Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
04/2006
04/12/2006CN1250372C Polishing pad with built-in optical sensor
04/11/2006US7025664 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
04/11/2006US7025658 Platen and head rotation rates for monitoring chemical mechanical polishing
04/11/2006US7024785 Method for the in-process dimensional checking of orbitally rotating crankpins
04/06/2006WO2006036412A1 Endpoint adjustment in electroprocessing
04/06/2006WO2006035337A1 Flexible rinsing step in a cmp process
04/06/2006US20060073770 Vapor deposition crucible
04/06/2006US20060073769 Polishing method
04/06/2006US20060073765 Grinding process and apparatus with arrangement for grinding with constant grinding load
04/05/2006EP1642678A1 Eyeglass lens processing apparatus
04/05/2006EP1641597A1 Substrate polishing apparatus
04/04/2006US7024063 In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
04/04/2006US7021992 Tire face grinder assembly
04/04/2006US7021991 Polishing apparatus
04/04/2006US7021990 Method and apparatus for circular grinding
04/04/2006US7020974 Apparatus for checking the dimensional and geometric features of pins
03/2006
03/30/2006US20060068684 Polishing method and polishing system
03/29/2006EP1639630A1 Polishing apparatus and polishing method
03/29/2006EP0809798B1 Method for polishing a wafer and method for manufacturing an integrated circuit
03/29/2006CN1751857A Automatic optimizing design method for constant force griding wave filter
03/29/2006CN1751855A Cmp pad having a streamlined windowpane
03/28/2006US7020306 Polishing pad surface condition evaluation method and an apparatus thereof and a method of producing a semiconductor device
03/28/2006US7019519 Thickness estimation using conductively related calibration samples
03/28/2006US7018275 Closed-loop control of wafer polishing in a chemical mechanical polishing system
03/28/2006US7018272 Pressure feed grinding of AMLCD substrate edges
03/28/2006US7018271 Method for monitoring a substrate during chemical mechanical polishing
03/28/2006US7018270 Method and apparatus for cutting semiconductor wafers
03/28/2006US7018269 Pad conditioner control using feedback from a measured polishing pad roughness level
03/28/2006US7018268 Protection of work piece during surface processing
03/28/2006CA2276319C Method and apparatus for ultrasonically testing of the surface of columnar structures, and method for grinding rolls by use of them
03/23/2006US20060063473 Method for inspecting grinding wheels
03/23/2006US20060063469 Advanced chemical mechanical polishing system with smart endpoint detection
03/23/2006DE102004053308A1 Device for simultaneous sharpening of both sides of disc shaped workpiece which is sandwiched between axial guidance devices and left and right grinding wheels
03/22/2006EP1637744A1 Proportional pressure regulator having positive and negative pressure delivery capability
03/22/2006EP1635960A2 Method and apparatus to process substrates with megasonic energy
03/22/2006EP1337380B1 Abrasive article having a window system for polishing wafers, and methods
03/22/2006EP1176631B1 Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device
03/22/2006EP1137515B1 Method and grinding machine for controlling the process during rough grinding of a workpiece
03/22/2006CN1246125C End point detection system for chemical and mechanical polishing
03/21/2006US7016799 Apparatus and method for checking the machining process of a machine tool
03/21/2006US7016795 Signal improvement in eddy current sensing
03/21/2006US7016000 Apparatus and method for rubbing LCD substrate
03/21/2006US7014541 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
03/21/2006US7014532 Lapping machine, lapping method, and method of manufacturing magnetic head
03/21/2006US7014531 Method and apparatus for inline measurement of material removal during a polishing or grinding process
03/21/2006US7014530 Slider fabrication system for sliders with integrated electrical lapping guides
03/21/2006US7014529 Substrate processing method and substrate processing apparatus
03/16/2006WO2006027885A1 Methods for determining and machining worked surface of plate-like material and apparatus for these methods
03/16/2006WO2005119383A3 Method and apparatus for controlling the machining of mechanical pieces
03/16/2006WO2005072332A3 Chemical mechanical planarization process control utilizing in-situ conditioning process
03/16/2006US20060057939 Grinding method of a workpiece and grinding apparatus
03/15/2006EP1633528A2 Substrate polishing apparatus
03/15/2006EP1633526A2 Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
03/15/2006EP1322940A4 In-situ method and apparatus for end point detection in chemical mechanical polishing
03/15/2006CN1747811A Method for calibrating a grinding machine
03/14/2006US7011568 Grinder with adjustable tool rest
03/14/2006US7011566 Methods and systems for conditioning planarizing pads used in planarizing substrates
03/14/2006US7011565 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
03/09/2006WO2006025507A1 Polishing apparatus and polishing method
03/09/2006US20060052040 Method for manufacturing microporous CMP materials having controlled pore size
03/09/2006US20060052037 Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus
03/08/2006CN2763968Y Chemical-mechanical abrading device
03/08/2006CN1744969A Modeling an abrasive process to achieve controlled material removal
03/08/2006CN1744285A 制造系统 Manufacturing System
03/07/2006US7008875 Methods and apparatus for polishing control
03/07/2006US7008309 Back pressure control system for CMP and wafer polishing
03/07/2006US7008298 Machine for machining long workpieces provided with cutting teeth, particularly for grinding endless saw blades
03/07/2006US7008297 Combined eddy current sensing and optical monitoring for chemical mechanical polishing
03/07/2006US7008296 Data processing for monitoring chemical mechanical polishing
03/07/2006US7008295 Substrate monitoring during chemical mechanical polishing
03/02/2006WO2006022452A2 Polishing apparatus and polishing method
03/02/2006WO2006022336A1 Method of evaluating cutting edge profile of re-sharpening pinion cutter
03/02/2006US20060046619 Polishing pad conditioner and monitoring method therefor
03/02/2006US20060046618 Methods and systems for determining physical parameters of features on microfeature workpieces
03/01/2006EP1628803A1 Method and device for machining spectacle lenses
03/01/2006EP1628802A1 Floor sanding machine
02/2006
02/28/2006US7004821 Process for bevelling an ohthalmic lens including a plotting stage without contact
02/28/2006US7004817 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
02/28/2006US7004816 Grinding method for vertical type of double disk surface grinding machine
02/28/2006US7004814 CMP process control method
02/23/2006WO2006019840A1 Abrasive article splicing system and methods
02/23/2006US20060040594 Apparatus and method for fabricating liquid crystal display panel
02/23/2006US20060040588 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
02/23/2006US20060040586 Method and apparatus for polishing a semiconductor device
02/23/2006US20060037699 Polishing pad and method for manufacturing semiconductor device
02/23/2006DE102004040429A1 Doppelseiten-Poliermaschine Double-side polishing machine
02/22/2006EP1628113A1 Feeler device for workpieces being machined
02/22/2006EP1626839A1 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
02/21/2006US7003148 Detection of an end point of polishing a substrate
02/21/2006US7002689 Optically-based method and apparatus for detecting and characterizing surface pits in a metal film during chemical mechanical polish
02/21/2006US7001260 Carrier head with a compressible film
02/21/2006US7001257 Multi-chamber carrier head with a flexible membrane
02/21/2006US7001249 Methods and systems for finishing edges of glass sheets
02/21/2006US7001246 Method and apparatus for monitoring a metal layer during chemical mechanical polishing
02/21/2006US7001245 Substrate carrier with a textured membrane
02/21/2006US7001244 Polishing apparatus
02/21/2006US7001243 Neural network control of chemical mechanical planarization
02/21/2006US7001242 Method and apparatus of eddy current monitoring for chemical mechanical polishing
02/16/2006US20060035565 Grinding wheel monitoring
02/16/2006US20060035562 System and a method for polishing optical connectors
1 ... 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 ... 89