Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/1996
02/28/1996EP0686093A4 Metal on plastic films with adhesion-promoting layer
02/28/1996EP0606216B1 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
02/28/1996EP0556184B1 Circuit board with electrical components, in particular surface-mounted devices
02/28/1996EP0453483B1 Non-toxic, non-flammable cleaner for printed board cleaning
02/28/1996CN1117716A Method and machine for cleaning components
02/28/1996CN1117659A Solderless flexible circuit carrier to printed circuit board interconnection
02/28/1996CN1117655A Electroplated solder terminal
02/28/1996CN1117565A Gas injection apparatus and process to form a controlled atmosphere in a confined space
02/28/1996CN1117531A Liquid for corroding copper and copper alloy
02/28/1996CN1117442A Transfer manufacture
02/28/1996CN1117441A Diffusion patterning process and screen therefor
02/27/1996US5495397 Three dimensional package and architecture for high performance computer
02/27/1996US5495395 Face-mounting type module substrate attached to base substrate face to face
02/27/1996US5495279 Method and apparatus for exposure of substrates
02/27/1996US5495223 Hybrid integrated circuit device
02/27/1996US5495179 Carrier having interchangeable substrate used for testing of semiconductor dies
02/27/1996US5495089 Laser soldering surface mount components of a printed circuit board
02/27/1996US5494856 Apparatus and method for creating detachable solder connections
02/27/1996US5494781 Forming circuit pattern on surface of planar or three-dimensional cubiform insulating substrate
02/27/1996US5494780 Accurately forming circuit patterns of electroconductive materials on three-dimensiuonal molded substrates
02/27/1996US5494764 Providing metal conductive layer on both sides of dielectric substrate and on through-hole inner walls, electrodepositing photoconductive layer, forming toner image by electrographic reversal development, decoating, etching exposed metal layer
02/27/1996US5494730 Electrically conductive pressure-sensitive adhesive tape
02/27/1996US5494529 Treatment method for cleaning and drying printed circuit boards and the like
02/27/1996US5494180 Hybrid resistance cards and methods for manufacturing same
02/27/1996US5493969 Screen printing apparatus and screen printing method
02/27/1996US5493769 Method of manufacturing electronic component and measuring characteristics of same
02/24/1996CA2130742A1 Hearing instrument hybrids incorporating edge metallization
02/22/1996WO1996005713A1 Solder pad for printed circuit boards
02/22/1996WO1996005640A1 Electric power distribution system
02/22/1996DE4434917C1 Selective application of adhesive to a substrate surface
02/22/1996DE4429514A1 Holder for light-guides or conductors fixed to PCB
02/22/1996DE4429141A1 Contact plate with plane of sepn. at right angles to contacts e.g. for electrical switch
02/22/1996DE4428126A1 Opto-electronic component for connection e.g. as signal converter to electronic circuit
02/21/1996EP0697805A1 Printed circuit board manufacture utilizing electroless palladium
02/21/1996EP0697727A2 Method of bumping substrates
02/21/1996EP0697724A1 Process for the production of a base board for printed wiring boards
02/21/1996EP0697721A2 Selective addition of a solder ball to an array of solder balls
02/21/1996EP0654170B1 Thermal cut-out and process for activating it
02/21/1996EP0563257B1 A method of cloning printed wiring boards
02/21/1996CN1117257A Spacer for light emitting deode
02/21/1996CN1117211A Structure and process for electro/mechanical joint formation
02/21/1996CN1117090A Agent for surface processing of copper and copper alloy
02/20/1996US5493594 Method and apparatus for inspection of solder joints by x-ray fluoroscopic imaging
02/20/1996US5493476 Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends
02/20/1996US5493263 Microstrip which is able to supply DC bias current
02/20/1996US5493259 High voltage, low pass filtering connector with multiple ground planes
02/20/1996US5493096 Thin substrate micro-via interconnect
02/20/1996US5493077 Printed wiring board having a blind via
02/20/1996US5493076 Structure for repairing semiconductor substrates
02/20/1996US5493075 Fine pitch solder formation on printed circuit board process and product
02/20/1996US5493074 Flexible printed circuit board comprising conductive circuits, an adhesive layer and cured films
02/20/1996US5492994 Adhesion additives and curable organosiloxane compositions containing same
02/20/1996US5492722 Process and apparatus for resin impregnation of a fibrous substrate
02/20/1996US5492653 Aqueous silver composition
02/20/1996US5492645 Stable degreaser without corrosion
02/20/1996US5492613 Process for electroless plating a metal on non-conductive materials
02/20/1996US5492595 Reducing oxide whiskers on surface with acidic reducing solution containing thiosulfate, rinsing; good adhesion to resin
02/20/1996US5492490 Insert mounting and method for inserting and mounting components in printed wiring board holes
02/20/1996US5492479 Electrical connector organizer and board stiffener apparatus
02/20/1996US5492478 Communications system
02/20/1996US5492477 Miniature lamp holder
02/20/1996US5492266 Fine pitch solder deposits on printed circuit board process and product
02/20/1996US5492265 Method for soldering printed-circuit boards under low pressure
02/20/1996US5492138 Pressure controlled cleaning system
02/20/1996US5491890 Method of mounting electronic components on a circuit board
02/20/1996US5491871 Solder paste and conductive ink printing stencil cleaner
02/15/1996WO1996004773A1 Rigid flex printed circuit board
02/15/1996WO1996004095A1 Soldering apparatus
02/15/1996WO1995035585A3 Surface mountable substrate edge terminal
02/15/1996WO1995024730A3 Apparatus having inner layers supporting surface-mount components
02/15/1996DE19529671A1 Framework construction for fixing circuit boards in television or video recorders
02/14/1996EP0696880A2 Plastic housing having a vibration damped mounting of a bondable element
02/14/1996EP0696651A1 Etching solution for copper or copper alloy
02/14/1996EP0696637A2 Octamethyltrisiloxane containing azeotropes
02/14/1996EP0696614A1 Material for the preparation of electrically conductive compounds in thermoplastic molded bodies
02/14/1996EP0696490A1 Selective removal of a single solder ball from an array of solder balls
02/14/1996EP0696411A1 Improvements relating to component mounting arrangements
02/14/1996EP0696410A1 Process for throughplating printed circuit boards using conductive plastics for direct plating
02/14/1996EP0696409A1 Process for producing printed circuit boards
02/14/1996EP0696240A1 Process and apparatus for the wave soldering of circuit boards
02/14/1996EP0504314B1 Polymeric compositions crosslinked with bistriazene compounds
02/14/1996CN1116772A Design of high density structures with laser etch stop
02/13/1996US5491651 Flexible wearable computer
02/13/1996US5491614 Control device and method of making the same
02/13/1996US5491597 Gimbal flexure and electrical interconnect assembly
02/13/1996US5491364 Reduced stress terminal pattern for integrated circuit devices and packages
02/13/1996US5491303 Surface mount interposer
02/13/1996US5491302 Microelectronic bonding with lead motion
02/13/1996US5490965 Method for closing holes in ceramic substrates
02/13/1996US5490895 Coating board with adhesive mixture of polybutadiene, epoxy novolak resin, and alumina, placing aluminum sheet in contact with the surface, curing
02/12/1996CA2150406A1 Octamethyltrisiloxane containing azeotropes
02/11/1996CA2118257A1 Screen printing apparatus
02/08/1996WO1996003851A1 Microridge abrasion for selective metalization
02/08/1996WO1996003771A1 Method of manufacturing a composite structure for use in electronic devices and structure, manufactured by said method
02/08/1996WO1996003757A1 Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom
02/08/1996DE19527595A1 Electronic card with printed circuits e.g. for vehicle instrument panel
02/08/1996DE19519856A1 Verfahren und Vorrichtung zum Abtrennen eines Films Method and apparatus for separating a film
02/07/1996EP0696159A1 Printed wiring board
02/07/1996EP0696092A2 Arrangement for fixing connector
02/07/1996EP0696078A1 Microwave oscillator and its manufacturing method