Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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03/31/1998 | US5733597 Snuff back controlled coating dispensing apparatus and methods |
03/31/1998 | US5733468 Copper |
03/31/1998 | US5733467 Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same |
03/31/1998 | US5733466 Electrolytic method of depositing gold connectors on a printed circuit board |
03/31/1998 | US5733465 Process for producing cutting die and produced cutting die |
03/31/1998 | US5733378 Propylene glycol methyl ether acetate |
03/31/1998 | US5733376 Apparatus for spray coating opposing major surfaces of a workpiece |
03/31/1998 | CA2069641C Method for removing contaminants from the surfaces of articles |
03/26/1998 | WO1998012903A1 A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion |
03/26/1998 | WO1998012897A1 Modularized hearing aid circuit structure |
03/26/1998 | WO1998012738A1 Fluxless solder ball attachment process |
03/26/1998 | WO1998012596A1 Method for assembling layers with a transfer process using a cross-linkable adhesive layer |
03/26/1998 | DE19723074A1 Laminography system for inspection of electronic connection and automatic warp compensation |
03/26/1998 | DE19702532A1 Embedded integrated circuit chip smart card, e.g. for bank, identification card |
03/26/1998 | DE19639232A1 Fluxless metallisation of workpieces, particularly circuit boards |
03/26/1998 | CA2265992A1 A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion |
03/26/1998 | CA2265947A1 Modularized hearing aid circuit structure |
03/26/1998 | CA2216352A1 Press-in pin with an elastic press-in region |
03/25/1998 | EP0831683A1 Assemblies of substrates and electronic components |
03/25/1998 | EP0831682A1 Circuit board |
03/25/1998 | EP0831528A2 Multilayer wiring board for mounting semiconductor device and method of producing the same |
03/25/1998 | EP0831525A2 Method for forming protruding electrode |
03/25/1998 | EP0830642A1 Film-stripping process |
03/25/1998 | EP0793903B1 Coating for the structured production of conductors on the surface of electrically insulating substrates |
03/25/1998 | CN1177346A Energy-activatable salt with fluorocarbon anions |
03/25/1998 | CN1177274A Method and apparatus for solder stenciling circuit boards |
03/25/1998 | CN1177273A Printed circuit board |
03/25/1998 | CN1177272A Cirucit substrate, circuit-formed suspension substrate, and prodn. method thereof |
03/25/1998 | CN1177206A Semiconductor device and mounting method therefor |
03/24/1998 | US5731960 Printed circuit board |
03/24/1998 | US5731958 Gravity latch for surface mount components |
03/24/1998 | US5731854 Method of effectively dispersing static electricity in LCD production by placing a short line in the end region of one substrate which extends beyond the other substrate |
03/24/1998 | US5731636 Semiconductor bonding package |
03/24/1998 | US5731547 Circuitized substrate with material containment means and method of making same |
03/24/1998 | US5731086 Nonconductor, isotropic film |
03/24/1998 | US5731073 Reusable, selectively conductive, Z-axis, elastomeric composite substrate |
03/24/1998 | US5731067 Multi-layered substrate |
03/24/1998 | US5731066 Electronic circuit device |
03/24/1998 | US5731047 Multiple frequency processing to improve electrical resistivity of blind micro-vias |
03/24/1998 | US5730932 Microelectronics |
03/24/1998 | US5730890 Method for conditioning halogenated polymeric materials and structures fabricated therewith |
03/24/1998 | US5730866 Automatic ionic cleanliness tester |
03/24/1998 | US5730853 Depositing copper layer over cleaned surface; heating; applying acid to remove oxides |
03/24/1998 | US5730620 Method and apparatus for locating electrical circuit members |
03/24/1998 | US5730619 Externally locked connector |
03/24/1998 | US5730543 Electrically conducting connection |
03/24/1998 | US5730051 Apparatus and method for centering a printing screen over an object |
03/24/1998 | US5729897 Method of manufacturing multilayer foil printed circuit boards |
03/24/1998 | US5729896 Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder |
03/24/1998 | US5729893 Process for producing a multilayer ceramic circuit substrate |
03/19/1998 | WO1998011765A2 Improvements relating to inductive assemblies in electronic circuits |
03/19/1998 | WO1998011757A1 Digital crosspoint switch |
03/19/1998 | WO1998011605A1 Circuit board for mounting electronic parts |
03/19/1998 | WO1998010920A1 Maleimide containing formulations and uses therefor |
03/19/1998 | DE19637551A1 Production of ceramic constructional element, e.g. capacitor |
03/18/1998 | EP0830054A1 Process for manufacturing rigid and flexible circuits |
03/18/1998 | EP0829765A1 Photosensitive resin composition |
03/18/1998 | EP0829324A1 Solder paste |
03/18/1998 | EP0829323A2 Infrared heater |
03/18/1998 | EP0829187A2 Chip socket assembly and chip file assembly for semiconductor chips |
03/18/1998 | EP0829186A1 Composite materials |
03/18/1998 | EP0828815A1 Azeotrope-like compositions and their use |
03/18/1998 | EP0828580A1 Process and device for the wave or vapour-phase soldering of electronic units |
03/18/1998 | EP0699340B1 An electric fuse and protective circuit |
03/18/1998 | EP0643902B1 Improved stencil or mask for applying solder to circuit boards and support frame therefor |
03/18/1998 | CN1176571A Multilayer metallized printing plate and its forming module |
03/18/1998 | CN1176505A Self-aligning low profile socket for connecting ball grid array devices through dendritic interposer |
03/18/1998 | CN1176239A Large ceramic article and method of manufacturing |
03/17/1998 | US5729440 Solder hierarchy for chip attachment to substrates |
03/17/1998 | US5729439 Printed wiring substrate |
03/17/1998 | US5729438 Discrete component pad array carrier |
03/17/1998 | US5729437 Electronic part including a thin body of molding resin |
03/17/1998 | US5729435 Semiconductor device and assembly board having through-holes filled with filling core |
03/17/1998 | US5729433 Assembly for mounting electronic components |
03/17/1998 | US5729346 Method and apparatus for testing automatic insertion state of electronic component in printed circuit board |
03/17/1998 | US5729316 Liquid crystal display module |
03/17/1998 | US5729315 Circuit assembly and process for production thereof |
03/17/1998 | US5728601 Process for manufacturing a single in-line package for surface mounting |
03/17/1998 | US5728600 Circuit encapsulation process |
03/17/1998 | US5728506 Lithographic processes employing radiation sensitive polymers and photosensitive acid generators |
03/17/1998 | US5728505 Flexible photopolymerizable coating with alkaline developers for protective coatings |
03/17/1998 | US5728473 Multilayer composites on silicon plates, copper films and polyimidesiloxane adhesives |
03/17/1998 | US5728247 Method for mounting a circuit |
03/17/1998 | US5727956 Connector assembly including metal strips as contact members |
03/17/1998 | US5727727 Flowing solder in a gap |
03/17/1998 | US5727461 Method of forming fiducials, and stencils containing such fiducials |
03/17/1998 | US5727310 Method of manufacturing a multilayer electronic circuit |
03/12/1998 | WO1998010628A1 Carrier element(1) for a semi-conductor chip |
03/12/1998 | WO1998010627A1 Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components |
03/12/1998 | WO1998010626A1 Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg |
03/12/1998 | WO1998010389A1 Electronic article surveillance protection for printed circuit boards |
03/12/1998 | WO1998010251A1 Device for dispensing small amounts of material |
03/12/1998 | WO1998010121A1 Method for anisotropic etching of structures in conducting materials |
03/12/1998 | WO1998010029A1 High temperature resistant antistatic pressure-sensitive adhesive tape |
03/12/1998 | WO1998009815A1 Method of transferring metal leaf to a substrate |
03/12/1998 | WO1998002756A3 Method of and device for inspecting a PCB |
03/12/1998 | WO1997043656A3 Wafer-level burn-in and test |
03/12/1998 | DE19738118A1 Semiconductor device mounting on circuit board |
03/12/1998 | DE19736896A1 Gehäuse für Halbleiterbauteile Enclosure for semiconductor devices |
03/12/1998 | DE19645875A1 Electro plating of sheet workpieces |