Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1998
03/12/1998DE19641863C1 Electrical component suction surface formation method e.g. for SMD components on PCB
03/12/1998DE19639954C1 Liquid crystal display assembly used e.g. for electronic weigher
03/12/1998DE19638732A1 Electrical precision resistances applying method for plastic circuit board
03/12/1998DE19636756A1 Multilayer technology inductance components mfr
03/12/1998DE19636112A1 Carrier element for semiconductor chip
03/12/1998CA2265578A1 Electronic article surveillance protection for printed circuit boards
03/12/1998CA2264595A1 Method of transferring metal leaf to a substrate
03/12/1998CA2185304A1 Digital data crosspoint switch with mirror pin-outs
03/11/1998EP0828410A2 Dual-solder process for enhancing reliability of thick-film hybrid circuits
03/11/1998EP0828293A1 Reflow soldering method for surface mounted semiconductor device
03/11/1998EP0828291A2 Fine pitch via formation using diffusion patterning techniques
03/11/1998EP0828261A1 Control circuit for positioning a mobile element, in particular used in a device controlling the inclination of a vehicle headlamp, and method of fabrication thereof
03/11/1998EP0828260A1 Control circuit for positioning a mobile element, in particular used in a device controlling the inclination of a vehicle headlamp, and method of fabrication thereof
03/11/1998EP0827802A1 Method to produce a weakening line using a laser
03/11/1998EP0827800A1 Solder leveller
03/11/1998EP0827633A1 Semiconductor assembly
03/11/1998EP0827632A1 Semiconductor device having a semiconductor chip electrically connected to a wiring substrate
03/11/1998EP0827627A1 A method of selectively metallising an inner, electrically insulating surface of an open body, and a scan velocity modulator manufactured using such a method
03/11/1998EP0759100B1 Device for processing printed circuit boards
03/11/1998CN1175882A Vibrator holding device
03/11/1998CN1175880A Machine for punching printed circuit plate
03/11/1998CN1037707C Azeotrope -like mixtures of 1, 1 -dichloro -2, 2, 2 -trifluoroethane and 1, 1 -dichloro -1 -fluoroethane
03/10/1998US5726863 Multilayer printed circuit board
03/10/1998US5726862 Electrical component having formed leads
03/10/1998US5726861 Surface mount component height control
03/10/1998US5726859 Circuit board component retainer and extractor
03/10/1998US5726623 Thermistor mounting arrangement
03/10/1998US5726612 Chip-type electronic component
03/10/1998US5726580 Universal wafer carrier for wafer level die burn-in
03/10/1998US5726568 Magneto-repulsion punching with dynamic damping
03/10/1998US5726501 Semiconductor device having a solder drawing layer
03/10/1998US5726493 Semiconductor device and semiconductor device unit having ball-grid-array type package structure
03/10/1998US5726482 Device-under-test card for a burn-in board
03/10/1998US5725972 Multilayer radiation transparent, opaque region, transition region and patterns
03/10/1998US5725938 Metallization of ceramic through application of an adherent reducible layer
03/10/1998US5725937 Component of printed circuit boards
03/10/1998US5725819 Injection molding method for board for IC card
03/10/1998US5725807 Carbon containing composition for electroplating
03/10/1998US5725706 Smooth pressure bonded layer, precious metals
03/10/1998US5725640 Solution containing an acid and a salt of an inorganic or organic nitrogen compound
03/10/1998US5725392 Continuous molded electrical connector with pins
03/10/1998US5725143 Method and machine for wave soldering or tinning
03/10/1998US5724889 Stencil shifter
03/10/1998US5724728 Method of mounting an integrated circuit to a mounting surface
03/10/1998US5724727 Method of forming electronic component
03/05/1998WO1998009487A1 Method and device for supplying flux
03/05/1998WO1998009486A1 Device with an electrical circuit for controlling the restraining elements of a vehicle
03/05/1998WO1998009485A1 Pattern plating method for fabricating printed circuit boards
03/05/1998WO1998009350A1 Electrical terminal with integral capacitive filter
03/05/1998WO1998009341A1 Improved isolation in multi-layer structures
03/05/1998WO1998009332A1 Semiconductor device provided with low melting point metal bumps and process for producing same
03/05/1998WO1998009331A1 Heat sink assembly and method of transferring heat
03/05/1998WO1998009321A1 Process for selective application of solder
03/05/1998WO1998008672A1 Metal ceramic composites with improved interfacial properties
03/05/1998WO1998008644A1 Method and apparatus for forming termination stripes
03/05/1998DE19654250A1 Production of oxidation-sensitive soldered joints
03/05/1998DE19635732A1 Carrier substrate for semiconductor chip of e.g. chip card
03/05/1998DE19635575A1 Surface-mounted electronic component, e.g. relay
03/05/1998DE19635178A1 Photolithographic exposure method for plate or foil
03/05/1998DE19634646A1 Verfahren zur selektiven Belotung Process for the selective Belotung
03/04/1998EP0827372A2 Electronic control module
03/04/1998EP0827198A2 Metal ceramic substrates for semiconductors of high reliability
03/04/1998EP0826793A1 Composition for stripping tin or tin alloys
03/04/1998EP0826503A2 Laser welding nonmetallic assemblies, such as T.A.B. tapes to semiconductor elements, particularly inkjet printheads
03/04/1998EP0826457A1 A method of drilling a hole in a workpiece
03/04/1998EP0826152A1 Method and apparatus for testing semiconductor dice
03/04/1998EP0670081B1 Coaxial high-frequency plug-type connector for multiple coaxial lines
03/04/1998EP0649562B1 Circuit protection device
03/04/1998CN1175344A Copper coating
03/04/1998CN1175286A Process for the corrosion protectio of copper or copper alloys
03/04/1998CN1175285A Printed circuit board manufacture
03/04/1998CN1175284A Silver plating
03/04/1998CN1175185A Method and device for fixing chip protection layer on circuit board
03/04/1998CN1175089A Structural unit for installing semiconductor device on substrate and installing method
03/03/1998US5724439 Inspecting apparatus of mounted component
03/03/1998US5724232 Chip carrier having an organic photopatternable material and a metal substrate
03/03/1998US5724056 Method for constructing a liquid crystal display
03/03/1998US5723903 Thin type semiconductor device, module structure using the device and method of mounting the device on board
03/03/1998US5723902 Surface mounting type electronic component
03/03/1998US5723823 Circuit board with enhanced rework configuration
03/03/1998US5723798 Measuring and controlling panel singulation shock
03/03/1998US5723701 Saturated linear polyfluorohydrocarbons, processes for their production, and their use in cleaning compositions
03/03/1998US5723359 Method for concurrently forming thin film resistor and thick film resistor on a hybrid integrated circuit substrate
03/03/1998US5723262 Photocurable mixture of phenolic polymer and unsaturated monomer having an epoxy or isocyanate group; heat, plating, and alkali resistance; adhesives, solder resists
03/03/1998US5723205 Fabrication multilayer combined rigid/flex printer circuit board
03/03/1998US5723073 Conductive paste containing 2-tetradecanol and ceramic circuit substrate using the same
03/03/1998US5723062 Ferric ammonium sulfate, phosphoric or sulfuric acid
03/03/1998US5722767 LED display panel structure
03/03/1998US5722741 Electrohydraulic pressure control device
03/03/1998US5722582 Hot air circulation for wave soldering machines
03/03/1998US5722581 Method and device for wave soldering incorporating a dry fluxing operation
03/03/1998US5722162 Fabrication procedure for a stable post
03/03/1998US5722160 Packaging method of BGA type electronic component
03/03/1998US5722159 Method for retention of a fragile conductive trace with a protective clamp
03/03/1998US5722137 Method for making a high density interconnect for an ultrasonic phased array
02/1998
02/26/1998WO1998008368A1 Method and apparatus for orienting miniature components
02/26/1998WO1998008363A1 Method for manufacturing a device for burning off thermal energy produced by electronic components embedded in a printed circuit card, and resulting device
02/26/1998WO1998008362A1 Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
02/26/1998WO1998008361A1 High performance flexible laminate
02/26/1998WO1998008191A1 Method for manufacturing an electric and mechanical connexion in a chip card module placed in a card holder recess
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