |
| 08/31/2005 | CN1660543A Method of forming a layered polishing pad |
| 08/31/2005 | CN1660535A Process and device for the aligning of tooth spaces of a workpiece with precut teeth |
| 08/31/2005 | CN1216722C Grinding device for use in tyre evener |
| 08/30/2005 | US6937915 Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
| 08/30/2005 | US6935935 Measuring apparatus |
| 08/30/2005 | US6935932 Polishing apparatus and method |
| 08/30/2005 | US6935922 Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing |
| 08/25/2005 | WO2005077598A1 Detection signal transmitting apparatus |
| 08/25/2005 | US20050186890 Tool sharpener with web thickness determination capability |
| 08/25/2005 | US20050186887 Processing method and apparatus |
| 08/25/2005 | US20050186886 Process and device for the aligning of tooth spaces of a workpiece with precut teeth |
| 08/25/2005 | US20050186691 Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus |
| 08/25/2005 | US20050185180 Semiconductor processor control systems |
| 08/25/2005 | DE102004013192B3 Bearing and cams grinding method e.g. for cam shaft, involves having cam shaft consisting of steel tube and cam directs tube toward grinding machine, with which after sharpening procedure directs cam shaft toward same grinding machine |
| 08/24/2005 | CN1659000A Apparatus for checking the dimensional and geometric features of pins |
| 08/23/2005 | US6934040 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers |
| 08/23/2005 | US6932679 Apparatus and method for loading a wafer in polishing system |
| 08/23/2005 | US6932678 Polishing apparatus |
| 08/23/2005 | US6932675 Plated grinding wheel life maximization method |
| 08/23/2005 | US6932674 Method of determining the endpoint of a planarization process |
| 08/23/2005 | US6932672 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
| 08/23/2005 | US6932671 Method for controlling a chemical mechanical polishing (CMP) operation |
| 08/23/2005 | US6931749 Apparatus and methods for measuring the pin diameter of a crankshaft at the place of grinding |
| 08/18/2005 | US20050181706 Method and control system for improving cmp process by detecting and reacting to harmonic oscillation |
| 08/18/2005 | US20050178743 A multilayer pad having a plurality of independent electrical biasable zones, attaching to exterior power source from one layer; controlling the rate of copper material removal from printed circuits, determining each polishing time in each zone; electrical apparatus for making semiconductors |
| 08/18/2005 | US20050178018 Method for the in-process dimensional checking of orbitally rotating crankpins |
| 08/18/2005 | DE102005000645A1 Treatment of substrate for manufacture of semiconductor device comprises chemically mechanically polishing substrate in intermediate polishing step then in final polishing step |
| 08/18/2005 | DE102004004556A1 Verfahren zur Herstellung der Halbleiterscheibe A process for producing the semiconductor wafer |
| 08/17/2005 | CN1655906A Polishing apparatus and methods for controlling polishing pressure as function of overlap area between polishing head and semiconductor substrate |
| 08/16/2005 | US6931330 Methods for monitoring and controlling chemical mechanical planarization |
| 08/16/2005 | US6930782 End point detection with imaging matching in semiconductor processing |
| 08/16/2005 | US6930478 Method for monitoring a metal layer during chemical mechanical polishing using a phase difference signal |
| 08/16/2005 | US6929531 System and method for metal residue detection and mapping within a multi-step sequence |
| 08/16/2005 | US6929530 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
| 08/11/2005 | WO2005072910A1 Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, cmp polisher, and method of manufacturing semiconductor device |
| 08/11/2005 | WO2005072332A2 Chemical mechanical planarization process control utilizing in-situ conditioning process |
| 08/11/2005 | US20050176348 Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method |
| 08/11/2005 | US20050176347 Wafer grinder |
| 08/11/2005 | DE102004003203A1 Elektro-Handwerkzeug mit optimiertem Arbeitsbereich Electric hand tool with optimized workspace |
| 08/10/2005 | EP1562228A2 Chemical mechanical polishing process for low dishing of metal lines in semiconductor wafer fabrication |
| 08/10/2005 | CN1653600A Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers |
| 08/10/2005 | CN1652898A Process control in electro-chemical mechanical polishing |
| 08/10/2005 | CN1213913C Package with multiple chambers and valves |
| 08/10/2005 | CN1213834C Method of chemical mechanical polishing |
| 08/09/2005 | US6926589 Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing |
| 08/09/2005 | US6926586 Fixture for attaching indicator to grinding machine |
| 08/09/2005 | US6926585 Pressure control system and polishing apparatus |
| 08/04/2005 | WO2005070624A1 Electric hand tool comprising an optimised working region |
| 08/04/2005 | US20050170752 Plated grinding wheel life maximization method |
| 08/04/2005 | US20050170751 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| 08/04/2005 | US20050170750 Polish pad to change polish rate on wafer by adjusting groove width and density |
| 08/04/2005 | US20050170749 Process for producing a semiconductor wafer |
| 08/04/2005 | US20050170748 Lens made of a crystalline material |
| 08/04/2005 | DE10361636A1 Verfahren und System zum Steuern des chemisch-mechanischen Polierens mittels eines seismischen Signals eines seismischen Sensors A method and system for controlling the chemical mechanical polishing by means of a seismic signal from a seismic sensor |
| 08/03/2005 | EP1558426A1 Polishing apparatus |
| 08/03/2005 | CN1649103A Method for producing semiconductor wafer |
| 08/03/2005 | CN1647893A High speed precision digital control grinding processing device based on PMAC |
| 08/02/2005 | US6925348 Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
| 08/02/2005 | US6924641 Method and apparatus for monitoring a metal layer during chemical mechanical polishing |
| 08/02/2005 | US6923711 Multizone carrier with process monitoring system for chemical-mechanical planarization tool |
| 08/02/2005 | US6923710 Apparatus and method for chemical mechanical polishing process |
| 08/02/2005 | US6923709 Chemical mechanical polishing apparatus having a measuring device for measuring a guide ring |
| 07/28/2005 | WO2005067663A2 Devices and methods for optical endpoint detection during semiconductor wafer polishing |
| 07/28/2005 | US20050164608 Apparatus for optical inspection of wafers during processing |
| 07/28/2005 | US20050164606 Chemical mechanical planarization process control utilizing in-situ conditioning process |
| 07/28/2005 | US20050164604 Apparatus for transporting for polishing wafers |
| 07/27/2005 | CN1646264A Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 07/27/2005 | CN1644318A Tire uniformity machine grinder |
| 07/26/2005 | US6922253 Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates |
| 07/26/2005 | US6922070 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing |
| 07/26/2005 | US6920698 Head and apparatus for the linear dimension checking of mechanical pieces |
| 07/21/2005 | WO2004078411A3 Method and apparatus for local polishing control |
| 07/21/2005 | US20050159080 Modified radial motion (MRM) method for modifying lengthwise curvature of face-milling spiral bevel and hypoid gears |
| 07/21/2005 | US20050159079 Rotor-grinding machine comprising a rotary head with two grinding wheels |
| 07/21/2005 | DE19825698B4 Bandschleifmaschine Belt sander |
| 07/20/2005 | CN1643662A System and method of broad band optical end point detection for film change indication |
| 07/20/2005 | CN1642693A Measuring the surface properties of polishing pads using ultrasonic reflectance |
| 07/20/2005 | CN1642692A Polishing pad support that improves polishing performance and longevity |
| 07/20/2005 | CN1642691A Rotor-grinding machine comprising a rotary head with two grinding wheels |
| 07/19/2005 | US6919958 Wafer metrology apparatus and method |
| 07/19/2005 | US6918821 Materials and methods for low pressure chemical-mechanical planarization |
| 07/19/2005 | US6918815 System and apparatus for predicting plate lapping properties to improve slider fabrication yield |
| 07/19/2005 | US6918814 Polishing apparatus |
| 07/14/2005 | US20050153632 Methods of preparing semiconductor workpiece process fluid |
| 07/14/2005 | US20050153631 System and method for monitoring quality control of chemical mechanical polishing pads |
| 07/14/2005 | US20050153557 Apparatus and method for treating susbtrates |
| 07/14/2005 | US20050150599 Devices and methods for optical endpoint detection during semiconductor wafer polishing |
| 07/14/2005 | DE10120341B4 Verfahren zur Bestimmung aktueller Positionsdaten eines Bearbeitungswerkzeugs A method for determining the current position data of a machine tool |
| 07/13/2005 | EP1551593A1 Polishing state monitoring apparatus and polishing apparatus and method |