Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/1995
08/03/1995DE4402758A1 Method for applying fluxing agent to PCBs
08/03/1995CA2181997A1 A method of making a composite laminate and a pwb substrate so made
08/03/1995CA2158941A1 Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors
08/02/1995EP0665706A1 Method of fabricating flat flexible circuits
08/02/1995EP0665705A2 Circuit-like metallic foil sheet and the like and process for producing them
08/02/1995EP0665609A2 Mounting terminal pins in substrates
08/02/1995EP0665468A1 Staining inhibitor for photopolymerizable compositions containing a tetrazole
08/02/1995EP0665467A1 Photoresist compositions with improved sensitivity and metal adhesion
08/02/1995EP0665309A1 Copper etching process
08/02/1995EP0566712B1 Method and system for removing contaminants
08/02/1995CN1106188A Printed circuit board and method of manufacturing the same
08/02/1995CN1106156A Display device easy to rework and method of assembling the same
08/02/1995CN1106073A Preparation for applying metall through surface structurization
08/02/1995CN1029426C Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer
08/01/1995USH1471 Metal substrate double sided circuit board
08/01/1995US5438481 Molded-in lead frames
08/01/1995US5438480 Printed circuit board and electronic parts to be mounted thereon
08/01/1995US5438479 High density, heat-dissipating circuit assembly with accessible components
08/01/1995US5438223 Anisotropic electrically conductive adhesive film and connection structure using the same
08/01/1995US5438167 Ferrimagnetic vias within multi-layer 3-dimensional structures/substrates
08/01/1995US5437960 Process for laminating photosensitive layer
08/01/1995US5437937 Surface treatment of metals
08/01/1995US5437916 Flexible printed circuits
08/01/1995US5437914 Electrolytic copper foil on glossy surface
08/01/1995US5437760 Press belt applicator for a continuous belt press
08/01/1995US5437758 Green sheet manufacturing methods and apparatuses
08/01/1995US5437727 Apparatus for drawing paste pattern on substrate
08/01/1995US5437091 High curvature antenna forming process
08/01/1995CA1336482C Treating an autodeposited coating with an alkaline material
07/1995
07/27/1995WO1995020064A1 Uniform electroplating of printed circuit boards
07/27/1995WO1995019888A1 Laser-driven silk screen mask device
07/27/1995DE4417518C1 Device for wet coating of circuit boards with lacquer
07/27/1995DE4401889A1 Coupling device to couple circuit board with multiple pole plug connector
07/27/1995DE4401612A1 Conductive region prodn. in or on ceramic workpiece
07/27/1995DE3790128C2 Electroless plating soln. for palladium deposition
07/27/1995DE19502257A1 Circuit board for electrical distribution box
07/26/1995EP0664664A1 Depositing a conductive metal onto a substrate
07/26/1995EP0664576A2 Pinned module
07/26/1995EP0664562A1 Ball grid array plastic package
07/26/1995EP0664491A1 Waterborne photoresists having polysiloxanes
07/26/1995EP0664490A1 Waterborne photoresists having associate thickeners
07/26/1995EP0664489A1 Waterborne photoresists having binders with sulfonic acid functionality
07/26/1995EP0664488A1 Waterborne photoresists having binders neutralized with amino acrylates
07/26/1995EP0664486A1 Waterborne photoresists having non-ionic fluorocarbon surfactants
07/26/1995EP0664446A2 Inspection system and method for cross-sectional imaging
07/26/1995EP0664073A1 Method for producing a conductive circuit
07/26/1995EP0664016A1 Method for preparing and using a screen printing stencil having raised edges
07/26/1995EP0579701B1 Process for the metallization of non-conductors, in particular circuit boards, using nitrogen-containing quaternary salts in the process
07/26/1995EP0573534A4 Powder coating method for producing circuit board laminae and the like.
07/26/1995EP0506786B1 Weakening wire supplied through a wire bonder
07/26/1995CA2133146A1 Waterborne photoresists having binders with sulfonic acid functionality
07/25/1995US5436745 Flex circuit board for liquid crystal display
07/25/1995US5436500 Surface mount semiconductor package
07/25/1995US5436412 Interconnect structure having improved metallization
07/25/1995US5436411 Fabrication of substrates for multi-chip modules
07/25/1995US5436405 Electromagnetically shielded microstrip circuit and method of fabrication
07/25/1995US5436279 Coating materials containing a reaction product of an epoxy novolak resin and an olefinically unsaturated carboxylic acid crosslinkable by radiation
07/25/1995US5436098 Multilayer element with quinone diazide, resin and aromatic hydroxy compound for relief images
07/25/1995US5436083 Protective electronic coatings using filled polysilazanes
07/25/1995US5436062 Process for the production of printed circuit boards with extremely dense wiring using a metal-clad laminate
07/25/1995US5436034 Process for improving the adhesiveness of electrolessly deposited metal films
07/25/1995US5436028 Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards
07/25/1995US5435903 Process for the electrodeposition of an amorphous cobalt-iron-phosphorus alloy
07/25/1995US5435885 Apparatus and method for fluid processing of electronic packaging with flow pattern change
07/25/1995US5435875 Method of manufacturing cavitied ceramic multilayer block
07/25/1995US5435860 Corrosion resistance for printed circuits
07/25/1995US5435838 Immersion plating of tin-bismuth solder
07/25/1995US5435733 Connector assembly for microelectronic multi-chip-module
07/25/1995US5435732 Flexible circuit member
07/25/1995US5435671 Drilling printed circuit boards and entry and backing boards therefor
07/25/1995US5435482 Integrated circuit having a coplanar solder ball contact array
07/25/1995US5435481 Soldering process
07/25/1995US5435480 Method for filling plated through holes
07/25/1995US5435057 Interconnection method and structure for organic circuit boards
07/25/1995CA1336368C Pad printing device for the transfer of clearly defined quantities of printing medium per surface unit
07/20/1995WO1995019692A1 Process for forming solid conductive vias in substrates
07/20/1995WO1995019691A1 A circuit board with specifically designed connection terminals
07/20/1995WO1995019256A1 Oxygen-curable coating composition
07/19/1995EP0663691A2 Method of soldering leads to electrical components
07/19/1995EP0663417A1 Thermoplastic polyimide polymer, thermoplastic polyimide film, polyimide laminate, and process for producing the laminate
07/19/1995EP0663411A1 Photo-imaging resist ink and cured product thereof
07/19/1995EP0663140A1 Fabrication of dense parallel solder bump connections
07/19/1995EP0663108A1 Contacting device for a film with several conductor tracks.
07/19/1995EP0662984A1 Process for treating plastic surfaces and swelling solution
07/19/1995CN1105398A Electrodeposited copper foil and process for making same
07/18/1995US5434749 Hybrid printed circuit board
07/18/1995US5434365 Supporting structure for a vibrator
07/18/1995US5434362 Flexible circuit board assembly and method
07/18/1995US5434232 Bisimide compositions
07/18/1995US5434102 Process for fabricating layered superlattice materials and making electronic devices including same
07/18/1995US5433885 Stabilization of silicate solutions
07/18/1995US5433822 Method of manufacturing semiconductor device with copper core bumps
07/18/1995US5433821 Direct patternization device and method
07/18/1995US5433820 Method and apparatus for dry process fluxing
07/18/1995US5433819 Method of making circuit boards
07/18/1995US5433624 Connector
07/18/1995US5433372 Process for the application of solder composition on the pins of electronic components
07/18/1995US5433000 Manufacturing method for a multilayer wiring board
07/18/1995US5432998 Gold-tin eutectic, alloy
07/18/1995CA2050702C Transportation protection and insertion device for multi-conductor cables