| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/12/1995 | US5474666 Using surfactant of alkali salt of acyclated polypeptide |
| 12/12/1995 | US5474651 Method for filling via holes in a semiconductor layer structure |
| 12/12/1995 | US5474108 Electromagnetic valve unit |
| 12/12/1995 | US5473814 Process for surface mounting flip chip carrier modules |
| 12/12/1995 | US5473813 Methods of forming electronic multi-layer printed circuit boards and/or cards and electronic packages including said boards or cards |
| 12/07/1995 | WO1995033291A1 Surface-mounted plug-in connector |
| 12/07/1995 | WO1995033289A1 Surface mount electrical connector with improved grounding element |
| 12/07/1995 | WO1995033086A1 Electrolytic method and device for the continuous and uniform metallization or etching of metal surfaces |
| 12/07/1995 | WO1995028735A3 Method of manufacturing a device whereby a support bar is provided with conductor tracks for electrically contacting a semiconductor element |
| 12/07/1995 | DE4419134A1 Positioning device for substrates processing |
| 12/07/1995 | DE19520213A1 The method and appts for optical processing of workpieces |
| 12/07/1995 | DE19519958A1 Heat-resistant cyano-acrylate adhesive useful for bonding electrical and electronic components |
| 12/06/1995 | EP0685990A2 Apparatus for mounting surface mount devices to a circuit board |
| 12/06/1995 | EP0685905A2 Electrical connections systems |
| 12/06/1995 | EP0685880A1 Method for interconnecting an electronic device using a removable solder carrying medium |
| 12/06/1995 | EP0685879A1 Method for interconnecting an electronic device using a transferable solder carrying medium |
| 12/06/1995 | EP0685878A2 Semiconductor package and method of forming the same |
| 12/06/1995 | EP0685294A1 Flux composition and corresponding soldering method |
| 12/06/1995 | EP0606402B1 Lamination of a photopolymerizable solder mask layer to a substrate containing holes using an intermediate photopolymerizable liquid layer |
| 12/06/1995 | EP0588834B1 Electrical connectors |
| 12/06/1995 | CN1113083A Thermoplastic polyimide polymer, thermoplastic polyimide film, polyimide laminate, and process for producing the laminate |
| 12/06/1995 | CN1113071A Copper foil used for layered plate plated with copper |
| 12/06/1995 | CN1113070A Apparatus with supporting plate and method for applying passive glue |
| 12/06/1995 | CN1113069A Printed circuit board |
| 12/06/1995 | CN1112950A Chemical reducing solution for copper oxide |
| 12/06/1995 | CN1112877A Metallic body with vapor deposited treatment layer(s) and adhesion-promoting layer |
| 12/05/1995 | US5473510 Land grid array package/circuit board assemblies and methods for constructing the same |
| 12/05/1995 | US5473499 Hot pluggable motherboard bus connection method |
| 12/05/1995 | US5473194 Chip carrier having through hole conductors |
| 12/05/1995 | US5473138 Method for increasing the surface area of ceramics, metals and composites |
| 12/05/1995 | US5473137 Method of bonding copper and a substrate for power electronics and made of a non-oxide ceramic |
| 12/05/1995 | US5473120 Multilayer board and fabrication method thereof |
| 12/05/1995 | US5473119 Stress-resistant circuit board |
| 12/05/1995 | US5473118 Printed circuit board with a coverlay film |
| 12/05/1995 | US5472828 Uniformly projecting predetermined pattern onto nonplanar substrate having three dimensionally curved surface by ablating with coherent light source |
| 12/05/1995 | US5472736 Masking a portion of coil-patterned groove partially plated with conductive material, then plating exposed portion with self-aligned second layer, dissolving cured photoresist and mask |
| 12/05/1995 | US5472735 Forming through hole, cleaning, selectively etching surface and electrolessly depositing a conductive metal |
| 12/05/1995 | US5472563 Printed circuit board and method and apparatus for making same |
| 12/05/1995 | US5472546 Method for making printed circuit boards |
| 12/05/1995 | US5472507 IC wiring connecting method and apparatus |
| 12/05/1995 | US5472298 Locating ring positioning apparatus for re-sharpened drill bit |
| 11/30/1995 | WO1995032605A1 Printed circuit board socket |
| 11/30/1995 | WO1995032604A1 Processing low dielectric constant materials for high speed electronics |
| 11/30/1995 | WO1995032493A2 Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer |
| 11/30/1995 | WO1995032449A1 Structure of conductive connecting portions, and liquid crystal display and electronic printer provided with the same |
| 11/30/1995 | WO1995032432A1 Process and system for testing the correct position of printed circuit boards having contact islands and conductor paths in a testing device |
| 11/30/1995 | WO1995032318A1 Catalytic, crosslinked polymeric films for electroless deposition of metal |
| 11/30/1995 | WO1995032174A1 Omega-hydrofluoroalkyl ethers, precursor carboxylic acids and derivatives thereof, and their preparation and application |
| 11/30/1995 | DE4418679A1 Integrated circuit interconnect system for wafer test |
| 11/30/1995 | DE4418617A1 Micro-wiring module with circuit board |
| 11/30/1995 | DE4418426A1 Semiconductor power modules for motor control inverter |
| 11/30/1995 | DE4418299A1 Illuminating device for transparent symbols of switch |
| 11/30/1995 | DE4418016A1 Metallisation of articles made of non-conductive materials |
| 11/30/1995 | DE4091519C2 Soldering machine with slotted rise tower |
| 11/30/1995 | CA2190116A1 Omega-hydrofluoroalkyl ethers, precursor carboxylic acids and derivatives thereof, and their preparation and application |
| 11/30/1995 | CA2163627A1 Processing low dielectric constant materials for high speed electronics |
| 11/29/1995 | EP0684648A2 Method for producing semiconductor device |
| 11/29/1995 | EP0684647A1 Electronic parts having airbridge interconnection and method of manufacturing such electronic parts |
| 11/29/1995 | EP0683716A1 Process for the production of plastic laminates with metal laminae especially for printed circuits made from endless bands. |
| 11/29/1995 | EP0683715A1 Process for making plastic laminates with metal laminae for printed circuits especially, with endothermic heating. |
| 11/29/1995 | EP0683702A1 Method and machine for cleaning components |
| 11/29/1995 | EP0537314B1 Coil former and process for procucing it |
| 11/29/1995 | CN1112803A A multiple layer printed circuit board |
| 11/29/1995 | CN1112796A Apparatus and method for detecting alignment of contacts in a multi-substrate electronic assembly |
| 11/29/1995 | CN1112705A Welding structure of electronic equipment part |
| 11/28/1995 | US5471368 Module having vertical peripheral edge connection |
| 11/28/1995 | US5471163 Tab circuit fusible links for disconnection or encoding information |
| 11/28/1995 | US5471151 Electrical interconnect using particle enhanced joining of metal surfaces |
| 11/28/1995 | US5471097 Resin encapsulated semiconductor device with an electrically insulating support and distortion preventing member |
| 11/28/1995 | US5471092 Metallurgical joint including a stress release layer |
| 11/28/1995 | US5471091 Techniques for via formation and filling |
| 11/28/1995 | US5471090 Electronic structures having a joining geometry providing reduced capacitive loading |
| 11/28/1995 | US5471088 Semiconductor package and method for manufacturing the same |
| 11/28/1995 | US5471016 Apparatus having at least one battery secured to a printed circuit board |
| 11/28/1995 | US5471010 Spatially separated uninsulated twisted wire pair |
| 11/28/1995 | US5470796 Electronic package with lead wire connections and method of making same |
| 11/28/1995 | US5470795 Method of connecting terminals of a plastic-encapsulated power transistor to a printed-circuit board |
| 11/28/1995 | US5470789 Forming apertures in insulating layers, coating with copper, wear, applying barriers and removal of layer |
| 11/28/1995 | US5470644 Apparatus and method for fabrication of printed circuit boards |
| 11/28/1995 | US5470607 Coating and heat sealing for connectors |
| 11/28/1995 | US5470412 Process for producing a circuit substrate |
| 11/28/1995 | US5470244 Electrical connector having reduced cross-talk |
| 11/28/1995 | US5469615 Method for electrical interconnection of metallic patterns |
| 11/25/1995 | CA2149972A1 Adhesive composition |
| 11/23/1995 | WO1995031886A1 Multilayer printed wiring board and its manufacture, and transferring plate and its manufacture |
| 11/23/1995 | WO1995031885A1 Lamination of dry-film photoresist for forming a conformable solder mask on a printed circuit board |
| 11/23/1995 | WO1995031884A1 Method for forming conductive circuit on surface of molded product, and component having conduction circuit |
| 11/23/1995 | WO1995031883A1 Process for manufacturing printed circuit foils or semifinished products for printed circuit foils, and thus manufactured printed circuit foils and semifinished products |
| 11/23/1995 | WO1995031590A1 Device for processing printed circuit boards |
| 11/23/1995 | WO1995031589A1 Device for processing flat workpieces, in particular printed circuit boards |
| 11/23/1995 | WO1995031586A1 Method of coating a substrate with copper |
| 11/23/1995 | DE4438316A1 Circuit board position checking system |
| 11/23/1995 | DE4431754C1 Carrier element for ic module of chip card |
| 11/23/1995 | DE4417866A1 Method and appts. for soldering electronic components using paste solder and preheat and reflow in oven |
| 11/23/1995 | DE4417551A1 Method and appts. for precision electrolytic processing of circuit boards |
| 11/23/1995 | DE4416403A1 Cooling system for printed circuit board |
| 11/23/1995 | DE19515034A1 Separation device for assembled printed circuit board |
| 11/22/1995 | EP0683549A2 A high performance connector |
| 11/22/1995 | EP0683519A2 A hybrid IC |
| 11/22/1995 | EP0683517A2 Semiconductor device having semiconductor chip bonded to circuit board through bumps and process of mounting thereof |