Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1995
11/07/1995US5463827 Display device
11/07/1995CA2104540C Solder paste
11/02/1995WO1995029573A1 Method of forming metallic conductive patterns on insulating substrates
11/02/1995WO1995029504A1 Self-aligning light directing surface mountable miniature incandescent lamp
11/02/1995EP0680248A1 Process for manufacturing a power electric circuit and electronic circuit obtained by this process
11/02/1995EP0680247A1 Screen-printing process for manufacturing printed circuits and arrangement for implementing the process
11/02/1995EP0680115A2 Lead wire arrangement for glass sealed wires
11/02/1995EP0680082A1 Structure and method for mounting semiconductor device and liquid crystal display device
11/02/1995EP0679914A1 Method of manufacturing a circuit board and circuit board manufactured using this method
11/02/1995EP0679706A1 Metallized polyimide film containing a hydrocarbyl tin compound
11/02/1995EP0679689A2 Moulded parts with excellent thermic stability
11/02/1995EP0679469A1 Laser transfer machining apparatus
11/02/1995EP0679128A1 Junction box having integrally formed shunt
11/02/1995DE4447466A1 Carrier elements for holding components in electrical appts.
11/02/1995DE19515159A1 Coupler for multilayer circuit with inner core
11/02/1995DE19502434A1 System und Verfahren zur inkrementalen Herstellung von Schaltungsplatinen System and method for incremental production of circuit boards
11/01/1995CN1111043A Surface assembling electronic unit
11/01/1995CN1110937A Method and device for dry fluxing of metallic surfaces before soldering or tinning
10/1995
10/31/1995US5463667 Inspection method for soldered joints using x-ray imaging and apparatus therefor
10/31/1995US5463242 Thin film circuits with high density connector
10/31/1995US5463191 Circuit board having an improved fine pitch ball grid array and method of assembly therefor
10/31/1995US5463190 Electrically conductive adhesive
10/31/1995US5462996 Thermoplastic polymer particles in liquid thermosettable resin
10/31/1995US5462897 Method for forming a thin film layer
10/31/1995US5462838 Method for manufacturing a curved surface multi-layer wiring board
10/31/1995US5462837 Method of fabricating high density printed circuit board
10/31/1995US5462773 Synchronized process for catalysis of electroless metal plating on plastic
10/31/1995US5462634 Surface-treated aluminum material and method for its surface treatment
10/31/1995US5462628 Method for bonding two surfaces together
10/31/1995US5462626 Method of bonding an external lead and a tool therefor
10/31/1995US5462599 Method and apparatus for coating board-shaped articles, especially printed circuit boards
10/31/1995US5462512 Printed circuit board working machine
10/31/1995US5462444 Electrical connector having bus bars providing circuit board retention
10/31/1995US5461775 Method for mounting electronic component on a flexible printed circuit board
10/31/1995US5461774 Apparatus and method of elastically bowing a base plate
10/26/1995WO1995028822A1 Conformal shield and method for forming same
10/26/1995WO1995028820A1 Method of manufacturing a device, by irradiating some parts of the surface of the device directly through a mask, and other parts indirectly through the mask and via a reflecting surface, thereby producing a pattern
10/26/1995WO1995028736A1 Process and device for chemically treating substrates
10/26/1995WO1995028735A2 Method of manufacturing a device whereby a support bar is provided with conductor tracks for electrically contacting a semiconductor element
10/26/1995WO1995028278A1 Composite article and method for making same
10/26/1995WO1995028249A1 Solder, solder connecting method and electronic part mounted structure
10/26/1995DE4425110C1 Aq. plating bath for electrodeposition of palladium
10/26/1995DE4417245A1 High resolution structured metallisation prodn.
10/26/1995CA2188184A1 Composite article and method for making same
10/25/1995EP0679054A2 Coding device for printed circuit boards
10/25/1995EP0679052A1 Process for structured metallizing of the surface of substrates
10/25/1995EP0679051A2 Contacting actuating and display means
10/25/1995EP0678933A1 Method of connecting two strips provided with conductor patterns, and magnetic head provided with two strips interconnected in accordance with the method
10/25/1995EP0678918A2 Multilayer printed wiring board
10/25/1995EP0678917A1 Supporting member for cooling means and electronic package using the same
10/25/1995EP0678596A1 Metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer
10/25/1995EP0678343A1 Method of depositing solid substance on a substrate
10/25/1995EP0678232A1 Plated compliant lead.
10/25/1995EP0678216A1 Electroluminescent lamp devices and their manufacture
10/25/1995EP0678124A1 Phosphating compositions and processes, particularly for use in fabrication of printed circuits utilizing organic resists
10/25/1995EP0610360B1 Process for manufacturing a printed circuit and printed circuit
10/25/1995EP0583407A4 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards
10/25/1995EP0467945B1 Printed circuit boards
10/25/1995EP0346486B1 Resin composition and solder resist resin composition
10/25/1995CN1110819A A display board having wiring with three-layered structure and a display device including the display board
10/25/1995CN1110694A A polymer composition for making single or multilayer patterns
10/24/1995US5461545 Process and device for hermetic encapsulation of electronic components
10/24/1995US5461539 Heat sensitive electronic component
10/24/1995US5461324 Split-fixture configuration and method for testing circuit traces on a flexible substrate
10/24/1995US5461256 Portable semiconductor device with resin
10/24/1995US5461203 Electronic package including lower water content polyimide film
10/24/1995US5461202 Flexible wiring board and its fabrication method
10/24/1995US5460922 Method for fabricating electrode patterns
10/24/1995US5460921 High density pattern template: materials and processes for the application of conductive pastes
10/24/1995US5460858 Reduction of concentration gradient of residual solvent
10/24/1995US5460767 Hot melt masking materials
10/24/1995US5460680 Method for manufacturing multi-layer printed board
10/24/1995US5460653 Spray type flux applying device
10/24/1995US5460531 Adaptor card with pass-through and non pass-through vias
10/24/1995US5460319 Lead, method of assembling an integrated circuit device, integrated circuit device, lead for providing a conductive path and method of providing a conductive path
10/24/1995US5460316 Stencils having enhanced wear-resistance and methods of manufacturing the same
10/24/1995US5459941 For use in printing
10/24/1995US5459923 Method of marking hermetic packages for electrical device
10/23/1995CA2147334A1 Metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer
10/23/1995CA2146594A1 Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere
10/19/1995WO1995028072A1 Sealed electronic packaging for environmental protection of active electronics
10/19/1995WO1995028017A1 Electrical lead for surface mounting of substrates
10/19/1995WO1995027924A1 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material
10/19/1995WO1995027813A1 Palladium colloid solution and use thereof
10/19/1995WO1995027808A1 Method for treating an oxidized copper film
10/19/1995WO1995027761A1 Powder composition for coatings
10/19/1995DE4414560A1 Spraying and full-area or partial application of liquids
10/19/1995DE4413077A1 Verfahren und Vorrichtung zur chemischen Behandlung von Substraten Method and device for the chemical treatment of substrates
10/19/1995DE4324210A1 Printed circuit board heat sink fixing
10/19/1995DE19509938A1 Electrical reed relay device for circuit board surface mounting
10/18/1995EP0677985A1 Method of manufacturing printed circuit boards
10/18/1995EP0677599A1 Apparatus for treatment of articles particularly for electroplating of circuit boards
10/18/1995EP0677090A1 Ink composition and method of making, using and recovering such composition
10/18/1995EP0638001A4 Ultrasonic spray coating system and method.
10/18/1995EP0591262B1 Process for producing a self-supporting thick film structure
10/18/1995EP0569528A4 Electrical connectors
10/18/1995EP0544741B1 Cyanate ester adhesives for electronic applications
10/18/1995CN2210511Y Structure improved automatic tin jet soldering machine
10/18/1995CN1110496A Annular circuit components coupled with printed circuit board through-hole
10/17/1995USRE35064 Multilayer printed wiring board
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