Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1995
10/17/1995US5459642 Capacitor mounting structure for printed circuit boards
10/17/1995US5459641 Polar electronic component and mounting structure therefor
10/17/1995US5459640 Circuit board assembly
10/17/1995US5459639 Printed circuit board assembly having high heat radiation property
10/17/1995US5459634 Area array interconnect device and method of manufacture thereof
10/17/1995US5459500 Charge plate connectors and method of making
10/17/1995US5459348 Heat sink and electromagnetic interference shield assembly
10/17/1995US5459294 Wireless floating horn switch
10/17/1995US5459287 Socketed printed circuit board BGA connection apparatus and associated methods
10/17/1995US5459284 Twisted-pair wire bond and method thereof
10/17/1995US5459103 Plating with copper, forming CuO layer on copper; plating with nickel, nickel/palladium and palladium; spot-plating
10/17/1995US5459013 Identifying defective area, applying an image reversal photoresist,exposing photoresist, removing portions of photoresist, depositing material on photoresist and defective area and removing photoresist
10/17/1995US5458921 Solvent system for forming films of photoimageable compositions
10/17/1995US5458911 Producing a dome above a recess in a substrate
10/17/1995US5458907 Method of manufacturing printed circuit boards having an oxidation proof coating on a copper or copper alloy circuit pattern
10/17/1995US5458763 Method for forming wiring pattern
10/17/1995US5458715 Alignment transfer method
10/17/1995US5458709 Forming green sheets containing ceramic and glass powders; lamination; firing; porous glass powders control shrinkage and prevent cracks and delamination
10/17/1995US5458497 Connector assembly
10/17/1995US5457881 Method for the through plating of conductor foils
10/17/1995US5457880 Embedded features for monitoring electronics assembly manufacturing processes
10/17/1995US5457878 Method for mounting integrated circuit chips on a mini-board
10/12/1995WO1995027341A1 Shielded circuit assembly and method for forming same
10/12/1995WO1995027307A1 Process and device for producing solder humps
10/12/1995WO1995026935A1 Coating of substrates
10/12/1995WO1995026872A1 Holographic document and method for forming
10/12/1995WO1995026852A1 Process and device for coating a non-solderable surface with a solderable metallised layer
10/12/1995WO1995026851A1 Mounting and electrically interconnecting components by solderbumps
10/12/1995DE4412463A1 Palladiumkolloid-Lösung und deren Verwendung Palladium colloid solution and the use thereof
10/12/1995DE4412364A1 Recyclable circuit board with film system laminated on substrate
10/12/1995DE4412278A1 Circuit board with both rigid and flexible regions
10/12/1995CA2187231A1 Coating of substrates
10/11/1995EP0676914A2 Method of constructing high yield, fine line, multilayer printed wiring board panel
10/11/1995EP0676913A1 Surface-mount component soldering
10/11/1995EP0676912A2 Apparatus, and corresponding method, for chemically etching substrates
10/11/1995EP0676806A2 Ball grid array intergrated circuit package with high thermal conductivity
10/11/1995EP0676803A2 Method of improving the adhesion to a polyimide surface by formation of covalent bands
10/11/1995EP0676800A2 Process for producing metal-bonded-ceramic materials or components
10/11/1995EP0676669A1 Pliable, aqueous processable, photoimageable permanent coatings for printed circuits
10/11/1995EP0676456A1 Heat-resistant adhesive film for printed board and method of use thereof
10/11/1995EP0676435A1 Epoxy adhesives and copper foils and copper clad laminates using same
10/11/1995EP0485582B1 Method of producing microbump circuits for flip chip mounting
10/11/1995CN1110077A Electrical interconnect apparatus
10/11/1995CN1110046A Printed plstic circuits and contacts and method for making same
10/11/1995CN1109924A Plating surface of unconductor
10/10/1995US5457610 Low profile mechanical interconnect system having metalized loop and hoop area
10/10/1995US5457605 Electronic device having coplanar heatsink and electrical contacts
10/10/1995US5457593 Apparatus for connecting multi-wire telecommunication cabling to surge protector modules
10/10/1995US5457153 Partially saponified polyvinylalcohol, fluorine-containing surfactant, liquid water-containing medium
10/10/1995US5457149 Reworkable adhesive for electronic applications
10/10/1995US5456945 Integrated circuits
10/10/1995US5456942 Positioning a substrate between two compressible layers, each of them has a apparture, substrate ha a via alined between them, a liquid coating is disposed on one aperture, applying pressure causing liquid to flow between layers, coating via
10/10/1995US5456856 Containing 2-butoxyethanol, 2-methylcyclohexanol or isopropyl lactate; cleaning, rinsing or drying surfaces
10/10/1995US5456817 Surface treatment method of a copper foil for printed circuits
10/10/1995US5456814 Contacting arrangement for a circuit board support assembly
10/10/1995US5456760 Cleaning process for electronic and electrical assemblies
10/10/1995US5456759 Method using megasonic energy in liquefied gases
10/10/1995US5456616 Electrical device employing a flat flexible circuit
10/10/1995US5456608 Cross-connect system
10/10/1995US5456404 Method of testing semiconductor chips with reusable test package
10/10/1995US5456018 Alignment system for planar electronic devices arranged in parallel fashion
10/10/1995US5456004 Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards
10/10/1995CA2013334C Method and apparatus for bonding continuous thin film to discrete base plates and film cutting apparatus therefor
10/05/1995WO1995026538A1 Method of manufacturing a chip card, and chip card thus produced
10/05/1995DE4410732A1 Verfahren zur Herstellung einer Chipkarte sowie Chipkarte A method of manufacturing a smart card as well as smart card
10/05/1995DE19511392A1 Method and appts. for production of solder bumps
10/05/1995DE19511119A1 Light to photoresist layer directing method for thin film mask mfr.
10/05/1995DE19511055A1 Circuit board terminal connector and mfg device
10/05/1995DE19510988A1 Schaltungsträger Circuit board
10/05/1995DE19503178A1 Producing solderable metallising layer on non-solderable surface
10/04/1995EP0675675A1 Cleaning method
10/04/1995EP0675674A1 Film circuit metal system for use with bumped IC packages
10/04/1995EP0675673A2 Reinforcement for flexible printed circuit board and reinforced flexible circuit board
10/04/1995EP0675569A1 Circuitized structure including flexible circuit with elastomeric member bonded thereto and method of making
10/04/1995EP0675539A2 Ball grid package with integrated passive circuit elements
10/04/1995EP0675537A2 Protective electronic coatings using filled polysilazanes
10/04/1995EP0675532A2 Method for forming solder bump in IC mounting board
10/04/1995EP0675531A2 Process for electrically interconnecting contacts
10/04/1995EP0675411A1 Photosensitive resin composition and photosensitive film using the same
10/04/1995EP0675213A1 Electrolytic copper foil for printed wiring boards and process for producing the same
10/04/1995EP0674827A1 Circuit-board device
10/04/1995EP0674808A1 Electrical interconnect structures.
10/04/1995EP0478562B1 Snap fit contact assembly
10/04/1995CN1109674A Method for packaging unpackaged integrate circuit into circuit board
10/03/1995USRE35045 Method for removing soldering flux with alkaline metal carbonate salts and an alkali metal silicate
10/03/1995US5455893 Processing method and neuronal network structure applying the method
10/03/1995US5455870 Apparatus and method for inspection of high component density printed circuit board
10/03/1995US5455742 Direct circuit board connection
10/03/1995US5455741 Holder for mounting an electronic element
10/03/1995US5455740 Bus communication system for stacked high density integrated circuit packages
10/03/1995US5455461 Semiconductor device having reformed pad
10/03/1995US5455446 Leaded semiconductor package having temperature controlled lead length
10/03/1995US5455393 Multilayered printed wiring board and method of manufacturing the same
10/03/1995US5455064 Process for fabricating a substrate with thin film capacitor and insulating plug
10/03/1995US5454970 Octamethyltrisiloxane containing azeotropes
10/03/1995US5454930 Dipping a catalyzed, electrically nonconductive substrate in a solution containing copper-complexing agent; formaldehyde-free
10/03/1995US5454928 Melting excess plated metal filling substrate holes to eliminate voids then lapping to level the surfaces
10/03/1995US5454927 Ceramic substrates with highly conductive metal vias
10/03/1995US5454926 Electrodeposited copper foil
10/03/1995US5454738 Electrical connector having reduced cross-talk
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