| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/27/1995 | US5428190 Rigid-flex board with anisotropic interconnect and method of manufacture |
| 06/27/1995 | US5427983 Depositing adhesion metal layer over etched molybdenum mask, overlays a metallic cushion layer and uppermost gold protective layer spreads over edges to cover exposed edges |
| 06/27/1995 | US5427895 Semi-subtractive circuitization |
| 06/27/1995 | US5427888 Positive photosensitive resin composition comprising a polymer having carbon-carbon double bonds, a maleic acid group and a maleimide group |
| 06/27/1995 | US5427865 Multiple alloy solder preform |
| 06/27/1995 | US5427841 Printed circuit having patterned polymeric layer with both electroconductive (having electrodeposited metal layer) and nonconductive areas |
| 06/27/1995 | US5427825 Localized surface glazing of ceramic articles |
| 06/27/1995 | US5427642 Method for mounting electronic parts on a printed circuit board by use of an adhesive composition |
| 06/27/1995 | US5427641 Method of forming a mounting structure on a tape carrier |
| 06/27/1995 | US5427627 Applying fluid to surface using controlled velocities and times, then repeating with second fluid |
| 06/27/1995 | US5427546 Flexible jumper with snap-in stud |
| 06/27/1995 | US5427532 Light emitting diode and socket assembly |
| 06/27/1995 | US5427303 Fluxless solder coating and joining |
| 06/27/1995 | US5426850 Fabrication process of wiring board |
| 06/27/1995 | US5426849 Method of producing a polyimide multilayer wiring board |
| 06/27/1995 | CA2059386C Socket and header electrical connector assembly |
| 06/27/1995 | CA1336047C Method of forming images |
| 06/27/1995 | CA1336046C Method of forming photosetting film |
| 06/22/1995 | WO1995016998A1 Anisotropic, electrically conductive adhesive film |
| 06/22/1995 | WO1995016814A1 Powder coating method for producing a composite web |
| 06/22/1995 | WO1995016570A1 Ablative imaging by proximity lithography |
| 06/22/1995 | WO1995016538A1 Device for removing excess solder from items being soldered at a soldering station |
| 06/22/1995 | WO1995016537A1 Heat-transfer device for use in a convective-heat installation, in particular a convective-heat soldering installation |
| 06/22/1995 | DE4343272A1 Electrically conductive adhesive bonding layer mfr. |
| 06/22/1995 | DE4342149A1 Tapered terminal pin for connecting electronic components to PCBs |
| 06/21/1995 | EP0659039A2 Ultraviolet-curing composition, pattern forming method making use of the same, printed-wiring board and its production |
| 06/21/1995 | EP0659038A2 Etching resist composition, pattern forming method making use of the same, printed-wiring board and its production |
| 06/21/1995 | EP0659032A1 Electronic component |
| 06/21/1995 | EP0658960A2 Cavity and bump interconnection structure for electronic packages |
| 06/21/1995 | EP0658957A2 High density electrical connector |
| 06/21/1995 | EP0658932A2 Ceramic substrate for semiconductor device |
| 06/21/1995 | EP0658929A1 Process for delaminating organic resin from board and process for manufacturating organic resin multi-layer wiring board |
| 06/21/1995 | EP0658436A1 Diffusion patterning process and screen therefor |
| 06/21/1995 | EP0658416A2 Method for texturing polymer foils |
| 06/21/1995 | EP0658391A1 Process, apparatus for dry reflowing metallic surfaces, before brazing them |
| 06/21/1995 | EP0658300A1 Structured printed circuit boards and films and process for producing them |
| 06/21/1995 | EP0556351B1 SURFACE MOUNT ASSEMBLY OF DEVICES USING AdCon INTERCONNECTIONS |
| 06/21/1995 | CN2201769Y Pricking-through pin of PC board for locating negative |
| 06/21/1995 | CN1104014A Composite substrates for preparation of printed circuits |
| 06/21/1995 | CN1103903A Electrodeposited copper foil and process for makin gasame using electrolyte solutions having controlled additions of chloride ions and organic additives |
| 06/20/1995 | US5426568 Launch-protected electronic assembly |
| 06/20/1995 | US5426405 Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects |
| 06/20/1995 | US5426399 Film carrier signal transmission line having separating grooves |
| 06/20/1995 | US5426265 Circuit component stand-off mount |
| 06/20/1995 | US5426263 Electronic assembly having a double-sided leadless component |
| 06/20/1995 | US5426132 Dual curing conformal coatings |
| 06/20/1995 | US5426074 Process for fabricating an active matrix circuit |
| 06/20/1995 | US5426008 Printing plates, photoresists |
| 06/20/1995 | US5425894 Dishwashing detergents; low foaming, biodegradable |
| 06/20/1995 | US5425873 Electroplating process |
| 06/20/1995 | US5425859 Electrochemical reduction |
| 06/20/1995 | US5425816 Electrical feedthrough structure and fabrication method |
| 06/20/1995 | US5425649 Connector system having switching and testing functions using tapered spring contact elements and actuators therefor |
| 06/20/1995 | US5425647 Split conductive pad for mounting components to a circuit board |
| 06/20/1995 | US5425495 Hot air circulation method for wave soldering machines |
| 06/20/1995 | US5425493 Selective addition of a solder ball to an array of solder balls |
| 06/17/1995 | CA2245047A1 Process for delaminating organic resin from board and process for manufacturing organic resin multi-layer wiring board |
| 06/15/1995 | WO1995015834A1 Solder depositing composition and method of packaging using the same |
| 06/15/1995 | WO1995015824A1 Method and machine for cleaning components |
| 06/15/1995 | CA2155668A1 Method and machine for cleaning components |
| 06/14/1995 | EP0658081A1 Method of heating a strip-shaped carrier in an oven and device for fastening at least one component on a strip-shaped carrier |
| 06/14/1995 | EP0658075A1 Method for manufacture of printed circuit boards |
| 06/14/1995 | EP0658074A1 Assembly of a printed circuit board and at least one component, and method of fastening a component to a printed circuit board |
| 06/14/1995 | EP0657959A1 Electrical connector assembly for mounting on a printed circuit board |
| 06/14/1995 | EP0657932A2 Terminal electrode for a chip package, assembly and method of production |
| 06/14/1995 | EP0657394A1 Silane compositions |
| 06/14/1995 | EP0657309A1 Method of producing transfer sheets |
| 06/14/1995 | EP0620930B1 Method and device for coating circuit boards |
| 06/14/1995 | EP0502915B1 Process and device for controlling the flow of operations in electroplating plants |
| 06/14/1995 | EP0498828B1 Solder leveller |
| 06/14/1995 | EP0417211B1 Conversion of manganate to permanganate |
| 06/14/1995 | DE4443410A1 Gedruckte Kunststoffschaltkreise und Kontakte und Verfahren zur Herstellung dieser Plastic printed circuits and contacts and method for producing these |
| 06/14/1995 | DE4342258A1 Conductive region prodn. on or in ceramic |
| 06/14/1995 | DE4339989A1 Mfg. solderable metal structures for contacting of electric modules |
| 06/14/1995 | CN1103617A Ink jet recording head, ink jet recording head cartridge and recording apparatus using same and method of manufacturing the head |
| 06/13/1995 | US5424919 Repairable electronic circuit package |
| 06/13/1995 | US5424918 Universal hybrid mounting system |
| 06/13/1995 | US5424906 Variable capacitor |
| 06/13/1995 | US5424896 Semiconductor package electrostatic discharge damage protection |
| 06/13/1995 | US5424384 Curable organosiloxane compositions containing low temperature reactive adhesion additives |
| 06/13/1995 | US5424368 Photoresists |
| 06/13/1995 | US5424252 Photo-plating solution and process |
| 06/13/1995 | US5424093 Dipping ends of substrates into metallic paints to form films yields external electrodes having uniform thickness |
| 06/13/1995 | US5424009 Catalytic, crosslinked polymeric films for electroless deposition of metal |
| 06/13/1995 | US5423974 Electrodeposition of metal onto previously metallized surface of polymeric substrate, for battery current collectors |
| 06/13/1995 | US5423935 Methods for applying discrete coatings |
| 06/13/1995 | US5423931 Method and apparatus for removing an electronic component from a board |
| 06/13/1995 | US5423930 Method of providing a sintered ceramic body having a concave portion |
| 06/13/1995 | US5423688 Clip for small outline IC device |
| 06/13/1995 | US5423285 Applying metal carboxylate precursor in solvent of xylenes, methoxyethanol or butyl acetate to integrated circuit wafer, heating to form layer of metal compound |
| 06/13/1995 | CA2011888C Fluxless soldering process |
| 06/13/1995 | CA1335914C Radiation-polymerizable composition and recording material prepared therefrom |
| 06/08/1995 | WO1995015674A1 Method of making a printed circuit board |
| 06/08/1995 | WO1995015673A1 Fabrication multilayer combined rigid/flex printed circuit board |
| 06/08/1995 | WO1995015579A1 Method for the encapsulation of components or elecetronic units and devices encapsulated using said method |
| 06/08/1995 | WO1995015266A1 Method of producing transfer sheets |
| 06/08/1995 | DE4443424A1 Multilayer substrate for power device controlled by microcomputer |
| 06/08/1995 | CA2154480A1 Method for the encapsulation of components or elecetronic units and devices encapsulated using said method |
| 06/07/1995 | EP0656741A2 Semiconductor package |
| 06/07/1995 | EP0656432A2 Method for making multilayers and apparatus for executing said method |