Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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01/02/1996 | US5480269 Method of drilling a hole for printed wiring board |
01/02/1996 | US5480048 Applying a polymer coating on a substrate |
01/02/1996 | US5479854 Automatic squeegee angle and pressure adjusting means |
01/02/1996 | US5479722 Movable registration pin mechanism |
01/02/1996 | US5479703 Method of making a printed circuit board or card |
01/02/1996 | US5479694 Method for mounting integrated circuits onto printed circuit boards and testing |
01/02/1996 | CA2073150C Dielectric filter construction having notched mounting surface |
01/02/1996 | CA1337864C Electrodeposition coating process of photoresist for printed circuit board |
12/28/1995 | WO1995035589A1 High impact digital crash data recorder |
12/28/1995 | WO1995035585A2 Surface mountable substrate edge terminal |
12/28/1995 | WO1995035580A1 Device and process for removing particles from objects |
12/28/1995 | WO1995035543A1 Document verification system |
12/28/1995 | WO1995035216A1 Lottery ticket structure with circuit elements |
12/28/1995 | WO1995032493A3 Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer |
12/28/1995 | CA2152578A1 Wiring backplane for plug-type connections |
12/28/1995 | CA2152577A1 Arrangement for connecting wiring backplanes and module circuit boards |
12/27/1995 | EP0689374A2 Electronic module |
12/27/1995 | EP0689245A2 Electronic device, its arrangement and method of manufacturing the same |
12/27/1995 | EP0689165A1 Contactless memory card with IC-module |
12/27/1995 | EP0689073A1 Alignment and bonding techniques |
12/27/1995 | EP0688860A1 Process for producing clean article |
12/27/1995 | EP0592471B1 Method of treating the surface of moulded polyamide articles, and the articles thus obtained |
12/27/1995 | CN2216319Y Structurally improved PCB collecting machine |
12/26/1995 | US5479529 Computer-implemented method |
12/26/1995 | US5479319 Electrical assembly |
12/26/1995 | US5479318 Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends |
12/26/1995 | US5479138 Multi-layer wiring board |
12/26/1995 | US5478972 Multilayer circuit board and a method for fabricating the same |
12/26/1995 | US5478779 Electrically conductive projections and semiconductor processing method of forming same |
12/26/1995 | US5478700 Drawing air of mask cavities, filling with solder paste or conductive adhesive by applying pressure, removing injector, applying infra-red radiation to evaporate paste flux and reflow solder balls projecting above the mask form cavities |
12/26/1995 | US5478699 Electroforming patterned metal layer onto portions of mandrel determined by pattern of resist |
12/26/1995 | US5478643 Matte transfer metallization film |
12/26/1995 | US5478607 Method for use of preflux, printed wiring board, and method for production thereof |
12/26/1995 | US5478599 Process for resin impregnation of a fibrous substrate |
12/26/1995 | US5478492 Compositions comprising pentafluorobutane and trans-1,2-dichloroethylene and use of these compositions |
12/26/1995 | US5478462 Pre-electroless depositing nickel or cobalt metal or alloy layer in a solution comprising an alkyldiamine, an alkali metal hydroxide, alkylene glycol and water |
12/26/1995 | US5478421 Method for making composite structures by filament winding |
12/26/1995 | US5478420 Process for forming open-centered multilayer ceramic substrates |
12/26/1995 | US5478009 Selective removal of a single solder ball from an array of solder balls |
12/26/1995 | US5478008 Method of soldering an electric cable to a circuit board |
12/26/1995 | US5478006 Printed-circuit substrate and its connecting method |
12/26/1995 | US5477933 Electronic device interconnection techniques |
12/26/1995 | US5477612 Method of making high density conductive networks |
12/26/1995 | CA2073008C Printed circuit board manufacturing method accommodates wave soldering and press fitting of components |
12/21/1995 | WO1995035015A1 A capsule-stiffening arrangement and a method for its manufacture |
12/21/1995 | WO1995034911A1 Electrostatic chuck |
12/21/1995 | WO1995034608A1 Substrate coated with water-soluble salt |
12/21/1995 | DE4420901A1 Liquid crystal cell |
12/20/1995 | EP0688155A1 Adapter for electrically connecting opto-electronic components to a printed circuit board |
12/20/1995 | EP0687567A2 Barrier layer for laser ablative imaging |
12/20/1995 | EP0687405A1 Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture |
12/20/1995 | EP0578737B1 Contact device for an electrical or electronic component |
12/20/1995 | EP0451254B1 Multilayer circuit board having microporous layers and process for making same |
12/20/1995 | EP0340241B1 High density electronic package comprising stacked sub-modules |
12/20/1995 | CN1113607A A chip package, a chip carrier and a method for producing the same, a terminal electrode for a circuit substrate and a method for producing the same, and a chip package-mounted complex |
12/19/1995 | US5477419 Method and apparatus for electrically connecting an electronic part to a circuit board |
12/19/1995 | US5477086 Shaped, self-aligning micro-bump structures |
12/19/1995 | US5476970 Reacting of an aromatic hydrocarbon and benzoyl peroxide |
12/19/1995 | US5476947 Benzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the same |
12/19/1995 | US5476726 Circuit board with metal layer for solder bonding and electronic circuit device employing the same |
12/19/1995 | US5476690 Pattern formed by electroless plating using a photoresist; developable by aqueous alkaline solution |
12/19/1995 | US5476688 Dividing starter aqueous plating solution into plurality of portions, forming baths of different concentrations, immersing powder substrate in each bath until depleted, rinsing between baths and at end of process, drying |
12/19/1995 | US5476580 Processes for preparing a non-conductive substrate for electroplating |
12/19/1995 | US5476211 Method of manufacturing electrical contacts, using a sacrificial member |
12/19/1995 | US5476207 Method and apparatus for fluxing and soldering terminals on a printed circuit board |
12/19/1995 | US5476039 Screen printing apparatus with magnetic support means for printing plate |
12/15/1995 | EP0733264A4 Self centering coil |
12/14/1995 | WO1995034106A1 Microelectronic contacts and assemblies |
12/14/1995 | WO1995034096A1 Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof |
12/14/1995 | WO1995033708A1 Process for preparing biscyanoacrylates |
12/14/1995 | DE4420002A1 Pot core for inductive components e.g. code-based identification systems |
12/14/1995 | DE4419667A1 Holder for SMT components on circuit board |
12/14/1995 | DE19520700A1 Semiconductor element used e.g. as integrated circuit |
12/14/1995 | DE19513354A1 Surface processing equipment |
12/14/1995 | CA2192383A1 Process for preparing biscyanoacrylates |
12/14/1995 | CA2188770A1 Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof |
12/13/1995 | EP0687137A2 Solder medium for circuit interconnection |
12/13/1995 | EP0687136A1 Method for selectively metallizing a substrate |
12/13/1995 | EP0687009A2 Multi-layer electronic circuit package with dielectric polymer layers having different optical absorption strength and method of forming it |
12/13/1995 | EP0687007A2 Electronic surface mount device and method for making |
12/13/1995 | EP0686662A2 Conductive coatings |
12/13/1995 | EP0686093A1 Metal on plastic films with adhesion-promoting layer |
12/13/1995 | EP0686073A1 No-clean, low-residue, volatile organic compound free soldering flux and method of use |
12/13/1995 | EP0624305A4 Carrier strip head interconnect assembly. |
12/13/1995 | CN1113375A Method of depositing solid substance on a substrate |
12/13/1995 | CN1113332A Resonant tag labels and method of making same |
12/12/1995 | USRE35115 Cleaning soldering flux from printed wiring board; alkali metal salt of octanoic or nonanoic acid as hydrotrope |
12/12/1995 | US5475606 Faraday cage for a printed circuit card |
12/12/1995 | US5475567 Method for hermetically sealing a single layer ceramic thick film electronic module |
12/12/1995 | US5475379 Solid phase conformal coating suitable for use with electronic devices |
12/12/1995 | US5475264 Arrangement having multilevel wiring structure used for electronic component module |
12/12/1995 | US5475263 Thick film hybrid multilayer circuit |
12/12/1995 | US5475261 Semiconductor device having many lead pins |
12/12/1995 | US5475260 Electronic read-only module |
12/12/1995 | US5475205 Document verification system |
12/12/1995 | US5475048 Free radical curable formulation of an unsaturated polyester or vinyl ester, thermoplastic resin and crosslinking agent |
12/12/1995 | US5474957 Process of mounting tape automated bonded semiconductor chip on printed circuit board through bumps |
12/12/1995 | US5474956 Curing and patterning the thin layer of polyimide dielectric |
12/12/1995 | US5474798 Method for the manufacture of printed circuit boards |
12/12/1995 | US5474741 Alternating unfired ceramic layers and flexible conforming retention layers which will become porous during firing when polymeric binders are volatialized |