Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1998
03/31/1998US5733597 Snuff back controlled coating dispensing apparatus and methods
03/31/1998US5733468 Copper
03/31/1998US5733467 Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
03/31/1998US5733466 Electrolytic method of depositing gold connectors on a printed circuit board
03/31/1998US5733465 Process for producing cutting die and produced cutting die
03/31/1998US5733378 Propylene glycol methyl ether acetate
03/31/1998US5733376 Apparatus for spray coating opposing major surfaces of a workpiece
03/31/1998CA2069641C Method for removing contaminants from the surfaces of articles
03/26/1998WO1998012903A1 A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion
03/26/1998WO1998012897A1 Modularized hearing aid circuit structure
03/26/1998WO1998012738A1 Fluxless solder ball attachment process
03/26/1998WO1998012596A1 Method for assembling layers with a transfer process using a cross-linkable adhesive layer
03/26/1998DE19723074A1 Laminography system for inspection of electronic connection and automatic warp compensation
03/26/1998DE19702532A1 Embedded integrated circuit chip smart card, e.g. for bank, identification card
03/26/1998DE19639232A1 Fluxless metallisation of workpieces, particularly circuit boards
03/26/1998CA2265992A1 A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion
03/26/1998CA2265947A1 Modularized hearing aid circuit structure
03/26/1998CA2216352A1 Press-in pin with an elastic press-in region
03/25/1998EP0831683A1 Assemblies of substrates and electronic components
03/25/1998EP0831682A1 Circuit board
03/25/1998EP0831528A2 Multilayer wiring board for mounting semiconductor device and method of producing the same
03/25/1998EP0831525A2 Method for forming protruding electrode
03/25/1998EP0830642A1 Film-stripping process
03/25/1998EP0793903B1 Coating for the structured production of conductors on the surface of electrically insulating substrates
03/25/1998CN1177346A Energy-activatable salt with fluorocarbon anions
03/25/1998CN1177274A Method and apparatus for solder stenciling circuit boards
03/25/1998CN1177273A Printed circuit board
03/25/1998CN1177272A Cirucit substrate, circuit-formed suspension substrate, and prodn. method thereof
03/25/1998CN1177206A Semiconductor device and mounting method therefor
03/24/1998US5731960 Printed circuit board
03/24/1998US5731958 Gravity latch for surface mount components
03/24/1998US5731854 Method of effectively dispersing static electricity in LCD production by placing a short line in the end region of one substrate which extends beyond the other substrate
03/24/1998US5731636 Semiconductor bonding package
03/24/1998US5731547 Circuitized substrate with material containment means and method of making same
03/24/1998US5731086 Nonconductor, isotropic film
03/24/1998US5731073 Reusable, selectively conductive, Z-axis, elastomeric composite substrate
03/24/1998US5731067 Multi-layered substrate
03/24/1998US5731066 Electronic circuit device
03/24/1998US5731047 Multiple frequency processing to improve electrical resistivity of blind micro-vias
03/24/1998US5730932 Microelectronics
03/24/1998US5730890 Method for conditioning halogenated polymeric materials and structures fabricated therewith
03/24/1998US5730866 Automatic ionic cleanliness tester
03/24/1998US5730853 Depositing copper layer over cleaned surface; heating; applying acid to remove oxides
03/24/1998US5730620 Method and apparatus for locating electrical circuit members
03/24/1998US5730619 Externally locked connector
03/24/1998US5730543 Electrically conducting connection
03/24/1998US5730051 Apparatus and method for centering a printing screen over an object
03/24/1998US5729897 Method of manufacturing multilayer foil printed circuit boards
03/24/1998US5729896 Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder
03/24/1998US5729893 Process for producing a multilayer ceramic circuit substrate
03/19/1998WO1998011765A2 Improvements relating to inductive assemblies in electronic circuits
03/19/1998WO1998011757A1 Digital crosspoint switch
03/19/1998WO1998011605A1 Circuit board for mounting electronic parts
03/19/1998WO1998010920A1 Maleimide containing formulations and uses therefor
03/19/1998DE19637551A1 Production of ceramic constructional element, e.g. capacitor
03/18/1998EP0830054A1 Process for manufacturing rigid and flexible circuits
03/18/1998EP0829765A1 Photosensitive resin composition
03/18/1998EP0829324A1 Solder paste
03/18/1998EP0829323A2 Infrared heater
03/18/1998EP0829187A2 Chip socket assembly and chip file assembly for semiconductor chips
03/18/1998EP0829186A1 Composite materials
03/18/1998EP0828815A1 Azeotrope-like compositions and their use
03/18/1998EP0828580A1 Process and device for the wave or vapour-phase soldering of electronic units
03/18/1998EP0699340B1 An electric fuse and protective circuit
03/18/1998EP0643902B1 Improved stencil or mask for applying solder to circuit boards and support frame therefor
03/18/1998CN1176571A Multilayer metallized printing plate and its forming module
03/18/1998CN1176505A Self-aligning low profile socket for connecting ball grid array devices through dendritic interposer
03/18/1998CN1176239A Large ceramic article and method of manufacturing
03/17/1998US5729440 Solder hierarchy for chip attachment to substrates
03/17/1998US5729439 Printed wiring substrate
03/17/1998US5729438 Discrete component pad array carrier
03/17/1998US5729437 Electronic part including a thin body of molding resin
03/17/1998US5729435 Semiconductor device and assembly board having through-holes filled with filling core
03/17/1998US5729433 Assembly for mounting electronic components
03/17/1998US5729346 Method and apparatus for testing automatic insertion state of electronic component in printed circuit board
03/17/1998US5729316 Liquid crystal display module
03/17/1998US5729315 Circuit assembly and process for production thereof
03/17/1998US5728601 Process for manufacturing a single in-line package for surface mounting
03/17/1998US5728600 Circuit encapsulation process
03/17/1998US5728506 Lithographic processes employing radiation sensitive polymers and photosensitive acid generators
03/17/1998US5728505 Flexible photopolymerizable coating with alkaline developers for protective coatings
03/17/1998US5728473 Multilayer composites on silicon plates, copper films and polyimidesiloxane adhesives
03/17/1998US5728247 Method for mounting a circuit
03/17/1998US5727956 Connector assembly including metal strips as contact members
03/17/1998US5727727 Flowing solder in a gap
03/17/1998US5727461 Method of forming fiducials, and stencils containing such fiducials
03/17/1998US5727310 Method of manufacturing a multilayer electronic circuit
03/12/1998WO1998010628A1 Carrier element(1) for a semi-conductor chip
03/12/1998WO1998010627A1 Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components
03/12/1998WO1998010626A1 Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg
03/12/1998WO1998010389A1 Electronic article surveillance protection for printed circuit boards
03/12/1998WO1998010251A1 Device for dispensing small amounts of material
03/12/1998WO1998010121A1 Method for anisotropic etching of structures in conducting materials
03/12/1998WO1998010029A1 High temperature resistant antistatic pressure-sensitive adhesive tape
03/12/1998WO1998009815A1 Method of transferring metal leaf to a substrate
03/12/1998WO1998002756A3 Method of and device for inspecting a PCB
03/12/1998WO1997043656A3 Wafer-level burn-in and test
03/12/1998DE19738118A1 Semiconductor device mounting on circuit board
03/12/1998DE19736896A1 Gehäuse für Halbleiterbauteile Enclosure for semiconductor devices
03/12/1998DE19645875A1 Electro plating of sheet workpieces