Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/1995
05/22/1995CA2175678A1 Ablative imaging by proximity lithography
05/18/1995WO1995013691A1 Printed circuit assembly having component locating features
05/18/1995WO1995013632A1 Passive conductor component for surface mounting on a printed circuit board
05/18/1995WO1995013625A1 Structure and method for mounting semiconductor device and liquid crystal display device
05/18/1995WO1995013331A1 Pressure sensitive adhesives
05/18/1995WO1995013161A1 Device for moving an object by means of thermal change in shape or volume
05/18/1995DE4338744A1 Printed circuit board with conduction paths
05/18/1995CA2174973A1 Pressure sensitive adhesives
05/17/1995EP0653905A1 Direct chip attach module
05/17/1995EP0653904A2 Via fill compositions for direct attach of devices and methods for applying same
05/17/1995EP0653819A2 High density electrical connector
05/17/1995EP0653805A2 Contact strip with edge clip connector
05/17/1995EP0653789A2 Electronic package structure and method of making same
05/17/1995EP0653763A1 Ultraviolet hardenable, solventless conductive polymeric material
05/17/1995EP0653641A1 Acceleration sensor
05/17/1995EP0653484A1 Compositions containing pentafluorobutane and use thereof
05/17/1995EP0653109A1 Modular panel for making a conductor network, associated connectors, and methods for fabricating such panels
05/17/1995EP0653105A1 Planarizing bumps for interconnecting matching arrays of electrodes
05/17/1995EP0652982A1 Process for the electrolytic processing especially of flat items and arrangement for implementing the process.
05/17/1995EP0652820A1 Process for producing plastic laminates from continuously fed bands.
05/17/1995CN2197696Y Multi-element press
05/16/1995US5416667 Printed wiring board having an electromagnetic wave shielding layer
05/16/1995US5416569 Electrographically making devices having electrically conductive paths corresponding to those graphically represented on a mask
05/16/1995US5416502 High-density circuit and method of its manufacture
05/16/1995US5416358 IC card including frame with lateral hole for injecting encapsulating resin
05/16/1995US5416278 Feedthrough via connection
05/16/1995US5416277 Cicuit and process of manufacturing the circuit
05/16/1995US5416276 Printed circuit board having protecting means
05/16/1995US5416274 Circuit board
05/16/1995US5415945 Dielectric ceramic composition for low temperature sintering
05/16/1995US5415944 Solder clad substrate
05/16/1995US5415920 Patterned chromium barrier layer with flange-like structure
05/16/1995US5415897 Method of depositing solid substance on a substrate
05/16/1995US5415819 Low pressure plasma treatment method
05/16/1995US5415762 Electroplating process and composition
05/16/1995US5415749 Process for electrodeposition of resist formulations which contain metal salts of β-diketones
05/16/1995US5415693 Paste applicator
05/16/1995US5415555 Electrical interconnection apparatus utilizing raised connecting means
05/16/1995US5415337 Method and apparatus for applying solder flux to a printed circuit
05/16/1995US5415193 Pressure controlled cleaning system
05/16/1995US5414928 Method of making an electronic package assembly with protective encapsulant material
05/16/1995CA2094072C Apparatus and system for screen printing
05/11/1995WO1995012966A1 Process for the dimensionally accurate lamination of multi-layer printed circuit boards and device therefor
05/11/1995WO1995012907A1 Manufacture of connector
05/11/1995WO1995012643A1 Electrically conductive adhesives
05/11/1995DE4434058A1 Dispenser device for applying slush (high-density pulps) thickened materials
05/11/1995DE4339019A1 Method for the fabrication of circuit boards
05/11/1995DE4338225A1 Process for wave soldering using lead-free solders
05/11/1995DE4338092A1 Device for desoldering components from a board, or soldering components to a board
05/11/1995DE4337970A1 Process for producing materials in web or sheet form, in particular circuit-board base material, from glass-fibre/epoxy-resin regrind from circuit-board scrap
05/11/1995DE4337921A1 Contactless chip card having an antenna coil and method for its production
05/11/1995DE4337920A1 Method and arrangement for producing a permanent electrical pressure contact
05/11/1995DE4337749A1 Method for producing ceramic multilayers
05/11/1995DE4337724A1 Device for coating the wall of holes in electrical printed circuit boards or multilayer printed circuit boards
05/11/1995DE4329000A1 Method and device for soldering workpieces
05/10/1995EP0652693A1 Machine for mechanically machining boards, in particular printed circuit boards
05/10/1995EP0652692A1 Printed circuit board
05/10/1995EP0652074A1 Machining head for mechanically machining boards, in particular printed circuit boards
05/10/1995EP0652068A1 Improvements in and relating to applying solder flux to a printed circuit board
05/10/1995EP0651937A1 Self-aligning electrical contact array
05/10/1995EP0651916A1 Rf waveguide signal transition apparatus
05/10/1995EP0651696A1 A method of manufacturing a ud-reinforced pwb laminate
05/10/1995EP0651684A1 Apparatus and process for soldering component onto boards.
05/09/1995US5414576 Space saving configuration of a printed cirucit board for a magnetic head on a flexure seat for the head
05/09/1995US5414303 Integrated circuit chip module
05/09/1995US5414239 Optical apparatus for laser machining
05/09/1995US5414224 Multilayer printed circuit board and method of manufacturing same
05/09/1995US5414223 Solder pad for printed circuit boards
05/09/1995US5413970 Process for manufacturing a semiconductor package having two rows of interdigitated leads
05/09/1995US5413966 Semiconductors
05/09/1995US5413964 Photo-definable template for semiconductor chip alignment
05/09/1995US5413838 Both-side roughened copper foil with protection film
05/09/1995US5413817 Method for adhering metal coatings to polyphenylene ether-polystyrene articles
05/09/1995US5413730 Compositions containing a fluorinated ether and use of these compositions
05/09/1995US5413660 Method for imparting improved adhesion to polyolefin substrates
05/09/1995US5413659 Array of conductive pathways
05/09/1995US5413275 Method of positioning and soldering of SMD components
05/09/1995US5413164 Heating furnace in combination with electronic circuit modules
05/09/1995US5412865 Method of manufacturing multilayer electronic component
05/09/1995CA2134592A1 Co2 cleaning and method
05/09/1995CA2134591A1 Supersonic exhaust nozzle having reduced noise levels for co2 cleaning system
05/09/1995CA1335494C Fiber resin composites, and method of making the same
05/05/1995CA2118206A1 Method and apparatus for applying solder flux to a printed circuit
05/04/1995WO1995012229A1 Flat flexible jumper
05/04/1995DE4416986A1 Process for producing from thermoplastic material a component having at least one integrated, electrically conducting section, and a component produced by this process
05/04/1995DE4405932C1 Aqueous noble metal preparations and their use for producing noble metal decorations
05/04/1995DE4336749A1 Vergußmasse für eine elektrische Baugruppe Sealing compound for electrical assembly
05/03/1995EP0651602A1 Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
05/03/1995EP0651601A1 Photopolymerisable mixture and process for manufacturing solder masks
05/03/1995EP0651600A1 Solder-coating method, and solder paste suitable for use therein
05/03/1995EP0651599A1 Fastening device for an electronic component on a flexible circuit, and casing containing such a device
05/03/1995EP0651598A1 Electronic circuit module
05/03/1995EP0651471A2 Electrical connector having bus bars providing circuit board retention
05/03/1995EP0651468A1 Circuit board and edge-mountable connector therefor, and method of preparing a circuit board edge
05/03/1995EP0651463A2 Method of soldering an electric cable to a circuit board
05/03/1995EP0651072A1 A process for etching titanium at a controllable rate
05/03/1995EP0651013A1 A tie-layer and a process for improving adhesion of a surface layer to a polyolefin substrate
05/03/1995EP0650848A2 Interconnect scheme for mounting differently configured print heads on the same carriage
05/03/1995EP0650795A2 Solder ball connections and assembly process
05/03/1995EP0650657A1 Treatment of substrates