Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/1996
01/02/1996US5480269 Method of drilling a hole for printed wiring board
01/02/1996US5480048 Applying a polymer coating on a substrate
01/02/1996US5479854 Automatic squeegee angle and pressure adjusting means
01/02/1996US5479722 Movable registration pin mechanism
01/02/1996US5479703 Method of making a printed circuit board or card
01/02/1996US5479694 Method for mounting integrated circuits onto printed circuit boards and testing
01/02/1996CA2073150C Dielectric filter construction having notched mounting surface
01/02/1996CA1337864C Electrodeposition coating process of photoresist for printed circuit board
12/1995
12/28/1995WO1995035589A1 High impact digital crash data recorder
12/28/1995WO1995035585A2 Surface mountable substrate edge terminal
12/28/1995WO1995035580A1 Device and process for removing particles from objects
12/28/1995WO1995035543A1 Document verification system
12/28/1995WO1995035216A1 Lottery ticket structure with circuit elements
12/28/1995WO1995032493A3 Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer
12/28/1995CA2152578A1 Wiring backplane for plug-type connections
12/28/1995CA2152577A1 Arrangement for connecting wiring backplanes and module circuit boards
12/27/1995EP0689374A2 Electronic module
12/27/1995EP0689245A2 Electronic device, its arrangement and method of manufacturing the same
12/27/1995EP0689165A1 Contactless memory card with IC-module
12/27/1995EP0689073A1 Alignment and bonding techniques
12/27/1995EP0688860A1 Process for producing clean article
12/27/1995EP0592471B1 Method of treating the surface of moulded polyamide articles, and the articles thus obtained
12/27/1995CN2216319Y Structurally improved PCB collecting machine
12/26/1995US5479529 Computer-implemented method
12/26/1995US5479319 Electrical assembly
12/26/1995US5479318 Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends
12/26/1995US5479138 Multi-layer wiring board
12/26/1995US5478972 Multilayer circuit board and a method for fabricating the same
12/26/1995US5478779 Electrically conductive projections and semiconductor processing method of forming same
12/26/1995US5478700 Drawing air of mask cavities, filling with solder paste or conductive adhesive by applying pressure, removing injector, applying infra-red radiation to evaporate paste flux and reflow solder balls projecting above the mask form cavities
12/26/1995US5478699 Electroforming patterned metal layer onto portions of mandrel determined by pattern of resist
12/26/1995US5478643 Matte transfer metallization film
12/26/1995US5478607 Method for use of preflux, printed wiring board, and method for production thereof
12/26/1995US5478599 Process for resin impregnation of a fibrous substrate
12/26/1995US5478492 Compositions comprising pentafluorobutane and trans-1,2-dichloroethylene and use of these compositions
12/26/1995US5478462 Pre-electroless depositing nickel or cobalt metal or alloy layer in a solution comprising an alkyldiamine, an alkali metal hydroxide, alkylene glycol and water
12/26/1995US5478421 Method for making composite structures by filament winding
12/26/1995US5478420 Process for forming open-centered multilayer ceramic substrates
12/26/1995US5478009 Selective removal of a single solder ball from an array of solder balls
12/26/1995US5478008 Method of soldering an electric cable to a circuit board
12/26/1995US5478006 Printed-circuit substrate and its connecting method
12/26/1995US5477933 Electronic device interconnection techniques
12/26/1995US5477612 Method of making high density conductive networks
12/26/1995CA2073008C Printed circuit board manufacturing method accommodates wave soldering and press fitting of components
12/21/1995WO1995035015A1 A capsule-stiffening arrangement and a method for its manufacture
12/21/1995WO1995034911A1 Electrostatic chuck
12/21/1995WO1995034608A1 Substrate coated with water-soluble salt
12/21/1995DE4420901A1 Liquid crystal cell
12/20/1995EP0688155A1 Adapter for electrically connecting opto-electronic components to a printed circuit board
12/20/1995EP0687567A2 Barrier layer for laser ablative imaging
12/20/1995EP0687405A1 Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture
12/20/1995EP0578737B1 Contact device for an electrical or electronic component
12/20/1995EP0451254B1 Multilayer circuit board having microporous layers and process for making same
12/20/1995EP0340241B1 High density electronic package comprising stacked sub-modules
12/20/1995CN1113607A A chip package, a chip carrier and a method for producing the same, a terminal electrode for a circuit substrate and a method for producing the same, and a chip package-mounted complex
12/19/1995US5477419 Method and apparatus for electrically connecting an electronic part to a circuit board
12/19/1995US5477086 Shaped, self-aligning micro-bump structures
12/19/1995US5476970 Reacting of an aromatic hydrocarbon and benzoyl peroxide
12/19/1995US5476947 Benzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the same
12/19/1995US5476726 Circuit board with metal layer for solder bonding and electronic circuit device employing the same
12/19/1995US5476690 Pattern formed by electroless plating using a photoresist; developable by aqueous alkaline solution
12/19/1995US5476688 Dividing starter aqueous plating solution into plurality of portions, forming baths of different concentrations, immersing powder substrate in each bath until depleted, rinsing between baths and at end of process, drying
12/19/1995US5476580 Processes for preparing a non-conductive substrate for electroplating
12/19/1995US5476211 Method of manufacturing electrical contacts, using a sacrificial member
12/19/1995US5476207 Method and apparatus for fluxing and soldering terminals on a printed circuit board
12/19/1995US5476039 Screen printing apparatus with magnetic support means for printing plate
12/15/1995EP0733264A4 Self centering coil
12/14/1995WO1995034106A1 Microelectronic contacts and assemblies
12/14/1995WO1995034096A1 Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof
12/14/1995WO1995033708A1 Process for preparing biscyanoacrylates
12/14/1995DE4420002A1 Pot core for inductive components e.g. code-based identification systems
12/14/1995DE4419667A1 Holder for SMT components on circuit board
12/14/1995DE19520700A1 Semiconductor element used e.g. as integrated circuit
12/14/1995DE19513354A1 Surface processing equipment
12/14/1995CA2192383A1 Process for preparing biscyanoacrylates
12/14/1995CA2188770A1 Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof
12/13/1995EP0687137A2 Solder medium for circuit interconnection
12/13/1995EP0687136A1 Method for selectively metallizing a substrate
12/13/1995EP0687009A2 Multi-layer electronic circuit package with dielectric polymer layers having different optical absorption strength and method of forming it
12/13/1995EP0687007A2 Electronic surface mount device and method for making
12/13/1995EP0686662A2 Conductive coatings
12/13/1995EP0686093A1 Metal on plastic films with adhesion-promoting layer
12/13/1995EP0686073A1 No-clean, low-residue, volatile organic compound free soldering flux and method of use
12/13/1995EP0624305A4 Carrier strip head interconnect assembly.
12/13/1995CN1113375A Method of depositing solid substance on a substrate
12/13/1995CN1113332A Resonant tag labels and method of making same
12/12/1995USRE35115 Cleaning soldering flux from printed wiring board; alkali metal salt of octanoic or nonanoic acid as hydrotrope
12/12/1995US5475606 Faraday cage for a printed circuit card
12/12/1995US5475567 Method for hermetically sealing a single layer ceramic thick film electronic module
12/12/1995US5475379 Solid phase conformal coating suitable for use with electronic devices
12/12/1995US5475264 Arrangement having multilevel wiring structure used for electronic component module
12/12/1995US5475263 Thick film hybrid multilayer circuit
12/12/1995US5475261 Semiconductor device having many lead pins
12/12/1995US5475260 Electronic read-only module
12/12/1995US5475205 Document verification system
12/12/1995US5475048 Free radical curable formulation of an unsaturated polyester or vinyl ester, thermoplastic resin and crosslinking agent
12/12/1995US5474957 Process of mounting tape automated bonded semiconductor chip on printed circuit board through bumps
12/12/1995US5474956 Curing and patterning the thin layer of polyimide dielectric
12/12/1995US5474798 Method for the manufacture of printed circuit boards
12/12/1995US5474741 Alternating unfired ceramic layers and flexible conforming retention layers which will become porous during firing when polymeric binders are volatialized