Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
08/2006
08/03/2006US20060169591 Method of making printed wiring board and method of forming plating film
08/02/2006CN2801397Y Pulse communicating device
08/02/2006CN1811920A Thin-film magnetic head crystal wafer
08/01/2006US7083500 Method and device for grinding the outside and inside of a rotationally symmetric machine part comprising a longitudinal borehole
08/01/2006US7083499 Method for deciding a bevel curve, method for determining the locus of a bevel, method for processing a lens and apparatus for processing a lens
08/01/2006US7083498 Method for deciding a bevel curve, method for determining the locus of a bevel, method for processing a lens and apparatus for processing a lens
08/01/2006US7083497 Polishing pad with built-in optical sensor
07/2006
07/27/2006WO2006077994A1 Substrate polishing method and apparatus
07/27/2006US20060166611 Back pressure control system for CMP and wafer polishing
07/27/2006US20060166609 System And Method For Ophthalmic Lens Manufacture
07/27/2006US20060166608 Spectral imaging of substrates
07/27/2006US20060166607 Detection of diamond contamination in polishing pad and reconditioning system therefor
07/27/2006US20060166606 Polishing state monitoring apparatus and polishing apparatus and method
07/27/2006US20060166604 Process and apparatus for grinding work for non-circular rotor, as well as camshaft
07/27/2006US20060166503 Polishing apparatus and polishing method
07/27/2006US20060166487 Method and apparatus for chemical mechanical polishing of semiconductor substrates
07/27/2006US20060163074 Biasing via electrodes; electro-chemical mechanical polishing; for semiconductor wafers/integrated circuits
07/26/2006EP1594654B1 Method and device for mechanically buffing worn-down tires
07/26/2006CN1809444A 基片抛光设备和基片抛光方法 A substrate polishing apparatus and a substrate polishing method
07/26/2006CN1807020A Calibration method and corrosion and milling machine used thereof
07/25/2006US7082345 Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
07/25/2006US7081040 Tool sharpener with web thickness determination capability
07/25/2006US7081038 Polishing method and apparatus
07/25/2006US7081037 Pad conditioner setup
07/20/2006WO2005067663A3 Devices and methods for optical endpoint detection during semiconductor wafer polishing
07/20/2006US20060160470 Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
07/19/2006EP1681136A1 Method for supplying lens of eyeglasses
07/19/2006CN1805825A Data processing for monitoring chemical mechanical polishing
07/19/2006CN1805824A Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
07/19/2006CN1803402A Marker method for optical polishing process
07/18/2006USRE39194 Method and apparatus for controlling planarizing characteristics in mechanical and chemical-mechanical planarization of microelectronic substrates
07/18/2006US7078894 Polishing device using eddy current sensor
07/18/2006US7077721 Pad assembly for electrochemical mechanical processing
07/18/2006US7076882 Head and apparatus for the linear dimension checking of mechanical pieces
07/18/2006CA2369657C Rotary abrasive tool
07/18/2006CA2280342C Micro-discharge truing device and fine machining method using the device
07/13/2006WO2006072456A1 Measurement of the thickness of a workpiece with ultrasound or megasound
07/13/2006US20060154570 Monitoring a metal layer during chemical mechanical polishing
07/13/2006US20060154568 Multilayer polishing pad and method of making
07/13/2006DE102004063870A1 Werkstückdickenmessung mit Ultra- oder Megaschall Workpiece thickness measurement with ultrasonic or megasonic
07/13/2006DE10059737B4 Anpassbare Läppscheibe für die Feinbearbeitung optischer Flächen und ein Verfahren für die Feinbearbeitung einer ausgewählten optischen Fläche mit einer anpassbaren Läppscheibe Customizable lapping wheel for fine machining of optical surfaces and a method for finishing a selected optical surface with a customizable lapping
07/12/2006EP1677945A1 Grinding machine
07/12/2006CN2794744Y Digital curve grinder
07/12/2006CN1799781A 手持式工具机 Hand-held machine tool
07/11/2006US7074114 Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces
07/11/2006US7074112 Apparatus that holds and tilts a tool
07/11/2006US7074111 Surface preparation device and method
07/11/2006US7074110 Optical coupler hub for chemical-mechanical-planarization polishing pads with an integrated optical waveguide
07/11/2006US7074109 Chemical mechanical polishing control system and method
07/06/2006US20060148383 Methods and systems for detecting a presence of blobs on a specimen during a polishing process
07/06/2006US20060148382 Polishing apparatus
07/06/2006US20060148381 Pad assembly for electrochemical mechanical processing
07/06/2006US20060148261 Methods and apparatus for polishing control
07/05/2006EP1676673A1 Attitude control device and precision machining apparatus comprising same
07/05/2006EP1676671A1 Precision machining apparatus and precision machining method
07/05/2006EP1590759A4 Method for automatic riser gate removal compensating for variance in casting
07/05/2006CN1798635A Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
07/05/2006CN1263087C Infrared end-point detecting system
07/05/2006CN1262393C Magnetic head grinding apparatus and grinding method
07/04/2006US7072050 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus
07/04/2006US7072016 Method for rubbing LCD substrate
07/04/2006US7070483 Automated drill bit re-sharpening and verification system
07/04/2006US7070479 Arrangement and method for conditioning a polishing pad
07/04/2006US7070478 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
07/04/2006US7070476 In-situ metalization monitoring using eddy current measurements during the process for removing the film
07/04/2006US7070475 Process control in electrochemically assisted planarization
06/2006
06/29/2006US20060141908 Method and apparatus for using a coolant fluid
06/29/2006US20060141907 Method for monitoring a CMP polishing method and arrangement for a CMP polishing method
06/29/2006DE10056814B4 Motorbetriebenes Werkzeug mit Arbeitsgeschwindigkeitssteuerschaltung The power tool with working speed control circuit
06/28/2006CN1795076A A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
06/27/2006US7066794 Tool for fine machining of optically active surfaces
06/27/2006US7066788 Electronic die positioning device and method
06/27/2006US7066787 Substrate processing apparatus
06/27/2006US7066786 Method of dressing polishing pad and polishing apparatus
06/27/2006US7066785 Polishing apparatus and related polishing methods
06/27/2006US7066028 Acoustic sensor for monitoring machining processes in machining tools
06/22/2006WO2005072332B1 Chemical mechanical planarization process control utilizing in-situ conditioning process
06/22/2006US20060135043 Grinding method and grinding machine
06/22/2006US20060135040 Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates
06/22/2006US20060131273 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
06/22/2006DE202006003376U1 Machine tool in particular for face grinding of work-piece, comprising specifically arranged guiding elements and spindle for compensation of irregular gap
06/21/2006EP1670615A2 Cnc abrasive fluid-jet milling
06/21/2006CN1791970A Substrate holding apparatus and polishing apparatus
06/21/2006CN1791491A 基片抛光设备 Substrate polishing equipment
06/21/2006CN1791490A Substrate polishing apparatus
06/21/2006CN1260778C Substrate processing method
06/20/2006US7062838 Method of forming an embedded read element
06/15/2006WO2006061910A1 Initial position setting method of whetstone in vertical duplex surface grinding machine
06/15/2006WO2006061474A1 Device for automatic mounting preparation of ophthalmic lenses enabling several lenses to be processed at the same time
06/15/2006WO2006061473A1 Method and device for automatic mounting preparation an ophthalmic lens
06/15/2006US20060129267 Method for measuring with a machining machine-tool, tool adapted therefor and software product managing same
06/15/2006US20060128286 Polishing apparatus
06/15/2006US20060128277 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
06/15/2006US20060128273 Methods and systems for conditioning planarizing pads used in planarizing substrates
06/15/2006US20060128272 Automated drill bit re-sharpening and verification system
06/15/2006US20060124474 Method and apparatus for local polishing control
06/14/2006EP1339528B1 Hand tool comprising a sensor for emitting a signal when the tool attachment is replaced
06/13/2006US7060606 Method and apparatus for chemical mechanical polishing of semiconductor substrates
06/13/2006US7059939 Polishing pad conditioner and monitoring method therefor
06/13/2006US7059937 Systems including differential pressure application apparatus
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