Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
---|
07/13/1995 | WO1995018965A1 Measuring probe |
07/13/1995 | WO1995018777A1 Electrically conductive connection |
07/13/1995 | DE4406418C1 Anisotropically conductive adhesive |
07/12/1995 | EP0662732A1 Circuit connection in an electrical assembly |
07/12/1995 | EP0662713A2 Minimal capture pads applied to ceramic vias in ceramic subtrates |
07/12/1995 | EP0662636A2 Method of forming images |
07/12/1995 | EP0662614A2 Printed circuit board test fixture and method |
07/12/1995 | EP0662256A1 An electrical connecting structure and a method for electrically connecting terminals to each other |
07/12/1995 | EP0662019A1 Method for making a ceramic metal composite |
07/12/1995 | EP0528874B1 Dispersion-based heat-seal coating |
07/12/1995 | EP0389619B1 Method of making a curved plastic body with circuit pattern |
07/12/1995 | EP0362404B1 Method of producing laminated ceramic electronic parts |
07/12/1995 | CN2203522Y Hanger moving printed circuit board soldering machine |
07/12/1995 | CN1105135A Hot pluggable motherboard bus connector method |
07/11/1995 | US5432680 Electronic assembly including lead terminals spaced apart in two different modes |
07/11/1995 | US5432676 Electronic apparatus case with wiring member embedded in a molded plastic hinge |
07/11/1995 | US5432626 Liquid crystal display device with shield casing connected to frame holding the display above lower casing holding light source |
07/11/1995 | US5432486 Capacitive and inductive coupling connector |
07/11/1995 | US5432485 Circuit for crossing strip lines |
07/11/1995 | US5432303 Polysiloxanes |
07/11/1995 | US5431987 Noise filter |
07/11/1995 | US5431959 Process for the activation of nickel - phosphorous surfaces |
07/11/1995 | US5431863 Method of mounting semiconductor device |
07/11/1995 | US5431847 Aqueous cleaning concentrates |
07/11/1995 | US5431805 Composition for forming controlled tin-lead solder alloy composition |
07/11/1995 | US5431803 Electrodeposited copper foil and process for making same |
07/11/1995 | US5431776 Copper etchant solution additives |
07/11/1995 | US5431774 Copper etching |
07/11/1995 | US5431745 Solder suspension for the application of thin layers of solder to substrates |
07/11/1995 | US5431739 Acryl alcohol |
07/11/1995 | US5431721 Ink varnish and composition and method of making the same |
07/11/1995 | US5431571 Electrical conductive polymer matrix |
07/11/1995 | US5431332 Method and apparatus for solder sphere placement using an air knife |
07/11/1995 | US5431328 Method for forming a bonded structure |
07/11/1995 | US5430933 Method of manufacturing a multiple layer printed circuit board |
07/11/1995 | CA1336273C Desmear and etchback of printed circuit boards using an nf_/o_ plasma gas mixture |
07/11/1995 | CA1336249C Procedure for the deposition of firmly adhering silver films |
07/11/1995 | CA1336248C Compressible temporary support for transfer layer |
07/06/1995 | WO1995018522A1 Printed wiring board |
07/06/1995 | WO1995018476A1 Electrically conductive structured sheets |
07/06/1995 | WO1995018474A1 Surface cover for an electric coupling unit and a method for applying said surface cover |
07/06/1995 | WO1995018434A2 Picture display device and method of manufacturing a picture display device |
07/06/1995 | WO1995018001A1 Process for resin impregnation of a porous web |
07/06/1995 | WO1995018000A1 Process and apparatus for resin impregnation of a porous web |
07/06/1995 | WO1995017999A1 Process and apparatus for resin impregnation of a porous web |
07/06/1995 | DE4405228C1 Printed circuit with rigid and flexible regions |
07/06/1995 | DE4400098A1 Membrane switch and method for making membrane switch |
07/06/1995 | CA2180133A1 Process for resin impregnation of a porous web |
07/06/1995 | CA2180132A1 Process and apparatus for resin impregnation of a porous web |
07/06/1995 | CA2180131A1 Process and apparatus for resin impregnation of a porous web |
07/05/1995 | EP0661914A2 Board center registration for solder paste deposition |
07/05/1995 | EP0661778A2 Method and apparatus for providing electrical power to electronic devices enclosed in a chip carrier |
07/05/1995 | EP0661734A2 Method of forming via holes in an insulation film and method of cutting the insulation film |
07/05/1995 | EP0660805A1 Method of cleaning waste water and recovery of contaminants therefrom |
07/05/1995 | EP0660762A1 Oil based composition clean up method and composition for use therein |
07/05/1995 | EP0590046A4 Mildly basic accelerating solutions for direct electroplating. |
07/05/1995 | EP0308518B1 Ink receiving flexible sheet for printing a pattern on an object by firing and label comprising said sheet |
07/05/1995 | CN2203020Y Regional type circuit plate wicking machine |
07/05/1995 | CN1104829A Screen press |
07/05/1995 | CN1104669A Copper foil with adhesive layer |
07/05/1995 | CN1029274C Multichip module and integrated circuit substrates having planarized patterned surfaces |
07/04/1995 | US5430614 Electrical interconnect using particle enhanced joining of metal surfaces |
07/04/1995 | US5430330 Semiconductor device, resin for sealing same and method of fabricating same |
07/04/1995 | US5430326 Semiconductor device for mounting on a printed wiring board |
07/04/1995 | US5429994 Wiring forming method, wiring restoring method and wiring pattern changing method |
07/04/1995 | US5429861 Electroless copper deposited on a printed circuit board capable of withstanding thermal cycling |
07/04/1995 | US5429859 LTCC alignment marks for mechanical parts placement |
07/04/1995 | US5429738 Method for forming printed circuits by elctroplating |
07/04/1995 | US5429709 Method of manufacturing polyimide multilayer printed wiring boards |
07/04/1995 | US5429701 Method of electrically interconnecting conductors |
07/04/1995 | US5429293 Soldering process |
07/04/1995 | US5429292 Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties |
07/04/1995 | CA2053274C Snap fit contact assembly |
07/01/1995 | CA2139278A1 Staining inhibitor for photopolymerizable compositions |
06/30/1995 | CA2139206A1 Sensitivity photoresist compositions |
06/29/1995 | DE4443372A1 Solder flux compsn. for soldering electronic elements |
06/29/1995 | DE4420527A1 Connection system to contact pin terminal components on PCB |
06/29/1995 | DE4420525A1 Connection system for contacting components with fine pitch patterning on PCB |
06/29/1995 | DE4415928A1 Activating printed solder paste |
06/29/1995 | DE4343843A1 Structured metallisation prodn. on substrate surface |
06/28/1995 | EP0660651A1 Multilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrate |
06/28/1995 | EP0660650A1 Printed circuit board having improved solder drainage pads |
06/28/1995 | EP0660649A2 Mounting structure for electronic component |
06/28/1995 | EP0660443A1 Electrical connector with improved retention feature |
06/28/1995 | EP0660407A1 Adhesive for semiconductor device and reinforcing material using the same |
06/28/1995 | EP0660405A2 Surface mount chip package |
06/28/1995 | EP0660404A2 Element joining pad for semiconductor device mounting board |
06/28/1995 | EP0660399A2 Ball-grid-array integrated circuit package with thermal conductivity |
06/28/1995 | EP0660384A1 Method for electrodeposition of solder |
06/28/1995 | EP0660382A2 Hybrid circuits and a method of manufacture |
06/28/1995 | EP0659800A1 Polyimide precursor composition, polyimide composition and process for the production of said polyimide composition |
06/28/1995 | EP0659515A1 Gas injection device and process for forming a controlled atmosphere in a confined space |
06/28/1995 | EP0659287A1 Image-transfer process. |
06/28/1995 | EP0480016B1 Solder flux applicator |
06/28/1995 | CN1104405A Method and apparatus for aligning and attaching a surface mount component |
06/28/1995 | CN1104404A Circuit elements and manufacture of same |
06/28/1995 | CN1104329A Apparatus and method for detecting out appearance of electronic elements |
06/27/1995 | US5428506 Circuit board EMI suppressor including a lossy dielectric layer |
06/27/1995 | US5428505 Printed circuit board |
06/27/1995 | US5428499 Printed circuit board having integrated decoupling capacitive core with discrete elements |