| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/03/1995 | EP0640151A4 Solder bumping of integrated circuit die. |
| 05/03/1995 | EP0561794B1 Shield gas wave soldering |
| 05/03/1995 | EP0497948B1 Method and device for hermetic encapsulation of electronic components |
| 05/03/1995 | CN1102260A 感光性树脂 Photosensitive resin |
| 05/03/1995 | CA2134632A1 Solder-coating method, and solder paste suitable for use therein |
| 05/02/1995 | US5412539 Multichip module with a mandrel-produced interconnecting decal |
| 05/02/1995 | US5412538 Multi-layer printed circuit board |
| 05/02/1995 | US5412159 High voltage resistive network circuit board with good potting adhesion |
| 05/02/1995 | US5412157 Semiconductor device |
| 05/02/1995 | US5412055 Fully substituted cyclopolysiloxanes and their use for making organosilicon polymers |
| 05/02/1995 | US5412002 Composition of glycidylated phenol/vinylcyclohexene or vinylnorbornene resin |
| 05/02/1995 | US5411837 Photoimageable composition of a latex binder, an unsaturated monomer, a photoinitiator and a neutralizing base and/or a polyetherurethane copolymer thickener |
| 05/02/1995 | US5411836 Positive type photoresist composition comprising a polymer having carbon-carbon double bonds with a maleic half ester and a maleimide attached to the backbone |
| 05/02/1995 | US5411795 Multilayer textile with metal and fabric |
| 05/02/1995 | US5411792 Transparent conductive substrate |
| 05/02/1995 | US5411765 Flexible multi-layer polyimide film laminates and preparation thereof |
| 05/02/1995 | US5411703 Lead-free, tin, antimony, bismtuh, copper solder alloy |
| 05/02/1995 | US5411629 Method for roughening surface of halocarbon film |
| 05/02/1995 | US5411628 Diffusion patterning process and screen therefor |
| 05/02/1995 | US5411602 Solder compositions and methods of making same |
| 05/02/1995 | US5411595 Post-etch, printed circuit board cleaning process |
| 05/02/1995 | US5411420 Solder terminal strip |
| 05/02/1995 | US5411409 Component mounting arrangement |
| 05/02/1995 | US5411404 Electrical connector having bus bars providing circuit board retention |
| 05/02/1995 | US5411400 Interconnect system for a semiconductor chip and a substrate |
| 05/02/1995 | US5411236 Reinforcing metal fitting for surface mount connector |
| 05/02/1995 | US5411199 Method for attaching a shield |
| 05/02/1995 | US5410957 Screen printing apparatus |
| 05/02/1995 | US5410956 Vacuum hot platen press with airtight covers in sliding contact with tensile strength members |
| 05/02/1995 | US5410807 High density electronic connector and method of assembly |
| 05/02/1995 | US5410806 Method for fabricating conductive epoxy grid array semiconductors packages |
| 05/02/1995 | US5410805 Method and apparatus for isolation of flux materials in "flip-chip" manufacturing |
| 04/27/1995 | WO1995011582A1 Flexible multilayer printed circuit boards and methods of manufacture |
| 04/27/1995 | WO1995011581A1 Treatment of substrates |
| 04/27/1995 | WO1995011580A1 Circuit-board device |
| 04/27/1995 | WO1995011129A1 Composite substrates for preparation of printed circuits |
| 04/27/1995 | WO1995005061A3 Method for producing a conductive circuit |
| 04/27/1995 | DE4336235A1 Method for the production of ceramic multilayers |
| 04/27/1995 | DE4335735A1 Suction module for boards and sheets |
| 04/27/1995 | CA2118091A1 Means for imparting improved adhesion to polyolefin substrates |
| 04/26/1995 | EP0650315A2 Electric control apparatus, especially for installation in a vehicle |
| 04/26/1995 | EP0650314A2 Method and apparatus for manufacture of printed circuit cards |
| 04/26/1995 | EP0650189A1 Method of manufacture of a semiconductor module |
| 04/26/1995 | EP0649917A1 Electrodeposited copper foil and process for making same |
| 04/26/1995 | EP0649702A1 Surface treatment method for fatigue-resistant solder |
| 04/26/1995 | EP0649699A2 Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering |
| 04/26/1995 | EP0649590A1 Component module |
| 04/26/1995 | EP0649574A1 Connection using zebra strip. |
| 04/26/1995 | EP0649565A1 Fitting unit for multilayer hybrid circuit with power components |
| 04/26/1995 | EP0649562A1 Circuit protection device |
| 04/25/1995 | US5410452 Printed circuit board electrical adaptor pin |
| 04/25/1995 | US5410451 Location and standoff pins for chip on tape |
| 04/25/1995 | US5410449 Heatsink conductor solder pad |
| 04/25/1995 | US5410233 Magneto-repulsion punching with dynamic damping |
| 04/25/1995 | US5410184 Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same |
| 04/25/1995 | US5409800 Temporary substrate having alkali soluble thermoplastic resin layer, intermediate layer, and photosensitive resin layer, interlaminar adhesion being least at interface between thermoplastic layer and the temporary substrate |
| 04/25/1995 | US5409741 Method for metallizing surfaces by means of metal powders |
| 04/25/1995 | US5409733 Apparatus and methods for applying conformal coatings to electronic circuit boards |
| 04/25/1995 | US5409567 Method of etching copper layers |
| 04/25/1995 | US5409399 Electrical connection assembly for mounting on a printed circuit board |
| 04/25/1995 | US5409159 Apparatus and methods for inerting solder during wave soldering operations |
| 04/25/1995 | US5409157 Composite transversely plastic interconnect for microchip carrier |
| 04/25/1995 | US5409155 Vibrational self aligning parts in a solder reflow process |
| 04/25/1995 | US5408741 Method for forming electronic device |
| 04/25/1995 | CA2078234C Dielectric filter and mounting bracket assembly |
| 04/25/1995 | CA1335340C Method for conditioning an organic polymeric material |
| 04/20/1995 | WO1995010931A1 Bonding inner layers in printed circuit board manufacture |
| 04/20/1995 | WO1995010343A1 Cleaning method |
| 04/20/1995 | DE4418278C1 Electrolytic process for treatment of printed circuit boards in horizontal continuous plants |
| 04/20/1995 | DE4417550C1 Method for the electrolytic treatment of microstrip line circuit boards and flexible microstrip line circuit boards |
| 04/20/1995 | DE4335879A1 Arrangement for quality control and monitoring of through-plated multilayer printed circuit boards |
| 04/20/1995 | DE4335524A1 Arrangement for attaching a flexible film to a printed circuit board |
| 04/19/1995 | EP0649273A1 Process of making an electrical contact |
| 04/19/1995 | EP0649272A1 Flexible fastening member and its method of manufacturing |
| 04/19/1995 | EP0649194A1 Electrical connector having reduced cross-talk |
| 04/19/1995 | EP0649193A1 Low insertion force/low profile flex connector |
| 04/19/1995 | EP0649171A2 Multichip module with a mandrel-produced interconnecting decal |
| 04/19/1995 | EP0649140A2 Electrical interconnect for a head/arm assembly of computer disk drives |
| 04/19/1995 | EP0649045A2 Method of repairing disconnection of wiring of a liquid crystal substrate |
| 04/19/1995 | EP0648568A1 Hot air circulation apparatus and method for wave soldering machines |
| 04/19/1995 | EP0648154A1 Use of fresnel zone plates for material processing |
| 04/19/1995 | EP0640039A4 Thin film metallization and brazing of aluminum nitride. |
| 04/19/1995 | EP0551328A4 Piezoelectric component-mounting foil and foil-making method |
| 04/19/1995 | EP0527740B1 Azeotropic composition of perfluoro-1,2-dimethylcyclobutane with 1,1-dichloro-1-fluoroethane |
| 04/19/1995 | CN1101598A Subliming solder flux composition |
| 04/19/1995 | CN1028266C Screen-printable thick film paste composition |
| 04/18/1995 | US5408538 Method of and apparatus for inspecting the minimum annular width of a land on a printed circuit board |
| 04/18/1995 | US5408385 Control device and method of making the same |
| 04/18/1995 | US5408207 Electronic device for high frequencies comprising a printed circuit and process for manufacturing such a circuit |
| 04/18/1995 | US5408190 Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die |
| 04/18/1995 | US5408053 Layered planar transmission lines |
| 04/18/1995 | US5408052 Flexible multi-layer circuit wiring board |
| 04/18/1995 | US5408050 Flat cable and method of making the same |
| 04/18/1995 | US5407864 Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip |
| 04/18/1995 | US5407783 Photoimageable compositions containing substituted 1, 2 dihalogenated ethanes for enhanced printout image |
| 04/18/1995 | US5407710 Contacting substrate with gaseous metallic precursor compound, focusing laser beam having specified wavelength on circuit line to heat and deposit metal, moving to other circuit line to connect |
| 04/18/1995 | US5407622 Injection molding; electroless deposition of metals |
| 04/18/1995 | US5407557 Multilayer laminate composed of wiring boards formed from a flexible dielectric and a wiring pattern |
| 04/18/1995 | US5407511 Process for forming a sintered conductor circuit board |
| 04/18/1995 | US5407505 Method of encapsulating temperature sensitive devices in wax-like material having a high coefficient of fusion |