| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/16/1996 | US5484688 Covering circuit with a solder stop mask |
| 01/16/1996 | US5484648 Lines of electroconductive paste, for electrode terminals, solvent-absorptive layer |
| 01/16/1996 | US5484647 Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same |
| 01/16/1996 | US5484626 Quartz crystal |
| 01/16/1996 | US5484518 Electroplating process |
| 01/16/1996 | US5484517 Method of forming multi-element thin hot film sensors on polyimide film |
| 01/16/1996 | US5484516 Resin products and process for producing the same |
| 01/16/1996 | US5483984 Fluid treatment apparatus and method |
| 01/16/1996 | US5483884 Method and apparatus for setting up a stencil printer |
| 01/16/1996 | US5483882 Screen adjustment and reset device for printing apparatus and the like |
| 01/16/1996 | US5483879 Printer system for printing circuit patterns or like on base board |
| 01/16/1996 | US5483741 Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice |
| 01/16/1996 | US5483737 Electrical shunt and tool for installing same |
| 01/16/1996 | CA2084685C Solder interconnections and methods for making same |
| 01/15/1996 | EP0698132A4 Carbon compositions and processes for preparing a non-conductive substrate for electroplating |
| 01/11/1996 | WO1996000969A1 Anisotropically conducting adhesive and process for its production |
| 01/11/1996 | WO1996000931A1 Method for preparing negative-working wash-off relief images and non-photosensitive elements for use therein |
| 01/11/1996 | WO1995023247A3 Method of electrolytically depositing metals from electrolytes containing organic additives |
| 01/11/1996 | DE4423929A1 Electrolytic gold@ plating of electronic components |
| 01/11/1996 | DE4423007A1 Generation of test program for checking solder pad data on circuit boards |
| 01/11/1996 | DE4421365A1 Inductive member with magnetic core having winding |
| 01/11/1996 | CA2170593A1 Method for preparing negative-working wash-off relief images and non-photosensitive elements for use therein |
| 01/10/1996 | EP0691802A1 Method of forming a multilayer printed circuit board and product thereof |
| 01/10/1996 | EP0691682A2 Fired body for and manufacture of a substrate |
| 01/10/1996 | EP0691660A1 Anisotropically electroconductive resin film |
| 01/10/1996 | EP0691626A2 Data carrier comprising an integrated circuit module |
| 01/10/1996 | EP0691389A1 Adhesive compositions and copper foil and copper clad laminates using same |
| 01/10/1996 | EP0691172A1 Soldering method and soldering apparatus |
| 01/10/1996 | EP0691135A1 Piston-based ventilator design and operation |
| 01/10/1996 | EP0635192A4 Circuit board connections. |
| 01/10/1996 | CN1114821A Method for-selectively metallizing a substrate |
| 01/10/1996 | CN1114820A Method of manufacturing a printed circuit board |
| 01/10/1996 | CN1114786A A flexible wiring board having a terminal array extending along a whole edge of its substrate and a connection structure of the flexible wiring board with a circuit board |
| 01/09/1996 | US5483603 System and method for automatic optical inspection |
| 01/09/1996 | US5483217 Electronic circuit device |
| 01/09/1996 | US5483101 Multilayer printed circuit board |
| 01/09/1996 | US5483100 Integrated circuit package with via interconnections formed in a substrate |
| 01/09/1996 | US5483021 Flat cable |
| 01/09/1996 | US5482818 Printed and integrated circuits, using computer to generate master reticle |
| 01/09/1996 | US5482784 Printed circuit inner-layer copper foil and process for producing the same |
| 01/09/1996 | US5482736 Coating with dielectrics and masking with apertures |
| 01/09/1996 | US5482645 Non-ozone depleting cleaning composition for degreasing and defluxing purposes |
| 01/09/1996 | US5482586 Method of manufacturing multilayer printed wiring board |
| 01/09/1996 | US5482553 System for pin-point application of a removable conformal coating |
| 01/09/1996 | US5482474 Edge-mountable circuit board connector |
| 01/09/1996 | US5482473 Flex circuit connector |
| 01/09/1996 | US5482201 Transport device and process for a vapor-phase soldering installation |
| 01/09/1996 | US5482200 Method for applying solder to a fine pitch flip chip pattern |
| 01/09/1996 | US5482198 Solder preform pick-and-place machine and operation |
| 01/09/1996 | US5482174 Method for removing copper oxide on the surface of a copper film and a method for patterning a copper film |
| 01/09/1996 | US5481894 Method for manufacturing a conductor for a flat cable |
| 01/09/1996 | US5481795 Method of manufacturing organic substrate used for printed circuits |
| 01/09/1996 | CA2105367C Connector for electrical components |
| 01/04/1996 | WO1996000494A1 Vertical interconnect process for silicon segments |
| 01/04/1996 | WO1996000492A1 Method and device for coating printed-circuit boards, in particular for the manufacture of multi-chip-modules |
| 01/04/1996 | WO1996000491A1 Metallized laminate material having ordered distribution of conductive through holes |
| 01/04/1996 | WO1996000136A1 Method and device for the soldering of circuit boards and similar articles using combined wave/reflow soldering or a special soldering technique |
| 01/04/1996 | DE4422996A1 Plasma etching of plastic, esp. high temp. plastics |
| 01/04/1996 | DE4422669A1 Multilayer circuit board design |
| 01/04/1996 | DE4422341A1 Soldering appts. for surface mounted devices |
| 01/04/1996 | DE4421996A1 Verfahren und Vorrichtung zum kombinierten Wellen- und Reflow-Löten von Leiterplatten und dergleichen Method and apparatus for combined wave and reflow soldering circuit boards and the like |
| 01/04/1996 | DE4421954A1 Method for sepg. a first liq. from a second liq. |
| 01/04/1996 | DE4421843A1 Vorrichtung und Verfahren zum Ablösen von Partikeln auf Gegenständen Apparatus and method for peeling off of particles on objects |
| 01/04/1996 | DE19523364A1 Leiterplatte Circuit board |
| 01/04/1996 | DE19508284A1 Optical transceiver for optical communication system |
| 01/04/1996 | CA2193729A1 Metallized laminate material having ordered distribution of conductive through holes |
| 01/03/1996 | EP0690530A1 Backplane assembly for connectors |
| 01/03/1996 | EP0690524A1 Assembly for connection of a backplane to the printed circuit of a subunit |
| 01/03/1996 | EP0690505A2 Sintered body for and manufacture of ceramic substrates |
| 01/03/1996 | EP0690504A1 Solder terminal and method of fabricating it |
| 01/03/1996 | EP0690500A1 Ball-grid-array integrated circuit package with solder-connected thermal conductor |
| 01/03/1996 | EP0690494A2 Connection and build-up-process for multi-chip-modules |
| 01/03/1996 | EP0690490A2 Flip chip technology using electrically conductive polymers and dielectrics |
| 01/03/1996 | EP0690461A1 Method for making devices using metallized magnetic substrates |
| 01/03/1996 | EP0690035A1 Metallization of ferrites comprising surface reduction |
| 01/03/1996 | EP0689927A1 LCP films having roughened surface and process therefor |
| 01/03/1996 | EP0689504A1 System for automatically connecting a source of electric current to laminates in a press |
| 01/03/1996 | EP0689491A1 Smd-soldering installation |
| 01/03/1996 | EP0591198B1 Method for coating a dielectric ceramic piece |
| 01/03/1996 | EP0580809B1 A system and method for manufacturing copper clad, glass fibre reinforced epoxy resin laminates |
| 01/03/1996 | EP0550432B1 Electrical connector structure and method for obtaining an electrical interconnection assembly |
| 01/03/1996 | CN1114458A Terminal and a method of forming the same |
| 01/02/1996 | US5481474 Double-sided placement of components on printed circuit board |
| 01/02/1996 | US5481437 Apparatus assembly of an electrotechnical apparatus |
| 01/02/1996 | US5481436 Multi-level assemblies and methods for interconnecting integrated circuits |
| 01/02/1996 | US5481435 Adaptor assembly for adding functionality to a pin grid receptacle on a circuit board |
| 01/02/1996 | US5481432 Electronic device having connector with rows of terminals divided by ribs and ground or power terminal adjacent ribs |
| 01/02/1996 | US5481205 Temporary connections for fast electrical access to electronic devices |
| 01/02/1996 | US5481138 Structure and a method for repairing electrical lines |
| 01/02/1996 | US5481073 Modular broadband bidirectional programmable switch system with stacked modular switch arrangement |
| 01/02/1996 | US5480957 Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation |
| 01/02/1996 | US5480841 Process of multilayer conductor chip packaging |
| 01/02/1996 | US5480839 Semiconductor device manufacturing method |
| 01/02/1996 | US5480835 Substrates with pads, photoresists patterns on substrates for integrated circuits |
| 01/02/1996 | US5480834 Process of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agent |
| 01/02/1996 | US5480730 Laminate of metal, metal oxide and second metal |
| 01/02/1996 | US5480675 Multilayer wires for printed circuits, depressurization and swinging |
| 01/02/1996 | US5480503 Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof |
| 01/02/1996 | US5480483 Apparatus for depositing solder on the terminal pads of printed circuit boards |
| 01/02/1996 | US5480309 Universal multilayer base board assembly for integrated circuits |