Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/1995
07/13/1995WO1995018965A1 Measuring probe
07/13/1995WO1995018777A1 Electrically conductive connection
07/13/1995DE4406418C1 Anisotropically conductive adhesive
07/12/1995EP0662732A1 Circuit connection in an electrical assembly
07/12/1995EP0662713A2 Minimal capture pads applied to ceramic vias in ceramic subtrates
07/12/1995EP0662636A2 Method of forming images
07/12/1995EP0662614A2 Printed circuit board test fixture and method
07/12/1995EP0662256A1 An electrical connecting structure and a method for electrically connecting terminals to each other
07/12/1995EP0662019A1 Method for making a ceramic metal composite
07/12/1995EP0528874B1 Dispersion-based heat-seal coating
07/12/1995EP0389619B1 Method of making a curved plastic body with circuit pattern
07/12/1995EP0362404B1 Method of producing laminated ceramic electronic parts
07/12/1995CN2203522Y Hanger moving printed circuit board soldering machine
07/12/1995CN1105135A Hot pluggable motherboard bus connector method
07/11/1995US5432680 Electronic assembly including lead terminals spaced apart in two different modes
07/11/1995US5432676 Electronic apparatus case with wiring member embedded in a molded plastic hinge
07/11/1995US5432626 Liquid crystal display device with shield casing connected to frame holding the display above lower casing holding light source
07/11/1995US5432486 Capacitive and inductive coupling connector
07/11/1995US5432485 Circuit for crossing strip lines
07/11/1995US5432303 Polysiloxanes
07/11/1995US5431987 Noise filter
07/11/1995US5431959 Process for the activation of nickel - phosphorous surfaces
07/11/1995US5431863 Method of mounting semiconductor device
07/11/1995US5431847 Aqueous cleaning concentrates
07/11/1995US5431805 Composition for forming controlled tin-lead solder alloy composition
07/11/1995US5431803 Electrodeposited copper foil and process for making same
07/11/1995US5431776 Copper etchant solution additives
07/11/1995US5431774 Copper etching
07/11/1995US5431745 Solder suspension for the application of thin layers of solder to substrates
07/11/1995US5431739 Acryl alcohol
07/11/1995US5431721 Ink varnish and composition and method of making the same
07/11/1995US5431571 Electrical conductive polymer matrix
07/11/1995US5431332 Method and apparatus for solder sphere placement using an air knife
07/11/1995US5431328 Method for forming a bonded structure
07/11/1995US5430933 Method of manufacturing a multiple layer printed circuit board
07/11/1995CA1336273C Desmear and etchback of printed circuit boards using an nf_/o_ plasma gas mixture
07/11/1995CA1336249C Procedure for the deposition of firmly adhering silver films
07/11/1995CA1336248C Compressible temporary support for transfer layer
07/06/1995WO1995018522A1 Printed wiring board
07/06/1995WO1995018476A1 Electrically conductive structured sheets
07/06/1995WO1995018474A1 Surface cover for an electric coupling unit and a method for applying said surface cover
07/06/1995WO1995018434A2 Picture display device and method of manufacturing a picture display device
07/06/1995WO1995018001A1 Process for resin impregnation of a porous web
07/06/1995WO1995018000A1 Process and apparatus for resin impregnation of a porous web
07/06/1995WO1995017999A1 Process and apparatus for resin impregnation of a porous web
07/06/1995DE4405228C1 Printed circuit with rigid and flexible regions
07/06/1995DE4400098A1 Membrane switch and method for making membrane switch
07/06/1995CA2180133A1 Process for resin impregnation of a porous web
07/06/1995CA2180132A1 Process and apparatus for resin impregnation of a porous web
07/06/1995CA2180131A1 Process and apparatus for resin impregnation of a porous web
07/05/1995EP0661914A2 Board center registration for solder paste deposition
07/05/1995EP0661778A2 Method and apparatus for providing electrical power to electronic devices enclosed in a chip carrier
07/05/1995EP0661734A2 Method of forming via holes in an insulation film and method of cutting the insulation film
07/05/1995EP0660805A1 Method of cleaning waste water and recovery of contaminants therefrom
07/05/1995EP0660762A1 Oil based composition clean up method and composition for use therein
07/05/1995EP0590046A4 Mildly basic accelerating solutions for direct electroplating.
07/05/1995EP0308518B1 Ink receiving flexible sheet for printing a pattern on an object by firing and label comprising said sheet
07/05/1995CN2203020Y Regional type circuit plate wicking machine
07/05/1995CN1104829A Screen press
07/05/1995CN1104669A Copper foil with adhesive layer
07/05/1995CN1029274C Multichip module and integrated circuit substrates having planarized patterned surfaces
07/04/1995US5430614 Electrical interconnect using particle enhanced joining of metal surfaces
07/04/1995US5430330 Semiconductor device, resin for sealing same and method of fabricating same
07/04/1995US5430326 Semiconductor device for mounting on a printed wiring board
07/04/1995US5429994 Wiring forming method, wiring restoring method and wiring pattern changing method
07/04/1995US5429861 Electroless copper deposited on a printed circuit board capable of withstanding thermal cycling
07/04/1995US5429859 LTCC alignment marks for mechanical parts placement
07/04/1995US5429738 Method for forming printed circuits by elctroplating
07/04/1995US5429709 Method of manufacturing polyimide multilayer printed wiring boards
07/04/1995US5429701 Method of electrically interconnecting conductors
07/04/1995US5429293 Soldering process
07/04/1995US5429292 Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
07/04/1995CA2053274C Snap fit contact assembly
07/01/1995CA2139278A1 Staining inhibitor for photopolymerizable compositions
06/1995
06/30/1995CA2139206A1 Sensitivity photoresist compositions
06/29/1995DE4443372A1 Solder flux compsn. for soldering electronic elements
06/29/1995DE4420527A1 Connection system to contact pin terminal components on PCB
06/29/1995DE4420525A1 Connection system for contacting components with fine pitch patterning on PCB
06/29/1995DE4415928A1 Activating printed solder paste
06/29/1995DE4343843A1 Structured metallisation prodn. on substrate surface
06/28/1995EP0660651A1 Multilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrate
06/28/1995EP0660650A1 Printed circuit board having improved solder drainage pads
06/28/1995EP0660649A2 Mounting structure for electronic component
06/28/1995EP0660443A1 Electrical connector with improved retention feature
06/28/1995EP0660407A1 Adhesive for semiconductor device and reinforcing material using the same
06/28/1995EP0660405A2 Surface mount chip package
06/28/1995EP0660404A2 Element joining pad for semiconductor device mounting board
06/28/1995EP0660399A2 Ball-grid-array integrated circuit package with thermal conductivity
06/28/1995EP0660384A1 Method for electrodeposition of solder
06/28/1995EP0660382A2 Hybrid circuits and a method of manufacture
06/28/1995EP0659800A1 Polyimide precursor composition, polyimide composition and process for the production of said polyimide composition
06/28/1995EP0659515A1 Gas injection device and process for forming a controlled atmosphere in a confined space
06/28/1995EP0659287A1 Image-transfer process.
06/28/1995EP0480016B1 Solder flux applicator
06/28/1995CN1104405A Method and apparatus for aligning and attaching a surface mount component
06/28/1995CN1104404A Circuit elements and manufacture of same
06/28/1995CN1104329A Apparatus and method for detecting out appearance of electronic elements
06/27/1995US5428506 Circuit board EMI suppressor including a lossy dielectric layer
06/27/1995US5428505 Printed circuit board
06/27/1995US5428499 Printed circuit board having integrated decoupling capacitive core with discrete elements