Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1995
10/03/1995US5454506 Structure and process for electro/mechanical joint formation
10/03/1995US5454161 Through hole interconnect substrate fabrication process
10/03/1995US5454159 Method of manufacturing I/O terminals on I/O pads
10/03/1995CA1337224C Compositions having uv cure with moisture shadow cure
09/1995
09/28/1995WO1995026123A1 Method of preparing foil printed circuit boards or semi-finished products for foil printed circuit boards
09/28/1995WO1995026122A1 Foil printed circuit boards and method of producing the same
09/28/1995WO1995026047A1 Semiconductor package manufacturing method and semiconductor package
09/28/1995WO1995026036A1 Printed circuit board relay with insert connections
09/28/1995WO1995025606A1 Cleaning process
09/28/1995DE4410285A1 Leiterplattenrelais mit Einpreßanschlüssen PCB relay with press
09/28/1995DE4410091A1 Electrostatic adhesive panel production process
09/28/1995DE19509441A1 Hybrid integrated circuit
09/28/1995CA2186116A1 Printed circuit board relay with insert connections
09/28/1995CA2162398A1 Filter substrate for connector and method for production thereof
09/27/1995EP0674473A2 Direct circuit board connection
09/27/1995EP0674472A2 Electronic package assembly and connector for use therewith
09/27/1995EP0673706A1 Solder paste mixture
09/27/1995EP0538432B1 Device for producing an electric circuit, especially for a measuring probe, and a measuring probe
09/27/1995EP0528963B1 Process for the production of a multilayer printed circuit board
09/26/1995US5453642 Multilayer interconnect systems
09/26/1995US5453582 Circuit board to be precoated with solder layers and solder circuit board
09/26/1995US5453581 Pad arrangement for surface mount components
09/26/1995US5453161 Polyamic acid to polyimide conversion by microwave heating
09/26/1995US5453148 Adhesive for connecting a circuit member to a substrate
09/26/1995US5453017 Solderable connector for high density electronic assemblies
09/26/1995US5452842 Tin-zinc solder connection to a printed circuit board or the like
09/26/1995US5452656 Apparatus for selectively applying solder paste to multiple types of printed circuit boards
09/26/1995US5452655 Screen printing apparatus for printing of viscous material
09/21/1995WO1995025422A1 Mechanical support and electrical interconnection device
09/21/1995WO1995025346A1 Electric connections arranged in a high-density grid
09/21/1995WO1995025008A1 Bismuth coating protection for copper
09/21/1995DE4408356A1 Circuit adaptor device
09/21/1995DE19509202A1 Electrically conducting connection
09/21/1995DE19509173A1 Masse aus einem Epoxygruppen enthaltenden Cycloolefinharz Mass of an epoxy group-containing cyclo-olefin
09/21/1995DE19505763A1 Soldering appts. for mounting components on printed circuit boards
09/20/1995EP0673192A1 Device for mechanical support and for electrical interconnections
09/20/1995EP0673189A1 Interconnection of opposite sides of a circuit board
09/20/1995EP0673188A1 Belt for providing solder depots for soldering components on a printed circuit board
09/20/1995EP0673067A2 High-frequency circuit with integrated logic circuit
09/20/1995EP0672955A1 Process for electrodeposition of resist formulations which contain metal salts of b-diketones
09/20/1995EP0672951A2 Lead-frame forming material
09/20/1995EP0672639A1 Paste for closing holes in ceramic substrates
09/20/1995EP0672500A2 Polymeric mask for sandblasting and method for its use
09/20/1995EP0672334A1 Process for production of printed circuit boards and use thereby
09/20/1995EP0672333A1 Compliant stacking connector for printed circuit boards
09/20/1995EP0643903A4 Tin-bismuth solder connection having improved high temperature properties, and process for forming same.
09/20/1995EP0558547B1 Process for the production of copper-coated substrates
09/20/1995CN2208312Y Transmission mechanism of closed loop welder for circuit boards
09/20/1995CN1108859A Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminsls even when the electrode terminals have a fine pitch
09/20/1995CN1108813A Surface mount chip package
09/20/1995CN1108768A Drycorrosion apparatus
09/19/1995US5452182 Flexible high density interconnect structure and flexibly interconnected system
09/19/1995US5451885 Interconnect stress test coupon
09/19/1995US5451815 Semiconductor device with surface mount package adapted for vertical mounting
09/19/1995US5451722 Printed circuit board with metallized grooves
09/19/1995US5451721 Multilayer printed circuit board and method for fabricating same
09/19/1995US5451720 Circuit board thermal relief pattern having improved electrical and EMI characteristics
09/19/1995US5451716 Resin-packaged electronic component having bent lead terminals
09/19/1995US5451629 Fast bonding electrically conductive composition and structures
09/19/1995US5451551 Multilevel metallization process using polishing
09/19/1995US5450959 Apparatus for use in separating parts from a panel array of parts
09/19/1995US5450744 Contamination monitoring system
09/19/1995CA1337037C Fluxless application of a metal-comprising coating
09/19/1995CA1337035C Process for metallizing substrate surfaces
09/19/1995CA1337030C Solder connector device
09/14/1995WO1995024821A1 Fabrication multilayer combined rigid/flex printed circuit board
09/14/1995WO1995024747A1 Semiconductor chip affording a high-density external interface
09/14/1995WO1995024734A1 Technique for producing interconnecting conductive links
09/14/1995WO1995024733A1 Prefabricated semiconductor chip carrier
09/14/1995WO1995024730A2 Apparatus having inner layers supporting surface-mount components
09/14/1995WO1995024674A1 Stable, ionomeric photoresist emulsion and process of preparation and use thereof
09/14/1995WO1995024276A1 Surround print process for the manufacture of electrode embedded dielectric green sheets
09/14/1995DE4408276A1 Dimer fatty acid-based polyamide
09/14/1995DE4407508A1 Embedding electrical conductors in plastic
09/14/1995DE19507317A1 Connection assembly for semiconductor chip
09/14/1995CA2185028A1 Stable, ionomeric photoresist emulsion and process of preparation and use thereof
09/13/1995EP0671647A1 Liquid crystal display module
09/13/1995EP0671041A1 Detection tag.
09/13/1995EP0670760A1 Electrical connector
09/13/1995EP0610364B1 Non-chlorinated solvent dewax process
09/12/1995US5450290 Printed circuit board with aligned connections and method of making same
09/12/1995US5450289 Semiconductor package and a printed circuit board applicable to its mounting
09/12/1995US5450286 Printed circuit having a dielectric covercoat
09/12/1995US5450263 Electronic device
09/12/1995US5450222 Electrical connection of devices incorporating multiple liquid crystal cells
09/12/1995US5450204 Inspecting device for inspecting printed state of cream solder
09/12/1995US5450101 Thermal head for a printer
09/12/1995US5449955 Copper barrier layer between nickel and gold
09/12/1995US5449863 Printed circuit board
09/12/1995US5449862 Planar cable array
09/12/1995US5449591 Shaping prepreg in a mold, plating with copper, forming patterns, repeating with next prepreg layer
09/12/1995US5449480 Method of producing boards for printed wiring
09/12/1995US5449427 Processing low dielectric constant materials for high speed electronics
09/12/1995US5449409 Device to process green-tape type circuits
09/12/1995US5449407 Expansion compensated precision extrusion apparatus
09/12/1995US5449301 Shunt connector
09/12/1995US5449110 Method of soldering lead terminal to substrate
09/12/1995US5449010 Pressure controlled cleaning system
09/12/1995US5448948 Squeegee for thick film screen printing processes
09/10/1995CA2143913A1 Liquid crystal display module
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