| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/07/1995 | EP0656171A1 A multiple layer printed circuit board. |
| 06/07/1995 | EP0656025A1 Solution for coating non conductors with conductive polymers and their metallization process. |
| 06/07/1995 | EP0655961A1 Tin-bismuth solder paste and method of use |
| 06/07/1995 | EP0500759B1 Coating metal on poly(aryl ether ketone) surfaces |
| 06/07/1995 | CN1103423A Electrically conductive adhesives |
| 06/07/1995 | CN1028729C Improved electromagnetic pump for pumping liquid metal soft solder |
| 06/06/1995 | US5422789 Printed circuit board component mounting device |
| 06/06/1995 | US5422764 Electrical interconnect for a head/arm assembly of computer disk drives |
| 06/06/1995 | US5422622 For suppressing electromagnetic radiation in an electronic device |
| 06/06/1995 | US5422516 Electronic parts loaded module including thermal stress absorbing projecting electrodes |
| 06/06/1995 | US5422228 Method of producing thin film multi-layered substrate |
| 06/06/1995 | US5422222 Electrodeposition coating composition |
| 06/06/1995 | US5421989 Coating substrate with noble metal colloid suspended in polymer matrix, removing matrix with chalcogen solution, electrolytically coating with principal metal |
| 06/06/1995 | US5421985 Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations |
| 06/06/1995 | US5421943 Pulsed current resistive heating for bonding temperature critical components |
| 06/06/1995 | US5421926 Printing or patterning transparent conductive ink onto a base board, drying and calcining to form conductive film, overcoating a ultraviolet curing resin, bonding base board to base plate, peeling base board |
| 06/06/1995 | US5421884 Apparatus for coating circuit boards |
| 06/06/1995 | US5421507 Method for fabricating an apparatus |
| 06/06/1995 | US5421506 Method of positioning an object on a carrier |
| 06/06/1995 | US5421256 Adjustable squeegee assembly for silk screen printers |
| 06/06/1995 | US5421083 Method of manufacturing a circuit carrying substrate having coaxial via holes |
| 06/06/1995 | US5421082 Method of forming a decal having conductive paths thereon |
| 06/06/1995 | US5421081 Method for producing electronic part mounting structure |
| 06/06/1995 | US5421079 High density, high performance memory circuit package |
| 06/06/1995 | CA1335817C Precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor |
| 06/06/1995 | CA1335772C Thick film forming process |
| 06/01/1995 | WO1995015020A1 Electrical interconnects |
| 06/01/1995 | WO1995014575A1 Alignment systems |
| 06/01/1995 | WO1995014538A1 Ammonia-free deposition of copper by disproportionation |
| 06/01/1995 | DE4437573A1 Film adhesive for bonding fluorocarbon resin to metal |
| 06/01/1995 | DE4405741C1 Electrolytic deposition of metal coating |
| 06/01/1995 | DE4404312C1 Connection device for microwave device unilateral planar line |
| 06/01/1995 | DE4340396A1 Application of preliminary solder material to substrates with solder stop masks. |
| 06/01/1995 | DE4340249A1 Apparatus for controlling boring depth in multilayer PCB |
| 06/01/1995 | DE4340168A1 Mfr. of multilayer circuit boards |
| 06/01/1995 | CA2176250A1 Alignment systems |
| 05/31/1995 | EP0655401A2 Method of and device for transferring platelike articles, especially printed circuit boards |
| 05/31/1995 | EP0655347A1 Thermal transfer dye-donor element comprising a substrate having a microstructured surface |
| 05/31/1995 | EP0655183A1 Method of manufacturing a multilayer printed wire board. |
| 05/31/1995 | EP0655020A1 Process and device for metallizing a contact area. |
| 05/31/1995 | EP0638094A4 Concentration of fluoropolymer dispersions using acrylic polymers of high acid content. |
| 05/31/1995 | EP0509992B1 Electrical connectors |
| 05/31/1995 | CN1103233A Method for manufacturing printed circuit board |
| 05/31/1995 | CN1103077A Photopolymerisable compositions |
| 05/30/1995 | US5420758 Integrated circuit package using a multi-layer PCB in a plastic package |
| 05/30/1995 | US5420755 Circuit board with electrical components, in particular surface-mounted devices |
| 05/30/1995 | US5420623 Recording head having multi-layer wiring |
| 05/30/1995 | US5420620 Recording apparatus having a recording head using an electrically conductive sheet |
| 05/30/1995 | US5420461 Integrated circuit having a two-dimensional lead grid array |
| 05/30/1995 | US5420378 Printed circuit board/chassis grounding apparatus and methods |
| 05/30/1995 | US5420377 Circuit assembly with vented solder pads |
| 05/30/1995 | US5420073 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal |
| 05/30/1995 | US5419998 Photopolymerizable composition for use in an alkaline-etch resistant dry film photoresist |
| 05/30/1995 | US5419954 Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof |
| 05/30/1995 | US5419946 Adhesive for printed wiring board and production thereof |
| 05/30/1995 | US5419926 Ammonia-free deposition of copper by disproportionation |
| 05/30/1995 | US5419829 Electroplating process |
| 05/30/1995 | US5419807 Method of providing electrical interconnect between two layers within a silicon substrate, semiconductor apparatus, and method of forming apparatus for testing semiconductor circuitry for operability |
| 05/30/1995 | US5419708 Printed circuit card with minor surface I/O pads |
| 05/30/1995 | US5419482 Soldering apparatus with adapted soldering tower |
| 05/30/1995 | US5419481 Process and apparatus for attaching/deataching land grid array components |
| 05/30/1995 | US5419038 Method for fabricating thin-film interconnector |
| 05/30/1995 | CA1335703C Pre-etch treatment for preparing a plastics substrate for plating with a metal |
| 05/26/1995 | WO1995014318A1 Shunt connector |
| 05/26/1995 | WO1995014314A1 Contact structure for interconnections, interposer, semiconductor assembly and method |
| 05/26/1995 | WO1995014312A1 Solderable connector for high density electronic assemblies |
| 05/26/1995 | WO1995014301A1 Attenuator especially for audio-signals |
| 05/26/1995 | WO1995014116A1 Preparation of alumina ceramic surfaces for electroless and electrochemical metal deposition |
| 05/26/1995 | WO1995013901A1 Metallurgically bonded polymer vias |
| 05/26/1995 | WO1995013896A1 Fluxless soldering pretreating system and method using fluorine-containing plasma |
| 05/24/1995 | EP0654958A1 Tab circuit fusible links for disconnection or encoding information |
| 05/24/1995 | EP0654821A2 Electronic device having co-planar heatsink and electrical contacts |
| 05/24/1995 | EP0654820A2 Semiconductor module |
| 05/24/1995 | EP0654818A1 Semiconductor device with solder bump and process for manufacturing the same |
| 05/24/1995 | EP0654800A1 Method of processing circuit board |
| 05/24/1995 | EP0654174A1 Sealed conductive active alloy feedthroughs |
| 05/24/1995 | EP0654170A1 Thermal cut-out and process for activating it. |
| 05/24/1995 | DE4339263A1 Flat objects i.e. PCBs transporting device |
| 05/24/1995 | DE4338656A1 PCBs and image carriers i.e. films alignment device |
| 05/24/1995 | CN2198681Y Connector with surface mounting technology mounting device |
| 05/24/1995 | CN1102804A Process for making plastic laminates with metal laminae for printed circuits especially, with endoth ermic heating |
| 05/24/1995 | CN1028535C Photosensitive thermosetting resin compsition and method of forming solder resist pattern by use thereof |
| 05/23/1995 | US5418691 Two printed circuit boards superiposed on one another both having position registry marks |
| 05/23/1995 | US5418690 Multiple wiring and X section printed circuit board technique |
| 05/23/1995 | US5418689 Printed circuit board or card for direct chip attachment and fabrication thereof |
| 05/23/1995 | US5418688 Cardlike electronic device |
| 05/23/1995 | US5418455 Magnetic position detector having a magnetic sensor element and a circuit board having a selectively changeable wiring pattern |
| 05/23/1995 | US5418115 Method for formation of image |
| 05/23/1995 | US5418064 Fluorescent brightener stilbene dye for sensitizing substrates |
| 05/23/1995 | US5418002 Preoxidation |
| 05/23/1995 | US5417896 Preparation of sheet-like polyethylene terephthalate materials having little surface roughness |
| 05/23/1995 | US5417828 Electroplating plant with opposed electrolitic cells and continuous feed of the workpieces to be plated |
| 05/23/1995 | US5417800 Thin film circuit board manufacturing process |
| 05/23/1995 | US5417784 Method of manufacturing laminated electronic component |
| 05/23/1995 | US5417769 Pollution control |
| 05/23/1995 | US5417578 Printed wiring boards having low signal-to-ground ratios |
| 05/23/1995 | US5417577 Interconnection method and apparatus |
| 05/23/1995 | US5417362 Electrical connecting method |
| 05/23/1995 | CA2109687A1 Method for the through plating of conductor foils |
| 05/23/1995 | CA1335625C Inspection of multipattern circuit boards |