| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/07/1996 | EP0696074A1 Terminal collector for contracting a battery for power supply to electronic circuitery, electronic circuitery and remote control transmitter incorporating the same |
| 02/07/1996 | EP0695631A1 Process for forming opencentered multilayer ceramic substrates |
| 02/07/1996 | EP0695249A1 Electro-hydraulic pressure regulating device |
| 02/07/1996 | CN1116253A Method of coating a copper film on a ceramic substrate |
| 02/06/1996 | US5490040 Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array |
| 02/06/1996 | US5489808 Electric circuit substrate apparatus |
| 02/06/1996 | US5489804 Flexible preformed planar structures for interposing between a chip and a substrate |
| 02/06/1996 | US5489803 Solder-bonded structure |
| 02/06/1996 | US5489752 Process for dissipating heat from a semiconductor package |
| 02/06/1996 | US5489750 Method of mounting an electronic part with bumps on a circuit board |
| 02/06/1996 | US5489749 Semiconductor connection components and method with releasable lead support |
| 02/06/1996 | US5489551 Method of fabricating thin film circuits with high density circuit interconnects by pyrolosis of an adhesive |
| 02/06/1996 | US5489500 Flexible strip structure for a parallel processor and method of fabricating the flexible strip |
| 02/06/1996 | US5489355 Method for producing glittering decorative boards |
| 02/06/1996 | US5488765 Method of measuring characteristics of a multilayer electronic component |
| 02/06/1996 | CA2091909C Fluid treatment apparatus and method |
| 02/06/1996 | CA2017743C Ultra-tall indium or alloy bump array for ir detector hybrids and micro-electronics |
| 02/06/1996 | CA2000301C Copper doped low melt solder for component assembly and rework |
| 02/01/1996 | WO1996003021A1 Removable computer peripheral cards having a solid one-piece housing and method of manufacturing the same |
| 02/01/1996 | WO1996002959A1 Electrical connections with deformable contacts |
| 02/01/1996 | WO1996002958A1 Assembly of shielded connectors and a board having plated holes |
| 02/01/1996 | WO1996002955A1 Process for producing an electrically conductive connection |
| 02/01/1996 | WO1996002939A1 Method of introducing material in holes |
| 02/01/1996 | WO1996002938A1 Filling holes and the like in substrates |
| 02/01/1996 | WO1996002922A2 Variable voltage protection structures and methods for making same |
| 02/01/1996 | WO1996002848A1 Three axis packaging |
| 02/01/1996 | WO1996002579A1 Radiation- and/or moisture-curable silicone compositions |
| 02/01/1996 | WO1996002351A1 Ultraviolet laser system and method for forming vias in multi-layered targets |
| 02/01/1996 | DE4427112A1 Circuit board arrangement with aluminium base for power electronics |
| 02/01/1996 | DE4426955A1 Clamp device for fixing the screening of control lines, bus lines and signal lines |
| 02/01/1996 | DE4426350A1 Integrated switch system with injection-moulded plastic body for vehicle internal light |
| 02/01/1996 | CA2194968A1 Variable voltage protection structures and methods for making same |
| 02/01/1996 | CA2192859A1 Radiation- and/or moisture-curable silicone compositions |
| 02/01/1996 | CA2171092A1 Filling holes and the like in substrates |
| 01/31/1996 | EP0694996A1 Selectively metallized plastic hold-down connector |
| 01/31/1996 | EP0694927A1 Flat cable with conductor ends connectable to connector |
| 01/31/1996 | EP0694220A1 Solder-bearing lead |
| 01/31/1996 | EP0623152B1 An energy-polymerizable adhesive, coating, film and process for making the same |
| 01/31/1996 | CN1115899A Semiconductor equipment with multi-layered coductor configuration |
| 01/30/1996 | US5488542 MCM manufactured by using thin film multilevel interconnection technique |
| 01/30/1996 | US5488540 Printed circuit board for reducing noise |
| 01/30/1996 | US5488539 Protecting cot packaged ICs during wave solder operations |
| 01/30/1996 | US5488394 Print head and method of making same |
| 01/30/1996 | US5487999 Method for fabricating a penetration limited contact having a rough textured surface |
| 01/30/1996 | US5487852 Polyamides, polyester ethers or polyimides for sheets |
| 01/30/1996 | US5487218 Method for making printed circuit boards with selectivity filled plated through holes |
| 01/30/1996 | US5487211 Method for fabricating a surface-mountable crystal resonator |
| 01/30/1996 | CA2103328C Electronic circuit board arrangements |
| 01/30/1996 | CA2057103C Electrically conductive circuit sheet and method and apparatus for making same |
| 01/25/1996 | WO1996002068A1 Microelectronic mounting with multiple lead deformation |
| 01/25/1996 | WO1996001743A1 Stencil for depositing and portioning variously thick spot layers of a viscous material |
| 01/25/1996 | WO1996001605A1 Sheets with high temperature stable protective coating |
| 01/25/1996 | DE19526511A1 PCB mounting applications of an encapsulated semiconductor package |
| 01/25/1996 | DE19517062A1 Anisotrop leitender Kleber und Verfahren zur Herstellung eines anisotrop leitenden Klebers An anisotropically conductive adhesive and process for producing an anisotropically conductive adhesive |
| 01/24/1996 | EP0693797A2 Pad on type contact interconnection technology for electronic apparatus |
| 01/24/1996 | EP0693796A1 Connector provided with metal strips as contact members, connector assembly comprising such a connector |
| 01/24/1996 | EP0693755A1 PTC device |
| 01/24/1996 | EP0693736A2 Board for IC card and manufacturing method therefor |
| 01/24/1996 | EP0693138A1 Method for metallising plastics, and resulting products |
| 01/24/1996 | CN1115563A Core elements assembly and method for production and assembling same |
| 01/24/1996 | CN1115562A Electromagnetic interference supressing body having low electromagnetic transparency and reflection, and electronic device having the same |
| 01/24/1996 | CN1115485A Anisotropically electroconductive resin film |
| 01/24/1996 | CN1115329A Epoxy adhesives and copper foils and copper clad laminates using same |
| 01/23/1996 | US5486941 Fine sphere, a spherical spacer for a liquid crystal display element and a liquid display element using the same |
| 01/23/1996 | US5486723 Packaged integrated circuit add-on card |
| 01/23/1996 | US5486657 Beveled edge circuit board with channeled connector pads |
| 01/23/1996 | US5486656 Printed circuit board having an extra plate connected to a product portion |
| 01/23/1996 | US5486655 Multiple wire adhesive on a multiple wire wiring board |
| 01/23/1996 | US5486427 Patterned array of uniform metal microbeads |
| 01/23/1996 | US5486314 Cleaning agent containing glycol ethers |
| 01/23/1996 | US5486258 Method for bonding substrates with silicone rubber comprising both a thermal and moisture crosslinking component |
| 01/23/1996 | US5486257 Method for bonding substrates with silicone rubber comprising both a thermal and moisture crosslinking component |
| 01/23/1996 | CA2031459C Surface structure of ceramics substrate and method of manufacturing the same |
| 01/23/1996 | CA1337979C Method of making electrically conductive patterns |
| 01/21/1996 | CA2147107A1 Ptc device |
| 01/18/1996 | WO1996001507A1 Resilient or depassivating electrical contact device without temperature rise |
| 01/18/1996 | WO1996001498A1 Integrated circuit device |
| 01/18/1996 | DE4437848C1 Appts. for continuously electroplating plane workpieces |
| 01/18/1996 | DE4432191C1 Verfahren zum Anschweißen von Bauteilanschlüssen an die Kontakte einer Leiterplatte und unter Anwendung dieses Verfahrens hergestellte Baugruppe Method for welding of component connections to the contacts of a circuit board and using this method produced assembly |
| 01/18/1996 | DE4425260A1 Process and equipment for soldering at least one soldering point on a component |
| 01/18/1996 | DE4424984A1 Flexible circuit board for SMD components |
| 01/18/1996 | DE4424831A1 Verfahren zur Herstellung einer elektrisch leitenden Verbindung A process for producing an electrically conductive connection |
| 01/17/1996 | EP0692841A1 Assembly of shielded connectors and a board having plated holes |
| 01/17/1996 | EP0692823A1 Ball grid array package for an integated circuit |
| 01/17/1996 | EP0692805A1 Electric relay |
| 01/17/1996 | EP0692178A1 Structuring of printed circuit boards |
| 01/17/1996 | EP0692149A1 Electrical connector |
| 01/17/1996 | EP0692137A1 Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors |
| 01/17/1996 | EP0692021A1 Microemulsion and emulsion cleaning compositions |
| 01/17/1996 | CN1030739C Autodeposition emulsion and method of using thereof to selectively protect metallic surfaces |
| 01/17/1996 | CN1030695C Solder precipitating composition and method of precipitating solder |
| 01/16/1996 | US5485352 Element joining pad for semiconductor device mounting board |
| 01/16/1996 | US5485337 Thin film magnetic head structure and method of fabricating the same for accurately locating and connecting terminals to terminal connections |
| 01/16/1996 | US5485081 Test point reduction system for a printed circuit board test system |
| 01/16/1996 | US5485038 Microelectronic circuit substrate structure including photoimageable epoxy dielectric layers |
| 01/16/1996 | US5484979 Coating of an ester of a polyhydroxy compound |
| 01/16/1996 | US5484965 Circuit board adapted to receive a single in-line package module |
| 01/16/1996 | US5484964 Surface mounting pin grid arrays |
| 01/16/1996 | US5484963 Ceramic substrate provided with metallized layers for connection with chip, circuit board, or the like |
| 01/16/1996 | US5484962 Electrical device provided with three terminals |