Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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03/19/1996 | US5499447 Method for manufacturing a printed circuit board having electrodes on end surface of substrate |
03/19/1996 | US5499446 Method for manufacturing printed circuit board with through-hole |
03/19/1996 | US5499444 Method of manufacturing a rigid flex printed circuit board |
03/19/1996 | US5499442 Delay line device and method of manufacturing the same |
03/19/1996 | CA2010128C Printed circuit board with electromagnetic interference prevention |
03/14/1996 | WO1996008127A1 Method of fabricating electronic circuit |
03/14/1996 | WO1996008056A1 Ball grid array socket |
03/14/1996 | WO1996008037A1 Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture |
03/14/1996 | WO1996008023A1 Process for contacting power current connection elements of an electric component and component produced using this process |
03/14/1996 | WO1996007984A1 Process for producing a smart card module for contactless smart cards |
03/14/1996 | WO1996007983A1 Support element |
03/14/1996 | WO1996007662A1 Novel acylphosphine oxides |
03/14/1996 | WO1996007503A1 Rosin-free, low voc, no-clean soldering flux and method using the same |
03/14/1996 | CA2197787A1 Novel acylphosphine oxides |
03/13/1996 | EP0701393A1 Production method for substrate having projecting portions |
03/13/1996 | EP0701298A2 Low inductance surface-mount connectors for interconnecting circuit devices and method for using same |
03/13/1996 | EP0701281A2 Substrate with bondable layer |
03/13/1996 | EP0700752A1 Method of patterning a coating on a substrate |
03/13/1996 | EP0700630A1 Foil printed circuit boards and method of producing the same |
03/13/1996 | EP0700588A1 Connector assembly |
03/13/1996 | EP0700409A1 Thermally cross-linkable heat-sealing adhesive |
03/13/1996 | EP0635035A4 A high performance epoxy based laminating adhesive. |
03/13/1996 | EP0559863A4 Method for forming solder bump interconnections to a solder-plated circuit trace |
03/13/1996 | EP0522026B1 Solder delivery system |
03/13/1996 | EP0452506B1 METHOD OF PRODUCING A FLEXIBLE CIRCUIT BOARD FOR MOUNTING IC's |
03/13/1996 | EP0440822B1 Conductive pattern forming composition and method of producing the same |
03/13/1996 | CN1118566A Panel assembly structure capable of connecting wiring line with electrode at fine pitch and integrated circuit mounting tape and manufacturing method thereof |
03/13/1996 | CN1118382A Process for producing metal-bonded-ceramic material or components, metal-bonded-ceramic material or components produced by that method, and electronic circuit substrates fabricated from said material |
03/13/1996 | CN1118367A Adhesive compositions and copper foils and copper clad laminates using same |
03/12/1996 | US5499164 High impact digital crash data recorder |
03/12/1996 | US5499131 Liquid crystal display |
03/12/1996 | US5498906 Capacitive coupling configuration for an intergrated circuit package |
03/12/1996 | US5498905 Layered features for co-fired module integration |
03/12/1996 | US5498840 Transducer signal terminator |
03/12/1996 | US5498805 High temperature flashpoint, stable cleaning composition |
03/12/1996 | US5498765 Positive photoresist composition containing photoacid generator and use thereof |
03/12/1996 | US5498642 Radiation surface-curable, room temperature vulcanizing silicone compositions |
03/12/1996 | US5498575 Bonding film member and mounting method of electronic component |
03/12/1996 | US5498467 Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom |
03/12/1996 | US5498440 Polycarbonate, abs polymer, alkali metal hydroxide, nitric acid |
03/12/1996 | US5498311 Process for manufacture of printed circuit boards |
03/12/1996 | US5498301 Agent for treating surfaces of copper and copper alloys |
03/12/1996 | US5498289 Apparatus for applying narrow metal electrode |
03/12/1996 | US5498174 Electrical connector with spring leg retention feature |
03/12/1996 | US5497938 Tape with solder forms and methods for transferring solder to chip assemblies |
03/12/1996 | US5497546 Method for mounting lead terminals to circuit board |
03/12/1996 | US5497545 Method of making electrical connections in the manufacture of wiring sheet assemblies |
03/11/1996 | EP0719182A4 Apparatus for spray coating |
03/07/1996 | WO1996007302A1 Device with an electric circuit |
03/07/1996 | WO1996006737A1 Apparatus for real-time estimation of printing medium properties and method for the use thereof |
03/07/1996 | WO1996006694A1 Surface modification processing of flat panel device substrates |
03/07/1996 | WO1996006693A1 Photo reactive cleaning of critical surfaces in cd manufacturing |
03/07/1996 | WO1996006692A1 Cleaning of printed circuit boards |
03/07/1996 | DE4432402A1 Appts. for soldering circuit boards |
03/07/1996 | DE4431605A1 Chipkartenmodul für kontaktlose Chipkarten und Verfahren zu seiner Herstellung Smart card module for contactless smart cards and process for its preparation |
03/07/1996 | DE4431198A1 Electrical contacting method for printed circuits using insulation displacement techniques |
03/07/1996 | DE4430798A1 Stanzgitter zur Verbindung von elektrischen Bauelementen Stamped grid for connection of electrical components |
03/07/1996 | DE19531050A1 Structuring workpieces using excimer laser beam |
03/06/1996 | EP0700239A1 Articles including solderable zinc surfaces |
03/06/1996 | EP0700238A1 Copper foil for use in making printed wiring board |
03/06/1996 | EP0700084A1 Device to fasten electronic devices to a heatsink and method of mounting to a printed circuit board |
03/06/1996 | EP0699747A1 Detergent composition |
03/06/1996 | EP0699746A1 Cleaning agent, cleaning method and cleaning apparatus |
03/06/1996 | EP0699717A2 Organosiloxane compositions yielding cured products exhibiting adhesion and reduced flammability |
03/06/1996 | EP0699526A1 Screen printing apparatus |
03/06/1996 | EP0699354A1 Planar cable array |
03/06/1996 | EP0699353A1 Electrical interconnect assembly |
03/06/1996 | EP0699340A1 An electric fuse and protective circuit |
03/06/1996 | EP0699220A1 Reworkable poly(ethylene-vinyl alcohol) adhesive for electronic applications |
03/06/1996 | EP0390891B1 Method of forming holes in ceramic ic packages |
03/06/1996 | CN1031236C Mounting structure of electronic elements |
03/05/1996 | US5497495 Computer electronic system having a cover for every module |
03/05/1996 | US5497034 IC wiring connecting method and apparatus |
03/05/1996 | US5496971 Circuit arrangement for multilayer printed circuit board |
03/05/1996 | US5496970 Planar cable array |
03/05/1996 | US5496772 Multilayer element formed with vapor deposition by radiation in nitrogen atmosphere |
03/05/1996 | US5496668 Formation of microstructures using a preformed photoresist sheet |
03/05/1996 | US5496613 Printed wire boards and method of making same |
03/05/1996 | US5496590 Composition for treating copper and copper alloy surfaces and method for the surface treatment |
03/05/1996 | US5496435 Semiconductor lead frame lead stabilization |
03/05/1996 | US5496433 Hot press for use in production of multilayered substrate |
03/05/1996 | US5496182 Connector device for electrically interconnecting printed circuit board like members |
03/05/1996 | US5495667 Method for forming contact pins for semiconductor dice and interconnects |
03/05/1996 | US5495665 Process for providing a landless via connection |
02/29/1996 | WO1996006389A1 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit |
02/29/1996 | WO1996006128A1 Aromatic polyamide film, process for producing the same, and magnetic recording medium and solar cell produced by using the same |
02/29/1996 | WO1996005970A1 A printed circuit board and method of manufacture thereof |
02/29/1996 | DE19506664A1 Electric control apparatus for vehicle IC engine electromechanical mechanism |
02/29/1996 | CA2190458A1 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit |
02/28/1996 | EP0699020A1 Circuit board provided with through-hole connexions |
02/28/1996 | EP0698921A2 Layered features for co-fired module integration |
02/28/1996 | EP0698620A1 Method for preparing modified resins and their applications |
02/28/1996 | EP0698590A2 Metallization of ceramics through application of an adherent reducible layer |
02/28/1996 | EP0698485A1 Laminated metal structure and method of making same |
02/28/1996 | EP0698290A1 Power semiconductor device with stress buffer layer |
02/28/1996 | EP0698233A1 Process and device for coating printed circuit boards |
02/28/1996 | EP0698232A1 Process and device for coating printed circuit boards |
02/28/1996 | EP0698132A1 Carbon compositions and processes for preparing a non-conductive substrate for electroplating |
02/28/1996 | EP0698130A1 Palladium layers deposition process |
02/28/1996 | EP0698129A1 Method for forming metallic films and use of the same |