Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/1995
08/22/1995US5444293 Structure and method for providing a lead frame with enhanced solder wetting leads
08/22/1995US5444212 Apparatus and method for producing a printing screen
08/22/1995US5444189 Printed wiring board and production thereof
08/22/1995US5444188 Flexible circuit wiring board and method of producing the same
08/22/1995US5444187 Method of surface mounting radio frequency components and the components
08/22/1995US5444025 Process for encapsulating a semiconductor package having a heat sink using a jig
08/22/1995US5443876 Electrically conductive structured sheets
08/22/1995US5443786 Oxidation and nitriding
08/22/1995US5443672 Using photopolymerizable material
08/22/1995US5443659 Flux for soldering and solder composition comprising the same and soldering method using the same
08/22/1995US5443653 System for cleaning contaminants from small areas with minimal incontained waste
08/22/1995US5443391 Electric wire-connecting terminal
08/22/1995US5443003 Stretching frame for use in silkscreening
08/22/1995US5442852 Method of fabricating solder ball array
08/22/1995CA2142542A1 Process for the production of structures
08/22/1995CA2137861A1 Process for the production of structures
08/17/1995DE4404607A1 Method of structured electrolytic deposition of materials
08/17/1995DE4404298A1 Forming a multilayer on a substrate
08/16/1995EP0667643A1 Electromagnetic interference suppressing body having low electromagnetic transparency and reflection, and electronic device having the same
08/16/1995EP0524248A4 Solder-bearing lead
08/16/1995EP0380591B1 Fiber/resin composites, and method of making the same
08/16/1995CN1106977A Metallic foil with adhesion promoting layer
08/16/1995CN1106936A Waterborne photoresists having polysiloxanes
08/16/1995CN1106935A Waterborne photoresists having binders neutralized with amino acrylates
08/16/1995CN1106849A Agent for surface processing copper and copper alloy
08/15/1995USRE35017 Method for removing soldering flux with alkaline salts, an alkali metal silicate and anionic polymer
08/15/1995US5442521 Circuit board assembly
08/15/1995US5442519 Device including a maintenance termination unit and protector
08/15/1995US5442470 Liquid crystal device having frame member and electronic apparatus using the same
08/15/1995US5442386 Structure and method for preventing ink shorting of conductors connected to printhead
08/15/1995US5442299 Printed circuit board test fixture and method
08/15/1995US5442240 Method of adhesion to a polyimide surface by formation of covalent bonds
08/15/1995US5442239 Structure and method for corrosion and stress-resistant interconnecting metallurgy
08/15/1995US5442230 High density integrated circuit assembly combining leadframe leads with conductive traces
08/15/1995US5442144 Multilayered circuit board
08/15/1995US5442143 Core for electrical connecting substrates and electrical connecting substrates with core, as well as process for the production thereof
08/15/1995US5442142 Large-current circuit board and method therefor
08/15/1995US5442042 Surface treatment of polyamide moldings and moldings obtained thereby
08/15/1995US5441849 Reduces electrical charge accumulation caused by an exposure to charged particle beam
08/15/1995US5441845 Curable; films for protecting electronic parts
08/15/1995US5441814 Method for use of preflux, printed wiring board, and method for production thereof
08/15/1995US5441770 Conditioning process for electroless plating of polyetherimides
08/15/1995US5441629 Automatic transfer of substrate using robot that moves only in vertical or horizontal directions
08/15/1995US5441626 Partially plated resin products and partial plating process therefor
08/15/1995US5441619 Electroplating apparatus
08/15/1995US5441474 PCB working machine and method
08/15/1995US5441430 Electrical lead for surface mounting of substrates
08/15/1995US5441429 Solder-bearing land
08/15/1995US5441195 Method of stretching solder joints
08/15/1995US5441194 Thermo-compression assembly/disassembly system for electric circuit board in inert ambience
08/15/1995US5441094 Trench planarization techniques
08/15/1995US5440980 Squeegee for screen printing machine
08/15/1995US5440805 Method of manufacturing a multilayer circuit
08/15/1995CA1336702C Method of controlling flow by a radiation formed dam
08/14/1995EP0724778A4 Anodized aluminum electronic package components
08/10/1995WO1995021517A1 Structuring of printed circuit boards
08/10/1995WO1995021474A1 Printed circuit interconnection strip
08/10/1995WO1995021408A1 Flexible wearable computer
08/10/1995WO1995021030A1 Efficient chemistry for selective modification and metallization of substrates
08/10/1995WO1995018434A3 Picture display device and method of manufacturing a picture display device
08/10/1995DE4402596A1 Elektrolytisches Verfahren in horizontalen Durchlaufanlagen und Vorrichtung zur Durchführung desselben The same electrolytic process in horizontal flow systems and apparatus for carrying out
08/10/1995DE19503392A1 Electronic component e.g. oscillator prodn.
08/10/1995DE19503186A1 Chemische Reduzierungslösung für Kupferoxid Chemical reduction solution for copper
08/10/1995CA2182799A1 Flexible wearable computer
08/09/1995EP0666705A2 Electrical device employing a flat flexible circuit
08/09/1995EP0666704A1 Flexible printed circuit board and manufacturing method therefor
08/09/1995EP0666587A1 Method for electrodeposition of photosensitive resist
08/09/1995EP0666506A1 System for wet application of a dry film to a panel
08/09/1995EP0666504A1 Aqueous photoimageable liquid emulsion, photoimageable film and process of manufacture
08/09/1995EP0569509A4 Electrical connectors.
08/09/1995EP0503089B1 A fine sphere, a spherical spacer for a liquid crystal display element and a liquid crystal display element using the same
08/09/1995EP0468002A4 Autodeposition emulsion for selectively protecting metallic surfaces
08/09/1995EP0448702B1 Application specific tape automated bonding
08/09/1995EP0403631B1 Method of making high density solder bumps and a substrate socket for high density solder bumps
08/09/1995CN1106580A Anisotropic conductive film, manufacturing method and connector using the same
08/08/1995US5440649 Method of and apparatus for inspection of external appearance of a circuit substrate, and for displaying abnormality information thereof
08/08/1995US5440454 Electrical connecting device and method for making same
08/08/1995US5440452 Surface mount components and semifinished products thereof
08/08/1995US5440240 Z-axis interconnect for discrete die burn-in for nonpackaged die
08/08/1995US5440169 Resin-packaged semiconductor device with flow prevention dimples
08/08/1995US5440075 Two-sided printed circuit board a multi-layered printed circuit board
08/08/1995US5439845 Process for fabricating layered superlattice materials and making electronic devices including same
08/08/1995US5439783 Consists of cupric complex of azole compound, an organic acid, a difficultly volatile complexing agent and water; used for surface treatment by oxidative etching
08/08/1995US5439732 Ceramic multi-layer wiring board
08/08/1995US5439636 Large ceramic articles and method of manufacturing
08/08/1995US5439398 Transistor mounting clamp assembly
08/08/1995US5439164 Methods for joining copper or its alloys
08/08/1995US5439162 Direct chip attachment structure and method
08/08/1995US5439160 Method and apparatus for obtaining reflow oven settings for soldering a PCB
08/08/1995US5438751 Using developer with a chlorine-free organic solvent
08/08/1995US5438749 Method of making a flex circuit interconnect for a microprocessor emulator and a method of testing
08/08/1995CA2041489C Lamp socket for use with a printed circuit board
08/03/1995WO1995020820A1 Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors
08/03/1995WO1995020692A1 Process and device for the electrolytic metal coating or etching of articles
08/03/1995WO1995020689A1 Method for metallising plastics, and resulting products
08/03/1995WO1995020479A1 Method of making a ud crossply pwb laminate having one or more inner layers of metal
08/03/1995WO1995020475A1 A method of making a composite laminate and a pwb substrate so made
08/03/1995WO1995020460A1 Solder paste utilizing aromatic carboxylic acids
08/03/1995WO1995020456A1 Soldering apparatus
08/03/1995DE4415200C1 Computer component assembly