Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1995
11/22/1995EP0683516A2 Multilayer circuit board and multichip module substrate
11/22/1995EP0683513A1 Electronic package with multilevel connections
11/22/1995EP0683450A2 Card type semiconductor device and method of manufacturing it
11/22/1995EP0683434A1 Photo-polymerizable composition, and image forming method and color filter using the composition
11/22/1995EP0683190A2 Improved novolac type epoxy resin and electronic parts encapsulating resin composition
11/22/1995EP0683045A2 Method and apparatus for screen printing
11/22/1995EP0683008A1 Solder depositing composition and method of packaging using the same
11/22/1995EP0683007A1 Machining device
11/22/1995EP0683006A1 Soldering equipment for soldering electronic components
11/22/1995EP0682809A1 Method for the encapsulation of components or elecetronic units and devices encapsulated using said method
11/22/1995EP0682587A1 Wave-soldering using a shroud for a gas.
11/22/1995CN1112352A Process for wave soldering components on a printed circuit board in a temperature controlled nonoxidizing atmosphere
11/22/1995CN1112297A Electrically connecting structure
11/22/1995CN1112280A Polar electrnic component and mounting structure therefor
11/22/1995CN1112168A Apparatus, and corresponding method, for chemically etching substrates
11/22/1995CN1030292C Jig for detecting height of wavy solder surface, method of controlling height of solder surface
11/21/1995US5469526 Optical fiber support for printed circuit boards
11/21/1995US5469333 Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads
11/21/1995US5469330 Heat sink header assembly
11/21/1995US5469324 Integrated decoupling capacitive core for a printed circuit board and method of making same
11/21/1995US5469131 Hybrid integrated circuit device
11/21/1995US5469012 Electronic component
11/21/1995US5468996 Electronic package assembly and connector for use therewith
11/21/1995US5468995 Semiconductor device having compliant columnar electrical connections
11/21/1995US5468920 Printed circuit board having raised conductor pads
11/21/1995US5468919 Printed circuit board device with surface-mounted bar-like connectors
11/21/1995US5468918 Conductive member for electric circuit and electric circuit body, and method for fabricating them
11/21/1995US5468917 Circuitized structure including flexible circuit with elastomeric member bonded thereto
11/21/1995US5468790 Useful in forming interconnection structures for integrated semiconductor devices
11/21/1995US5468784 Polymerizable blend of acrylate monomer and epoxy acrylate with polymerization initiator and reactive diluent
11/21/1995US5468681 Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias
11/21/1995US5468679 Process for fabricating materials for ferroelectric, high dielectric constant, and integrated circuit applications
11/21/1995US5468655 Method for forming a temporary attachment between a semiconductor die and a substrate using a metal paste comprising spherical modules
11/21/1995US5468597 Selective metallization process
11/21/1995US5468591 Barrier layer for laser ablative imaging
11/21/1995US5468515 Composition and method for selective plating
11/21/1995US5468445 Firing metals to form oxides from conductive metals
11/21/1995US5468409 Aqueous cupric chloride saline solution; accuracy; printed circuits; radar
11/21/1995US5468345 Method of making a high-definition printed circuit
11/21/1995US5468315 Method of and apparatus for producing multilayer ceramic board
11/21/1995US5467913 Solder ball supply device
11/21/1995CA2116269C Method of making an article comprising solder bump bonding
11/18/1995CA2149497A1 Apparatus for mounting surface mount devices to a circuit board
11/16/1995WO1995031016A1 Flex circuit connector
11/16/1995WO1995030720A1 High temperature resistant antistatic pressure-sensitive adhesive tape
11/16/1995WO1995030703A1 Energy polymerizable compositions, homopolymers and copolymers of oxazolines
11/16/1995WO1995030509A1 Process for wave-soldering printed circuit boards
11/16/1995DE4417285A1 Appts. for soldering electronic circuits with multiple connection points to support
11/16/1995DE4416882A1 Mutual alignment of film and circuit board for printing
11/16/1995DE4416747A1 Wet treating of objects
11/16/1995DE19516193A1 Coating circuit boards
11/16/1995CA2188277A1 Energy polymerizable compositions, homopolymers and copolymers of oxazolines
11/16/1995CA2165812A1 Flex circuit connector
11/15/1995EP0682368A2 Metallization for polymer-dielectric multichip modules
11/15/1995EP0682367A1 Packaged semiconductor device and a manufacturing process therefor
11/15/1995EP0682366A2 Mounting of integrated circuit devices
11/15/1995EP0682365A1 Three-dimensional interconnection of electronic component housings using printed circuits
11/15/1995EP0682363A2 Via-structure of a multilayer interconnection ceramic substrate
11/15/1995EP0682085A2 Curable organosiloxane compositions containing low temperature reactive adhesion additives
11/15/1995EP0682069A2 Adhesion promoting additives and low temperature curing organosiloxane compositions containing same
11/15/1995EP0626124A4 High density conductive networks and method and apparatus for making same.
11/15/1995CN1111898A A method for the production of a printed circuit which is ready for soldering
11/15/1995CN1111833A Pinned module
11/15/1995CN1111685A Non-cyanide copper-zinc electroplating bath, method of surface treatment of copper foil for printed wiring board using the same and copper foil for printed wiring board
11/15/1995CN1111567A Copper clad laminate, multilayer printed circuit board and their processing method
11/14/1995US5467252 Method for plating using nested plating buses and semiconductor device having the same
11/14/1995US5467251 Printed circuit boards and heat sink structures
11/14/1995US5466972 Multilayer integrated circuits, titanium-palladium alloy, improved adhesion
11/14/1995US5466908 Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards
11/14/1995US5466653 Method for preparing negative-working wash-off relief images and non-photosensitive elements for use therein
11/14/1995US5466635 Process for making an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating
11/14/1995US5466330 Handling apparatus for ceramic green sheet
11/14/1995US5466161 Compliant stacking connector for printed circuit boards
11/14/1995US5465898 Process for producing a metal-ceramic substrate
11/14/1995CA2055473C Copper alloy compositions
11/12/1995CA2147522A1 Method of coating a substrate with copper
11/09/1995WO1995030178A1 Method of photolithographically producing a copper pattern on a plate of an electrically insulating material
11/09/1995DE4416788A1 Verfahren zum Wellenlöten von Leiterplatten A method for wave soldering of printed circuit boards
11/09/1995DE4416146A1 Catch attachment to retain SIM block on circuit board
11/09/1995DE19514479A1 Appts. for etching circuit boards
11/08/1995EP0681418A2 Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere
11/08/1995EP0681417A2 Solder tool
11/08/1995EP0681416A2 Printed circuit board and method of connecting electronic parts
11/08/1995EP0681322A2 Bonded ceramic metal composite substrates and circuit boards constructed therewith
11/08/1995EP0681306A1 Electric component
11/08/1995EP0680660A1 Conductive lacquer contact surface.
11/08/1995EP0680523A1 Preparation of alumina ceramic surfaces for electroless and electrochemical metal deposition
11/08/1995CN1111439A Electric units for surface fastening
11/08/1995CN1111357A Printed circuit board test fixture and method
11/07/1995US5465229 Single in-line memory module
11/07/1995US5464950 Aluminum nitride circuit board and method of producing same
11/07/1995US5464725 Method of manufacturing a printed wiring board
11/07/1995US5464690 Holographic document and method for forming
11/07/1995US5464682 Minimal capture pads applied to ceramic vias in ceramic substrates
11/07/1995US5464662 Fabrication method of printed wiring board
11/07/1995US5464653 Method for interconnection of metal layers of the multilayer network of an electronic board, and the resultant board
11/07/1995US5464652 Green ceramic via metallization technique
11/07/1995US5464557 Oxidative stable cleaning solvent mixtures
11/07/1995US5464553 Low foaming effective hydrotrope
11/07/1995US5464494 Heat resistance
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