Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
07/2011
07/06/2011EP2089186B1 Apparatus for polishing a semiconductor wafer
07/06/2011EP2083967B1 Conditioning tools and techniques for chemical mechanical planarization
07/06/2011EP1542267B1 Method and apparatus for polishing wafer
07/06/2011CN201889708U Grinder
07/06/2011CN201889707U Foamed sponge grinding device
07/06/2011CN201889706U Discharging device of ultra-precision grinder
07/06/2011CN102119071A High porosity vitrified superabrasive products and method of preparation
07/06/2011CN102119070A Chemical mechanical polishing with multi-zone slurry delivery
07/06/2011CN102119069A Polishing pad and method for manufacturing the polishing pad
07/06/2011CN102117758A Transfer mechanism
07/06/2011CN102117736A Substrate treating device, substrate conveying device, substrate grasping device, and chemical solution treating device
07/06/2011CN102114609A Experimental method for chemical mechanical polishing technology modeling
07/06/2011CN101372089B Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing
07/06/2011CN101106082B Method for the simultaneous double-side grinding of a plurality of semiconductor wafers, and semiconductor wafer having outstanding flatness
07/05/2011US7973105 Polymer particles having improved mechanical properties and applications of same
07/05/2011US7972485 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
07/05/2011US7972440 Monitoring and control of a fabrication process
06/2011
06/30/2011WO2011079059A2 Method of making a grinding disk and a grinding disk
06/30/2011WO2011077999A1 Pad for chemical mechanical polishing and method of chemical mechanical polishing using same
06/30/2011WO2011077973A1 Polishing agent for copper polishing and polishing method using the same
06/30/2011WO2011077922A1 Temporarily fixing composition
06/30/2011WO2011077887A1 Cmp polishing fluid for polishing palladium and polishing method
06/30/2011WO2011077631A1 Dual-surface polishing device
06/30/2011WO2011037776A3 Abrasive article with solid core and methods of making the same
06/30/2011WO2011028556A3 Structured abrasive article and method of using the same
06/30/2011US20110159786 Polishing Pad with Porous Elements and Method of Making and Using the Same
06/30/2011US20110159785 Preparation of synthetic quartz glass substrates
06/30/2011US20110159783 Method and apparatus for polishing a substrate
06/30/2011US20110159782 Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatus
06/30/2011US20110156058 Silicon carbide monocrystal substrate and manufacturing method therefor
06/30/2011US20110155690 Polishing method
06/29/2011EP2338849A1 Preparation of synthetic quartz glass substrates
06/29/2011CN201881267U Pressure balancing mechanism of double-layer plane grinder
06/29/2011CN201881266U Pressurizing device of double-layer grinder
06/29/2011CN201881265U Grinding pressure adjusting device of double-layer grinder
06/29/2011CN201881264U Connecting shaft mechanism of double-layer grinder
06/29/2011CN201881263U Stereoscopic grinding disc device
06/29/2011CN102113096A Polishing solution for cmp, and method for polishing substrate using the polishing solution for cmp
06/29/2011CN102108281A Polishing composition
06/29/2011CN102107392A Wafer grinding tray supporting device
06/29/2011CN102107391A Method for processing monocrystal silicon carbide wafer
06/29/2011CN101716745B Device and method for polishing sapphire substrate material by ultrasound assisted chemical machinery
06/29/2011CN101579840B High-precise ball highly-efficient grinding and polishing processing method
06/28/2011US7967665 Substrate holding apparatus, polishing apparatus, and polishing method
06/28/2011US7967662 Apparatus for lapping sliders using axially deformable member
06/28/2011US7967660 Polishing apparatus and polishing method
06/23/2011WO2011074691A1 Polishing method, polishing apparatus and polishing tool
06/23/2011WO2011074361A1 Group iii nitride crystal substrate, group iii nitride crystal substrate having epitaxial layer, and semiconductor device and method for producing the same
06/23/2011US20110151755 Cmp retaining ring
06/23/2011US20110151752 Process for producing glass substrate
06/23/2011US20110151751 Method of manufacturing semiconductor device
06/23/2011US20110147947 Semiconductor device and method for fabricating the same
06/22/2011EP1491605B1 Cerium based abrasive material and method for preparation thereof
06/22/2011DE112009001195T5 Doppelseiten-Schleifvorrichtung und Verfahren zur Herstellung von Wafern The double-side grinding apparatus and method for the production of wafers
06/22/2011DE102008044646B4 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer
06/22/2011CN201872081U Lapping plate connecting device of plane lapping machine
06/22/2011CN201872080U Grinding device of grinder limit column
06/22/2011CN201872079U Ultra-fine grinding machine for bearing roller
06/22/2011CN201872078U Grinding device for cylinder sleeve mounting surface of railway motor car
06/22/2011CN201872077U Grinding device of upper and lower guide bearing bushes of hydro-power generating unit generator
06/22/2011CN201872076U Planetary grinding disc
06/22/2011CN201872075U Supporting plate positioning device used for valves
06/22/2011CN201872074U Fixture device on punch former
06/22/2011CN1816422B Synthesis of a functionally graded pad for chemical mechaical planarization
06/22/2011CN102105267A Polishing composition and polishing method using the same
06/22/2011CN102105266A Aluminum oxide particle and polishing composition containing the same
06/22/2011CN102101755A Method for thinning glass substrate
06/22/2011CN101583464B Polishing pad and method for producing the same
06/21/2011US7964653 Polyol composition for two-component curable abrasive foam, composition for two-component curable abrasive foam, abrasive foam, and method for producing abrasive foam
06/21/2011US7963825 Abrasive, method of polishing target member and process for producing semiconductor device
06/21/2011US7963823 Machining machine with means for acquiring machining parameters
06/16/2011WO2011071168A1 Cmp polishing liquid, method for polishing substrate, and electronic component
06/16/2011WO2011070898A1 Polishing slurry for silicon carbide and polishing method therefor
06/16/2011WO2011070839A1 Abrasive material
06/16/2011WO2011070699A1 Semiconductor wafer polishing method
06/16/2011US20110143636 Optical disk restoration method and apparatus
06/16/2011DE10196115B4 Verfahren zum Polieren eines Halbleiterwafers A method of polishing a semiconductor wafer
06/15/2011EP2331649A2 Methods and compositions for polishing silicon-containing substrates
06/15/2011EP2331294A1 Method for measuring the thickness of a discoidal workpiece
06/15/2011CN201863119U Grinding sleeve with coaxial holes
06/15/2011CN201863118U Flexible shaft grinding equipment
06/15/2011CN201863117U Grinding equipment of circuit board
06/15/2011CN201863116U Clamping mechanism for valve sealing surface grinding device
06/15/2011CN201863115U Base of valve sealing surface grinding device
06/15/2011CN201863114U Sample fixing tool for chemical mechanical polishing
06/15/2011CN102092002A Liquid polishing method for monocrystalline silicon piece
06/15/2011CN102092001A Grinding device for ceramic bushing
06/15/2011CN102092000A Fixture for grinding ball end of plunger connecting rod assembly
06/15/2011CN102091999A Processing method for hot-pressing grinding of bearing bush working faces
06/15/2011CN102091995A Chemical and mechanism grinding method and system
06/15/2011CN101456165B Polishing cloth and substrate manufacturing method using same
06/15/2011CN101396805B Carrier head with retaining ring and carrier ring
06/15/2011CN101264585B Double-side polishing apparatus
06/14/2011US7961431 Additive-free fiber for metal texture of hard disk drives
06/14/2011US7959493 Method for polishing glass substrate and process for producing glass substrate
06/14/2011US7959490 Orthopaedic component manufacturing method and equipment
06/09/2011WO2011068236A1 Wafer polishing method
06/09/2011US20110136414 Polishing head and polishing apparatus
06/09/2011US20110136407 Method for predicting the polishing characteristics and life-span of a soft polishing pad
06/09/2011DE112009001875T5 Waferpolierverfahren und Doppelseitenpoliervorrichtung Wafer polishing method and double-side polishing apparatus
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