Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1996
03/19/1996US5499447 Method for manufacturing a printed circuit board having electrodes on end surface of substrate
03/19/1996US5499446 Method for manufacturing printed circuit board with through-hole
03/19/1996US5499444 Method of manufacturing a rigid flex printed circuit board
03/19/1996US5499442 Delay line device and method of manufacturing the same
03/19/1996CA2010128C Printed circuit board with electromagnetic interference prevention
03/14/1996WO1996008127A1 Method of fabricating electronic circuit
03/14/1996WO1996008056A1 Ball grid array socket
03/14/1996WO1996008037A1 Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture
03/14/1996WO1996008023A1 Process for contacting power current connection elements of an electric component and component produced using this process
03/14/1996WO1996007984A1 Process for producing a smart card module for contactless smart cards
03/14/1996WO1996007983A1 Support element
03/14/1996WO1996007662A1 Novel acylphosphine oxides
03/14/1996WO1996007503A1 Rosin-free, low voc, no-clean soldering flux and method using the same
03/14/1996CA2197787A1 Novel acylphosphine oxides
03/13/1996EP0701393A1 Production method for substrate having projecting portions
03/13/1996EP0701298A2 Low inductance surface-mount connectors for interconnecting circuit devices and method for using same
03/13/1996EP0701281A2 Substrate with bondable layer
03/13/1996EP0700752A1 Method of patterning a coating on a substrate
03/13/1996EP0700630A1 Foil printed circuit boards and method of producing the same
03/13/1996EP0700588A1 Connector assembly
03/13/1996EP0700409A1 Thermally cross-linkable heat-sealing adhesive
03/13/1996EP0635035A4 A high performance epoxy based laminating adhesive.
03/13/1996EP0559863A4 Method for forming solder bump interconnections to a solder-plated circuit trace
03/13/1996EP0522026B1 Solder delivery system
03/13/1996EP0452506B1 METHOD OF PRODUCING A FLEXIBLE CIRCUIT BOARD FOR MOUNTING IC's
03/13/1996EP0440822B1 Conductive pattern forming composition and method of producing the same
03/13/1996CN1118566A Panel assembly structure capable of connecting wiring line with electrode at fine pitch and integrated circuit mounting tape and manufacturing method thereof
03/13/1996CN1118382A Process for producing metal-bonded-ceramic material or components, metal-bonded-ceramic material or components produced by that method, and electronic circuit substrates fabricated from said material
03/13/1996CN1118367A Adhesive compositions and copper foils and copper clad laminates using same
03/12/1996US5499164 High impact digital crash data recorder
03/12/1996US5499131 Liquid crystal display
03/12/1996US5498906 Capacitive coupling configuration for an intergrated circuit package
03/12/1996US5498905 Layered features for co-fired module integration
03/12/1996US5498840 Transducer signal terminator
03/12/1996US5498805 High temperature flashpoint, stable cleaning composition
03/12/1996US5498765 Positive photoresist composition containing photoacid generator and use thereof
03/12/1996US5498642 Radiation surface-curable, room temperature vulcanizing silicone compositions
03/12/1996US5498575 Bonding film member and mounting method of electronic component
03/12/1996US5498467 Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom
03/12/1996US5498440 Polycarbonate, abs polymer, alkali metal hydroxide, nitric acid
03/12/1996US5498311 Process for manufacture of printed circuit boards
03/12/1996US5498301 Agent for treating surfaces of copper and copper alloys
03/12/1996US5498289 Apparatus for applying narrow metal electrode
03/12/1996US5498174 Electrical connector with spring leg retention feature
03/12/1996US5497938 Tape with solder forms and methods for transferring solder to chip assemblies
03/12/1996US5497546 Method for mounting lead terminals to circuit board
03/12/1996US5497545 Method of making electrical connections in the manufacture of wiring sheet assemblies
03/11/1996EP0719182A4 Apparatus for spray coating
03/07/1996WO1996007302A1 Device with an electric circuit
03/07/1996WO1996006737A1 Apparatus for real-time estimation of printing medium properties and method for the use thereof
03/07/1996WO1996006694A1 Surface modification processing of flat panel device substrates
03/07/1996WO1996006693A1 Photo reactive cleaning of critical surfaces in cd manufacturing
03/07/1996WO1996006692A1 Cleaning of printed circuit boards
03/07/1996DE4432402A1 Appts. for soldering circuit boards
03/07/1996DE4431605A1 Chipkartenmodul für kontaktlose Chipkarten und Verfahren zu seiner Herstellung Smart card module for contactless smart cards and process for its preparation
03/07/1996DE4431198A1 Electrical contacting method for printed circuits using insulation displacement techniques
03/07/1996DE4430798A1 Stanzgitter zur Verbindung von elektrischen Bauelementen Stamped grid for connection of electrical components
03/07/1996DE19531050A1 Structuring workpieces using excimer laser beam
03/06/1996EP0700239A1 Articles including solderable zinc surfaces
03/06/1996EP0700238A1 Copper foil for use in making printed wiring board
03/06/1996EP0700084A1 Device to fasten electronic devices to a heatsink and method of mounting to a printed circuit board
03/06/1996EP0699747A1 Detergent composition
03/06/1996EP0699746A1 Cleaning agent, cleaning method and cleaning apparatus
03/06/1996EP0699717A2 Organosiloxane compositions yielding cured products exhibiting adhesion and reduced flammability
03/06/1996EP0699526A1 Screen printing apparatus
03/06/1996EP0699354A1 Planar cable array
03/06/1996EP0699353A1 Electrical interconnect assembly
03/06/1996EP0699340A1 An electric fuse and protective circuit
03/06/1996EP0699220A1 Reworkable poly(ethylene-vinyl alcohol) adhesive for electronic applications
03/06/1996EP0390891B1 Method of forming holes in ceramic ic packages
03/06/1996CN1031236C Mounting structure of electronic elements
03/05/1996US5497495 Computer electronic system having a cover for every module
03/05/1996US5497034 IC wiring connecting method and apparatus
03/05/1996US5496971 Circuit arrangement for multilayer printed circuit board
03/05/1996US5496970 Planar cable array
03/05/1996US5496772 Multilayer element formed with vapor deposition by radiation in nitrogen atmosphere
03/05/1996US5496668 Formation of microstructures using a preformed photoresist sheet
03/05/1996US5496613 Printed wire boards and method of making same
03/05/1996US5496590 Composition for treating copper and copper alloy surfaces and method for the surface treatment
03/05/1996US5496435 Semiconductor lead frame lead stabilization
03/05/1996US5496433 Hot press for use in production of multilayered substrate
03/05/1996US5496182 Connector device for electrically interconnecting printed circuit board like members
03/05/1996US5495667 Method for forming contact pins for semiconductor dice and interconnects
03/05/1996US5495665 Process for providing a landless via connection
02/1996
02/29/1996WO1996006389A1 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit
02/29/1996WO1996006128A1 Aromatic polyamide film, process for producing the same, and magnetic recording medium and solar cell produced by using the same
02/29/1996WO1996005970A1 A printed circuit board and method of manufacture thereof
02/29/1996DE19506664A1 Electric control apparatus for vehicle IC engine electromechanical mechanism
02/29/1996CA2190458A1 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit
02/28/1996EP0699020A1 Circuit board provided with through-hole connexions
02/28/1996EP0698921A2 Layered features for co-fired module integration
02/28/1996EP0698620A1 Method for preparing modified resins and their applications
02/28/1996EP0698590A2 Metallization of ceramics through application of an adherent reducible layer
02/28/1996EP0698485A1 Laminated metal structure and method of making same
02/28/1996EP0698290A1 Power semiconductor device with stress buffer layer
02/28/1996EP0698233A1 Process and device for coating printed circuit boards
02/28/1996EP0698232A1 Process and device for coating printed circuit boards
02/28/1996EP0698132A1 Carbon compositions and processes for preparing a non-conductive substrate for electroplating
02/28/1996EP0698130A1 Palladium layers deposition process
02/28/1996EP0698129A1 Method for forming metallic films and use of the same