Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/1996
04/02/1996US5504277 Solder ball array
04/02/1996US5504265 Saturated linear polyfluorohydrocarbons, processes for their production, and their use in cleaning compositions
04/02/1996US5504138 Circuit board devices with superconducting bonds and lines
04/02/1996US5504035 Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate
04/02/1996US5503961 Applying photosensitive polyimide precursor on substrate, exposing, inhibiting photosensitivity, applying second layer of precursor, exposing, developing
04/02/1996US5503960 Placing photoresist layers on top and bottom surfaces of metal plate, masking, accurately aligning mask patterns, securing together, exposing to ultraviolet light, removing masks, developing photoresists, etching apertures in exposed metal
04/02/1996US5503787 Heat treating green laminate of glass and ceramic, oxidizing, reducing, firing and densification
04/02/1996US5503777 Thixotropic conductive paste
04/02/1996US5503698 Heating thermally degrabable complex in polymer matrix to produce metal solder
04/02/1996US5503681 Using a silicon-containing or an isoparaffin cleaning agent with a surfactant or a hydrophilic solvent cleaning promoter
04/02/1996US5503286 Depositing adhesive metallic layer overlying insulator, depositing chromium copper alloy layer, depositing solder bondable metallic layer, forming solder, etching using solder as mask, selectively etching adhesion layer
04/02/1996US5503122 Engine components including ceramic-metal composites
04/02/1996US5502893 Method of making a printing wiring board
04/02/1996US5502891 Electrical connecting method utilizing an anisotropic conductive film
04/02/1996US5502889 Method for electrically and mechanically connecting at least two conductive layers
04/02/1996CA2046615C A method of manufacturing a substrate for placement of electrical and/or electronic components
03/1996
03/31/1996CA2158915A1 Liquid photoimageable resist
03/31/1996CA2158703A1 Electrical connector and alignment apparatus for contact pins thereof
03/28/1996WO1996009751A1 Device for automatically fitting upper and lower sides of printed circuit boards with smd components
03/28/1996WO1996009749A1 Process and device for automatically fitting the top and bottom sides of printed circuit boards with smd components
03/28/1996WO1996009748A1 Planar cable array
03/28/1996WO1996009746A1 Compliant interface for a semiconductor chip
03/28/1996WO1996009745A1 Microelectronic bonding with lead motion
03/28/1996WO1996009647A1 Process for contacting an electronic component on a substrate
03/28/1996WO1996009646A1 Polymer stud grid array
03/28/1996WO1996009339A1 Ptfe reinforced compliant adhesive and method of fabricating same
03/28/1996WO1996009158A1 Foiled ud-prepreg and pwb laminate prepared therefrom
03/28/1996DE4434460A1 Electronic component for circuit board mounting
03/28/1996DE4433930A1 Illumination element with flexible contact pins
03/28/1996DE4432864A1 Mounting system for front panel electronic module mounting on circuit board
03/28/1996DE3645319C2 Electrodeposition process for printed circuit boards
03/28/1996DE19535282A1 Connecting electronic component to substrate with several contact faces
03/28/1996DE19532811A1 Lötpaste und Verfahren zur Herstellung Solder paste and process for preparing
03/28/1996CA2200314A1 Foiled ud-prepreg and pwb laminate prepared therefrom
03/27/1996EP0703721A2 Improved battery holder for a printed circuit board
03/27/1996EP0703639A1 Multilayer electric circuit with connecting terminals
03/27/1996EP0703423A1 Step elevator for transporting workpieces in a vertical direction within an oven or furnace
03/27/1996EP0703069A1 Cushioning material for forming press
03/27/1996EP0703038A1 Movable registration pin mechanism
03/27/1996EP0702847A1 Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
03/27/1996EP0702806A1 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material
03/27/1996EP0401367B1 Ink-on-glass digitizer tablet and method of construction
03/27/1996CN1119456A Process for producing clean article
03/27/1996CN1119404A Method and apparatus for removing film
03/27/1996CN1119403A Treatment method and apparatus for printed circuit boards and the like
03/27/1996CN1119402A Dual substrate package assembly for being electrically coupled to a conducting member
03/27/1996CN1119352A Microwave oscilator and making of same
03/27/1996CN1119343A Method for producing semiconductor device
03/27/1996CN1119342A Electronic package with multilevel connections
03/27/1996CN1031446C Making method for multi-layer electronic circuit
03/26/1996US5502631 Circuit elements that are ultrasonically welded together
03/26/1996US5502617 Electronic device having a flat, card-like casing enclosing components for a complete computer system
03/26/1996US5501944 Ablative imaging by proximity lithography
03/26/1996US5501942 Crosslinkable acrylate polymers
03/26/1996US5501938 Magnetic, electroconductive, fluorescent, colored patterns, graphic arts, color proofing, masks for printed circuits, secuity coding
03/26/1996US5501777 Method for testing solder mask material
03/26/1996US5501761 Method for stripping conformal coatings from circuit boards
03/26/1996US5501755 Large area multi-electrode radiation detector substrate
03/26/1996US5501735 Apparatus for processing printed circuit board substrates
03/26/1996US5501629 Buffing apparatus suitable to buff thin plate work and controlling method for the apparatus
03/26/1996US5501350 Forming photoresist layer on a copper layer black-oxide treated by alkaline oxidizer and finely surface roughened by acid treatment
03/26/1996US5501005 Mounting device of electronic components and a mounting method
03/26/1996US5501004 Outer-lead bonding apparatus and method therefor
03/26/1996CA2116662C Component of printed circuit boards
03/26/1996CA1338186C Circuit board material and electroplating bath for the production thereof
03/21/1996WO1996008945A1 Monolithic lcp polymer microelectronic wiring modules
03/21/1996WO1996008841A1 A high density integrated circuit assembly combining leadframe leads with conductive traces
03/21/1996WO1996008728A1 A surface mount test point enabling hands free diagnostic testing of electronical circuits
03/21/1996WO1996008525A1 Process for producing photosensitive resin and liquid photosensitive resin composition
03/21/1996WO1996008415A1 Mechanical connection of printed circuit boards for building three-dimensional structures from flat printed circuit board waste
03/21/1996WO1996008337A1 Method of applying solder to connection surfaces, and method of producing a solder alloy
03/21/1996DE4433565A1 Einrichtung zum automatischen Bestücken der Ober- und Unterseite von Leiterplatten mit SMD-Bauteilen Means for automatically loading the top and bottom of PCB with SMD components
03/21/1996DE4433378A1 Automatic mounting of electronic SMD components on both sides of circuit board
03/21/1996DE4432966A1 Economical injection moulding of plastics device with metal on pt. of surface
03/21/1996DE4432774A1 Verfahren zur Belotung von Anschlußflächen, sowie Verfahren zur Herstellung einer Lotlegierung A process for Belotung of pads, and to methods for producing a solder alloy
03/20/1996EP0702511A2 Packaging electrical components
03/20/1996EP0702509A2 Packaging electrical components
03/20/1996EP0702432A1 Connector for a printed circuit board
03/20/1996EP0702425A1 Improved solder tail and electric connector incorporating same
03/20/1996EP0702404A2 Semiconductor device
03/20/1996EP0702402A1 Manufacturing method for integrated circuits and semiconductor wafer so obtained
03/20/1996EP0702379A1 Electronic and/or magnetic devices
03/20/1996EP0702269A1 Process for producing a cutting die
03/20/1996EP0702070A2 Adhesive for copper foils and adhesive-backed copper foil
03/20/1996EP0701924A2 Electrical connection box
03/20/1996EP0701634A1 Multiple solvent cleaning system
03/20/1996EP0540514B1 High accuracy, high flexibility energy beam machining system
03/20/1996EP0464507B1 Method and apparatus for the continuous manufacture of planar, resin containing laminates
03/20/1996CN1118886A Waterborne photoresists having associate thickeners
03/19/1996USRE35180 High frequency thermode driven device employing one-turn-secondary transformers
03/19/1996US5500785 Circuit board having improved thermal radiation
03/19/1996US5500555 Multi-layer semiconductor package substrate with thermally-conductive prepeg layer
03/19/1996US5500315 An article comprising an image pattern on a substrate
03/19/1996US5500279 Laminated metal structure and metod of making same
03/19/1996US5500278 Used for hybrid integrated circuit
03/19/1996US5500106 Electroplating process
03/19/1996US5499924 Butt joint connector assembly
03/19/1996US5499756 Method of applying a tacking agent to a printed circuit board
03/19/1996US5499754 Fabricating electronic systems
03/19/1996US5499668 Process for making electronic device
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