Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1995
03/29/1995EP0645074A1 Method of making a printed circuit board
03/29/1995EP0644909A1 Process for coating a substrate with a silicon and zirconium based lacquer
03/29/1995EP0644908A1 Silicon based lacquer, its use as a substrate coating and substrates thus obtained
03/29/1995EP0644809A1 Three-dimensional printing techniques
03/28/1995USRE34887 Ceramic multilayer circuit board and semiconductor module
03/28/1995US5402315 Printed circuit board and assembly module for connection of screened conductors for distribution boards and distribution systems in light-current systems engineering
03/28/1995US5402314 Printed circuit board having through-hole stopped with photo-curable solder resist
03/28/1995US5402255 Liquid crystal panel module and tape carrier package for liquid crystal driver IC
03/28/1995US5401913 Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
03/28/1995US5401912 Microwave surface mount package
03/28/1995US5401911 Via and pad structure for thermoplastic substrates and method and apparatus for forming the same
03/28/1995US5401909 Printed circuit board with locally enhanced wiring density
03/28/1995US5401689 Method for forming a semiconductor chip carrier
03/28/1995US5401675 Sputtering titanium nitride
03/28/1995US5401414 Process for recovering a fluid dissolved in a rinsing bath
03/28/1995US5401413 Method for enhancing the biodegradation of biodegradable organic wastes
03/28/1995US5401370 Device for masking field lines in an electroplating plant
03/28/1995US5401188 Boardlock clip
03/28/1995US5400953 Method of printing a bonding agent
03/28/1995US5400950 Method for controlling solder bump height for flip chip integrated circuit devices
03/28/1995US5400949 Circuit board assembly
03/28/1995US5400948 Circuit board for high pin count surface mount pin grid arrays
03/28/1995US5400503 Wiring method and wiring apparatus
03/28/1995CA1334924C Process for etching epoxy resin with a high etch back value
03/23/1995WO1995008189A1 Multi-chip module
03/23/1995WO1995008176A1 Electrical assembly comprising a ptc resistive element
03/23/1995DE4432910A1 Partially electroplated plastics products and partial-electroplating process therefor
03/23/1995DE4332534A1 Ribbon cable connector for making contact with a printed circuit board
03/22/1995EP0644713A1 Solder-precoated wiring board and method for manufacturing the same
03/22/1995EP0644628A1 Electrical angle connector of a printed circuit board type having a plurality of connecting conductive strips of a common length
03/22/1995EP0644612A2 Branch joint box
03/22/1995EP0644596A1 Method for multi-layer printed wiring board design
03/22/1995EP0644589A2 Method to fill contact holes in a semiconductor layer structure
03/22/1995EP0644227A1 Solid surface modifying method and apparatus
03/22/1995EP0643903A1 Tin-bismuth solder connection having improved high temperature properties, and process for forming same.
03/22/1995EP0643902A1 Improved stencil or mask for applying solder to circuit boards and support frame therefor
03/22/1995EP0643780A1 Multiple solvent cleaning system.
03/22/1995EP0619935A4 Multi-layer circuit construction methods and structures with customization features and components for use therein.
03/22/1995EP0536266B1 Partially fluorinated alkanes having a tertiary structure
03/22/1995EP0336969B1 Flexible metal/plastic laminate and method and apparatus for manufacturing same
03/22/1995EP0302901B1 Solderable lead
03/21/1995US5400262 Universal interconnect matrix array
03/21/1995US5400221 Printed circuit board mounted with electric elements thereon
03/21/1995US5400220 Mechanical printed circuit board and ball grid array interconnect apparatus
03/21/1995US5400210 Multilayer dielectric with insulator of silicon nitride and silicon carbide ceramic
03/21/1995US5400160 Display means for apparatus with transparent panel fixed to LCD panel via elastic packing with ridges in zig zag pattern
03/21/1995US5400003 Inherently impedance matched integrated circuit module
03/21/1995US5399902 Semiconductor chip packaging structure including a ground plane
03/21/1995US5399651 Unsaturated organosilicates
03/21/1995US5399650 Adhesion promoting additives and low temperature curing organosiloxane compositions containing same
03/21/1995US5399637 Energy-polymerizable adhesive, coating, and film
03/21/1995US5399604 Epoxy group-containing resin compositions
03/21/1995US5399528 Multi-layer fabrication in integrated circuit systems
03/21/1995US5399432 Galvanically compatible conductive filler and methods of making same
03/21/1995US5399425 Metallized polymers
03/21/1995US5399416 Heat-conductive adhesive films, laminates with heat-conductive adhesive layer and the use thereof
03/21/1995US5399305 Dynamic gating of polymers for isotropic properties
03/21/1995US5399281 Cleaning compound
03/21/1995US5399239 Coating with protective layer of chemical resistant polyimide
03/21/1995US5399238 Method of making field emission tips using physical vapor deposition of random nuclei as etch mask
03/21/1995US5399202 Resist-peeling liquid and process for peeling a resist using the same
03/21/1995US5398865 Preparation of surfaces for solder joining
03/21/1995US5398863 Shaped lead structure and method
03/21/1995US5398399 Galvanically
03/21/1995CA1334880C Solder mask resins having improved stability
03/21/1995CA1334875C Amorphous-polypropylene-based hot melt adhesive
03/16/1995WO1995007372A1 Copper etchant solution additives
03/16/1995WO1995007152A1 Surface processing
03/16/1995DE4430390A1 Process for the production of structured metallic coatings on surfaces
03/16/1995DE4330975A1 Method for fitting a power component on a printed circuit board
03/15/1995EP0643550A1 Plastic part e.g. wiring support or plastic casing
03/15/1995EP0643441A2 Electrical connectors
03/15/1995EP0643440A2 Electrical connectors
03/15/1995EP0643366A2 Electronic modul for cards and production of such module
03/15/1995EP0643154A2 Composition for treating copper and copper alloy surfaces and method for the surface treatment
03/15/1995EP0643153A1 Process for the fabrication of structured metallizations on surfaces
03/15/1995EP0642919A1 Laminate and multilayer printed circuit board
03/15/1995EP0642861A1 Apparatus and method for drilling
03/15/1995EP0642841A1 Press belt applicator for a continuous belt press
03/15/1995CN1027945C Electronic detail mounting module
03/14/1995US5398169 Microelectronic package comprising metal housing grounded to board edge
03/14/1995US5398166 Electronic component and mounting structure thereof
03/14/1995US5398165 Electronic circuit component and mounting method therefor
03/14/1995US5398128 Resin coating retains flexibility after cure
03/14/1995US5397864 Wiring board and a method for producing the same
03/14/1995US5397863 Dispersion of fluorinated carbon particles in polymer, substrate for electronic devices, low coefficient of expansion
03/14/1995US5397741 Polysilsesquioxane overcoating, improved chemical mechanical polishing results
03/14/1995US5397685 Light-sensitive composition and process
03/14/1995US5397678 Multicolor
03/14/1995US5397607 Input/output (I/O) thin film repair process
03/14/1995US5397599 Metallization of polycarbonate, low and high phosphorus nickel layers
03/14/1995US5397495 Cleaning compounds for electronic circuits
03/14/1995US5397239 Molded hinged connector
03/14/1995US5397048 Needle for applying viscous fluid
03/14/1995US5396702 Method for forming solder bumps on a substrate using an electrodeposition technique
03/14/1995CA2068357C Water-soluble flux for cored solder
03/09/1995DE4431903A1 Printed circuit board having an electrical circuit, in particular for the dashboard of a motor vehicle
03/09/1995DE4338107C1 Semiconductor module
03/09/1995DE4329577A1 Device for simplifying the measurement of thick film resistors
03/09/1995DE4324479A1 Method for producing structures which can be soldered in order to make contact with electrical modules
1 ... 978 979 980 981 982 983 984 985 986 987 988 989 990 991 992 993 994 995 996 997 998 ... 1185