| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/18/1995 | US5407488 Method and apparatus for in-situ removal of material from openings in a stencil |
| 04/18/1995 | US5407416 Automatic tool change device for printed circuit board machines |
| 04/18/1995 | US5407121 Fluxless soldering of copper |
| 04/18/1995 | US5406701 Fabrication of dense parallel solder bump connections |
| 04/18/1995 | CA2017080C Semiconductor device package structure |
| 04/14/1995 | CA2121374A1 Soldering process and apparatus |
| 04/14/1995 | CA2117952A1 Perfecting the processes for manufacturing service boxes and their components |
| 04/13/1995 | WO1995010172A1 Metal-cored printed circuit board for insertion into the casing of an electronic device |
| 04/13/1995 | WO1995010170A1 Compliant stacking connector for printed circuit boards |
| 04/13/1995 | DE4334390A1 Process for the preparation of a processable, conductive, colloidal polymer |
| 04/13/1995 | DE4334355A1 Information transmitter |
| 04/13/1995 | CA2173591A1 Metal-cored printed circuit board for insertion into the casing of an electronic device |
| 04/12/1995 | EP0647991A2 Boardlock clip |
| 04/12/1995 | EP0647952A1 Electrical overstress pulse protection |
| 04/12/1995 | EP0647871A1 Method for manufacturing a substrate having window-shaped coating films and frame-shaped coating film on the surface thereof |
| 04/12/1995 | EP0647729A1 Method of providing a metal pattern on an electrically insulating substrate in an electroless process |
| 04/12/1995 | EP0647389A1 Annular circuit components coupled with printed circuit board through-hole. |
| 04/12/1995 | EP0647251A1 Surface mount conductive adhesives |
| 04/12/1995 | EP0588793B1 Housing for motor vehicle electronics |
| 04/11/1995 | US5406459 Surface mounting module for an electric circuit board |
| 04/11/1995 | US5406458 Printed circuit board having tapered contact pads for surface mounted electrical components |
| 04/11/1995 | US5406119 Lead frame |
| 04/11/1995 | US5406034 Circuit board having stepped vias |
| 04/11/1995 | US5406027 Mounting structure and electronic device employing the same |
| 04/11/1995 | US5405731 Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits |
| 04/11/1995 | US5405707 Copper paste for internal conductor of multilayer ceramic electronic component |
| 04/11/1995 | US5405704 Plates having random crystal orientation, little texture and resistanace to cyclic temperature changes |
| 04/11/1995 | US5405686 Article coated with kured homogeneous thermoset resin/thermoplastic particles |
| 04/11/1995 | US5405656 Electroless plating; then radiation |
| 04/11/1995 | US5405547 Non-chlorinated cleaner-drier |
| 04/11/1995 | US5405466 Method of manufacturing multilayer ceramic electronic component |
| 04/11/1995 | US5405283 CO2 cleaning system and method |
| 04/11/1995 | US5405267 Board-mounting rack for plurality of electrical connectors |
| 04/11/1995 | US5404637 Method of manufacturing multilayer printed wiring board |
| 04/11/1995 | CA1335190C Printed circuit board |
| 04/06/1995 | WO1995009521A1 Local hardening method of a semiconductor integrated circuit |
| 04/06/1995 | WO1995009456A1 Array of conductive pathways |
| 04/06/1995 | WO1995009452A1 Microwave circuit |
| 04/06/1995 | WO1995009437A1 Method for assembling an electronic package |
| 04/06/1995 | WO1995009436A1 Patterned array of uniform metal microbeads |
| 04/06/1995 | WO1995009255A1 Method of protecting solderable copper and copper-alloy surfaces from corrosion |
| 04/06/1995 | DE4334150A1 Method for manufacturing complete assemblies |
| 04/06/1995 | DE4333608A1 Method for presoldering component connections and component carriers |
| 04/06/1995 | DE4333299A1 Method and device for producing beads on the connecting wires of an electronic component, as well as an electronic component |
| 04/06/1995 | CA2171190A1 Patterned array of uniform metal microbeads |
| 04/06/1995 | CA2133635A1 Electrical connector having reduced cross-talk |
| 04/05/1995 | EP0647090A1 Printed wiring board and a method of manufacturing such printed wiring boards |
| 04/05/1995 | EP0647089A1 Process for the manufacture of three dimensional plastic parts having integrated conductive tracks |
| 04/05/1995 | EP0647088A2 Electrical connector |
| 04/05/1995 | EP0646971A2 Two-terminal SMT-miniature-housing of semiconductor device and process of manufacturing the same |
| 04/05/1995 | EP0646962A1 Metal sheet processing method and lead frame processing method, and lead frame and semiconductor device manufacturing method and semiconductor device |
| 04/05/1995 | EP0646954A2 Low-defect one-step etching process |
| 04/05/1995 | EP0646661A1 Method for removing soldering flux |
| 04/05/1995 | EP0646290A1 Face-mount connector |
| 04/05/1995 | EP0646281A1 Thermal protection device and process for activating the same. |
| 04/05/1995 | EP0646048A1 Electrically conductive compositions and methods for the preparation and use thereof |
| 04/05/1995 | CN1101206A Printer system for printing circuit patterns or like on base board |
| 04/04/1995 | US5404408 Miniature hearing aid to be worn on the head, and a method for the manufacture thereof |
| 04/04/1995 | US5404312 Automatic designing system capable of designing a logic circuit as desired |
| 04/04/1995 | US5404309 Cad apparatus for designing pattern of electric circuit |
| 04/04/1995 | US5404239 Liquid crystal display with flexible circuit holding driver circuit having notches for engaging curable member |
| 04/04/1995 | US5404044 Parallel process interposer (PPI) |
| 04/04/1995 | US5404021 Laser sensor for detecting the extended state of an object in continuous motion |
| 04/04/1995 | US5403978 Two-layer or multilayer printed circuit board |
| 04/04/1995 | US5403975 Anodized aluminum electronic package components |
| 04/04/1995 | US5403973 Custom conformal heat sinking device for electronic circuit cards and methods of making the same |
| 04/04/1995 | US5403869 Curable blend also including an epoxy resin, epoxy compounds, photoinitiator and tin compound; accurate positioning of wires on printed circuit; voidless; flexible; heat and solvent resistance |
| 04/04/1995 | US5403785 Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby |
| 04/04/1995 | US5403776 Process of using a jig to align and mount terminal conductors to a semiconductor plastic package |
| 04/04/1995 | US5403701 Using lift-off approach; forming, patterning, removing barrier plane, photoresist; taut membrane |
| 04/04/1995 | US5403700 Method of making a thin film electrical component |
| 04/04/1995 | US5403684 PCB tooling apparatus and method for forming patterns in registration on both sides of a substrate |
| 04/04/1995 | US5403672 Metal foil for printed wiring board and production thereof |
| 04/04/1995 | US5403671 Product for surface mount solder joints |
| 04/04/1995 | US5403650 Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby |
| 04/04/1995 | US5403649 Fabricating metal articles from printed images |
| 04/04/1995 | US5403616 Method for forming patterned transparent conducting film |
| 04/04/1995 | US5403527 Method of making patterned electrically conductive structures |
| 04/04/1995 | US5403467 Forming through-holes in copper-laminated circuit boards, oxidizing with alkaline potassium permanganate solution, rinsing with water, treating with 3,4-ethylenedioxythiophene emulsion and acid, rinsing, electrodepositing copper |
| 04/04/1995 | US5403465 Comprising a matte-side raw roughened layer of copper or copper oxide and at least one metallic metal or alloy barrier layer; tensile strength, elongation, heat resistance |
| 04/04/1995 | US5403438 Process for forming pattern |
| 04/04/1995 | US5403420 Heating and applying pressure to stack of fluoropolymer flexible layers in lamination fixture while controlling adhesion |
| 04/04/1995 | US5403376 A metal powder mixtures consisting of different particle sizes , the larger particle will melt first to fill the voids surrounding other particles; flow control agents for molten metal |
| 04/04/1995 | US5403202 Low insertion force/low profile flex connector |
| 04/04/1995 | US5403107 Cleaning device particularly for printed circuit boards |
| 04/04/1995 | US5402719 Silk screen work stations and clamp mechanism assemblies for the precise positioning and support of the work pieces |
| 04/04/1995 | US5402563 Apparatus for removing electronic device from printed circuit board |
| 03/30/1995 | WO1995008403A1 Method and apparatus for soldering circuit boards |
| 03/30/1995 | DE4332996A1 Plug connector for making contact with a printed circuit board |
| 03/30/1995 | DE4332770A1 Arrangement of a power component on a printed circuit board |
| 03/30/1995 | DE4332752A1 Component and method for its production |
| 03/30/1995 | DE4332282A1 Method for the production of printed circuits |
| 03/30/1995 | CA2149541A1 Method and apparatus for soldering circuit boards |
| 03/29/1995 | EP0645953A1 Method of producing a two or multilayer wiring structure and two or multilayer structure made thereof |
| 03/29/1995 | EP0645952A1 Method of manufacturing a multilayer circuit |
| 03/29/1995 | EP0645951A1 Printed circuit board and method of manufacturing the same |
| 03/29/1995 | EP0645950A1 Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same |
| 03/29/1995 | EP0645949A2 Printed circuit board and liquid crystal display |
| 03/29/1995 | EP0645948A1 Surface mount solder assembly of leadless integrated circuit packages to substrates |
| 03/29/1995 | EP0645276A2 Combination instrument |