Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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08/03/1995 | DE4402758A1 Method for applying fluxing agent to PCBs |
08/03/1995 | CA2181997A1 A method of making a composite laminate and a pwb substrate so made |
08/03/1995 | CA2158941A1 Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors |
08/02/1995 | EP0665706A1 Method of fabricating flat flexible circuits |
08/02/1995 | EP0665705A2 Circuit-like metallic foil sheet and the like and process for producing them |
08/02/1995 | EP0665609A2 Mounting terminal pins in substrates |
08/02/1995 | EP0665468A1 Staining inhibitor for photopolymerizable compositions containing a tetrazole |
08/02/1995 | EP0665467A1 Photoresist compositions with improved sensitivity and metal adhesion |
08/02/1995 | EP0665309A1 Copper etching process |
08/02/1995 | EP0566712B1 Method and system for removing contaminants |
08/02/1995 | CN1106188A Printed circuit board and method of manufacturing the same |
08/02/1995 | CN1106156A Display device easy to rework and method of assembling the same |
08/02/1995 | CN1106073A Preparation for applying metall through surface structurization |
08/02/1995 | CN1029426C Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer |
08/01/1995 | USH1471 Metal substrate double sided circuit board |
08/01/1995 | US5438481 Molded-in lead frames |
08/01/1995 | US5438480 Printed circuit board and electronic parts to be mounted thereon |
08/01/1995 | US5438479 High density, heat-dissipating circuit assembly with accessible components |
08/01/1995 | US5438223 Anisotropic electrically conductive adhesive film and connection structure using the same |
08/01/1995 | US5438167 Ferrimagnetic vias within multi-layer 3-dimensional structures/substrates |
08/01/1995 | US5437960 Process for laminating photosensitive layer |
08/01/1995 | US5437937 Surface treatment of metals |
08/01/1995 | US5437916 Flexible printed circuits |
08/01/1995 | US5437914 Electrolytic copper foil on glossy surface |
08/01/1995 | US5437760 Press belt applicator for a continuous belt press |
08/01/1995 | US5437758 Green sheet manufacturing methods and apparatuses |
08/01/1995 | US5437727 Apparatus for drawing paste pattern on substrate |
08/01/1995 | US5437091 High curvature antenna forming process |
08/01/1995 | CA1336482C Treating an autodeposited coating with an alkaline material |
07/27/1995 | WO1995020064A1 Uniform electroplating of printed circuit boards |
07/27/1995 | WO1995019888A1 Laser-driven silk screen mask device |
07/27/1995 | DE4417518C1 Device for wet coating of circuit boards with lacquer |
07/27/1995 | DE4401889A1 Coupling device to couple circuit board with multiple pole plug connector |
07/27/1995 | DE4401612A1 Conductive region prodn. in or on ceramic workpiece |
07/27/1995 | DE3790128C2 Electroless plating soln. for palladium deposition |
07/27/1995 | DE19502257A1 Circuit board for electrical distribution box |
07/26/1995 | EP0664664A1 Depositing a conductive metal onto a substrate |
07/26/1995 | EP0664576A2 Pinned module |
07/26/1995 | EP0664562A1 Ball grid array plastic package |
07/26/1995 | EP0664491A1 Waterborne photoresists having polysiloxanes |
07/26/1995 | EP0664490A1 Waterborne photoresists having associate thickeners |
07/26/1995 | EP0664489A1 Waterborne photoresists having binders with sulfonic acid functionality |
07/26/1995 | EP0664488A1 Waterborne photoresists having binders neutralized with amino acrylates |
07/26/1995 | EP0664486A1 Waterborne photoresists having non-ionic fluorocarbon surfactants |
07/26/1995 | EP0664446A2 Inspection system and method for cross-sectional imaging |
07/26/1995 | EP0664073A1 Method for producing a conductive circuit |
07/26/1995 | EP0664016A1 Method for preparing and using a screen printing stencil having raised edges |
07/26/1995 | EP0579701B1 Process for the metallization of non-conductors, in particular circuit boards, using nitrogen-containing quaternary salts in the process |
07/26/1995 | EP0573534A4 Powder coating method for producing circuit board laminae and the like. |
07/26/1995 | EP0506786B1 Weakening wire supplied through a wire bonder |
07/26/1995 | CA2133146A1 Waterborne photoresists having binders with sulfonic acid functionality |
07/25/1995 | US5436745 Flex circuit board for liquid crystal display |
07/25/1995 | US5436500 Surface mount semiconductor package |
07/25/1995 | US5436412 Interconnect structure having improved metallization |
07/25/1995 | US5436411 Fabrication of substrates for multi-chip modules |
07/25/1995 | US5436405 Electromagnetically shielded microstrip circuit and method of fabrication |
07/25/1995 | US5436279 Coating materials containing a reaction product of an epoxy novolak resin and an olefinically unsaturated carboxylic acid crosslinkable by radiation |
07/25/1995 | US5436098 Multilayer element with quinone diazide, resin and aromatic hydroxy compound for relief images |
07/25/1995 | US5436083 Protective electronic coatings using filled polysilazanes |
07/25/1995 | US5436062 Process for the production of printed circuit boards with extremely dense wiring using a metal-clad laminate |
07/25/1995 | US5436034 Process for improving the adhesiveness of electrolessly deposited metal films |
07/25/1995 | US5436028 Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards |
07/25/1995 | US5435903 Process for the electrodeposition of an amorphous cobalt-iron-phosphorus alloy |
07/25/1995 | US5435885 Apparatus and method for fluid processing of electronic packaging with flow pattern change |
07/25/1995 | US5435875 Method of manufacturing cavitied ceramic multilayer block |
07/25/1995 | US5435860 Corrosion resistance for printed circuits |
07/25/1995 | US5435838 Immersion plating of tin-bismuth solder |
07/25/1995 | US5435733 Connector assembly for microelectronic multi-chip-module |
07/25/1995 | US5435732 Flexible circuit member |
07/25/1995 | US5435671 Drilling printed circuit boards and entry and backing boards therefor |
07/25/1995 | US5435482 Integrated circuit having a coplanar solder ball contact array |
07/25/1995 | US5435481 Soldering process |
07/25/1995 | US5435480 Method for filling plated through holes |
07/25/1995 | US5435057 Interconnection method and structure for organic circuit boards |
07/25/1995 | CA1336368C Pad printing device for the transfer of clearly defined quantities of printing medium per surface unit |
07/20/1995 | WO1995019692A1 Process for forming solid conductive vias in substrates |
07/20/1995 | WO1995019691A1 A circuit board with specifically designed connection terminals |
07/20/1995 | WO1995019256A1 Oxygen-curable coating composition |
07/19/1995 | EP0663691A2 Method of soldering leads to electrical components |
07/19/1995 | EP0663417A1 Thermoplastic polyimide polymer, thermoplastic polyimide film, polyimide laminate, and process for producing the laminate |
07/19/1995 | EP0663411A1 Photo-imaging resist ink and cured product thereof |
07/19/1995 | EP0663140A1 Fabrication of dense parallel solder bump connections |
07/19/1995 | EP0663108A1 Contacting device for a film with several conductor tracks. |
07/19/1995 | EP0662984A1 Process for treating plastic surfaces and swelling solution |
07/19/1995 | CN1105398A Electrodeposited copper foil and process for making same |
07/18/1995 | US5434749 Hybrid printed circuit board |
07/18/1995 | US5434365 Supporting structure for a vibrator |
07/18/1995 | US5434362 Flexible circuit board assembly and method |
07/18/1995 | US5434232 Bisimide compositions |
07/18/1995 | US5434102 Process for fabricating layered superlattice materials and making electronic devices including same |
07/18/1995 | US5433885 Stabilization of silicate solutions |
07/18/1995 | US5433822 Method of manufacturing semiconductor device with copper core bumps |
07/18/1995 | US5433821 Direct patternization device and method |
07/18/1995 | US5433820 Method and apparatus for dry process fluxing |
07/18/1995 | US5433819 Method of making circuit boards |
07/18/1995 | US5433624 Connector |
07/18/1995 | US5433372 Process for the application of solder composition on the pins of electronic components |
07/18/1995 | US5433000 Manufacturing method for a multilayer wiring board |
07/18/1995 | US5432998 Gold-tin eutectic, alloy |
07/18/1995 | CA2050702C Transportation protection and insertion device for multi-conductor cables |