| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/09/1998 | WO1998015065A1 Slotline-mounted flip chip structures |
| 04/09/1998 | WO1998015064A1 Slotline-mounted flip chip |
| 04/09/1998 | WO1998014995A1 Flip chip assembly method |
| 04/09/1998 | WO1998014859A1 Adapter for network card |
| 04/09/1998 | WO1998014822A1 Method and apparatus for bonding of adhesive tape of liquid crystal panel |
| 04/09/1998 | WO1998014357A1 Valve control device with tridimensional printed board in mid technology |
| 04/09/1998 | WO1998014299A1 Tacking processes and systems for soldering |
| 04/09/1998 | DE19743737A1 Thick layer circuit board, e.g. for IC ignition, motor control |
| 04/09/1998 | DE19701165C1 Chip card module |
| 04/09/1998 | DE19640959A1 Multilayer circuit or sensor substrate of glass-ceramic |
| 04/09/1998 | DE19640261A1 Ventilsteuergerät mit dreidimensionaler Leiterplatte in MID-Technik Valve controller with three-dimensional circuit board in MID technology |
| 04/08/1998 | EP0835047A2 RF-driven semiconductor device |
| 04/08/1998 | EP0835046A1 Component mounting board, process for producing the board, and process for producing the module |
| 04/08/1998 | EP0834921A2 Multi-layer circuit construction method and structures with customization features and components for use therein |
| 04/08/1998 | EP0834917A1 Film carrier and semiconductor device using the same |
| 04/08/1998 | EP0834887A2 Chip component |
| 04/08/1998 | EP0834886A1 A reusable, selectively conductive, Z-axis, elastomeric composite substrate |
| 04/08/1998 | EP0834598A1 Selective metallization of three dimensional objects |
| 04/08/1998 | EP0834391A1 Process for producing resin molding having minute cavities on the surface |
| 04/08/1998 | EP0834376A1 Solder, and soldered electronic component and electronic circuit board |
| 04/08/1998 | EP0834243A1 Photolithographically patterned spring contact |
| 04/08/1998 | EP0834242A1 Connection substrate |
| 04/08/1998 | EP0834195A1 Flexible leads for tape ball grid array circuit |
| 04/08/1998 | EP0834169A1 Tesselated electroluminescent display having a multilayer ceramic substrate |
| 04/08/1998 | EP0833874A1 Adhesive compositions, bonding films made therefrom and processes for making bonding films |
| 04/08/1998 | EP0833716A1 Gas knife cooling system |
| 04/08/1998 | CN1178625A Printed circuit board and manufacture thereof |
| 04/08/1998 | CN1178602A High performance integrated circuit package |
| 04/08/1998 | CN1178445A Stability enhancement of molten solder droplets as ejected from nozzle of droplet pump |
| 04/08/1998 | CN1178153A Method and apparatus for processing circuit board by laser |
| 04/07/1998 | US5737644 Lens drive mechanism |
| 04/07/1998 | US5737272 Liquid crystal display apparatus, structure for mounting semiconductor device, method of mounting semiconductor device, electronic optical apparatus and electronic printing apparatus |
| 04/07/1998 | US5737053 Wire substrate having branch lines perpendicular to the main lines in which the branch lines connect to driving circuits on a display device |
| 04/07/1998 | US5737043 Liquid crystal display panel holding metal fixture |
| 04/07/1998 | US5736790 Semiconductor chip, package and semiconductor device |
| 04/07/1998 | US5736784 Variable-width lead interconnection structure and method |
| 04/07/1998 | US5736681 Printed wiring board having an interconnection penetrating an insulating layer |
| 04/07/1998 | US5736680 Polymorphic rectilinear thieving pad |
| 04/07/1998 | US5736679 Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board |
| 04/07/1998 | US5736234 Multilayer printed circuit board having latticed films on an interconnection layer |
| 04/07/1998 | US5736191 Applying electroconductive coating to a substrate surface which has pattern of microridges, then partial removal gives electrically isolated areas without loss of strength |
| 04/07/1998 | US5736190 Exterior protective layer for an electrical component |
| 04/07/1998 | US5736074 Drops of two materials are merged in flight forming coating of lower melting temperature material on drop of higher melting temperature material; high density electronics |
| 04/07/1998 | US5736065 Aqueous solution of an alkali boron hydride mixed with a water-soluble polyoxyethylene chain-containing organic compound |
| 04/07/1998 | US5735973 Benzimidazole compound; protection from oxidation and rust |
| 04/07/1998 | US5735698 For securing a circuit component to a printed circuit board |
| 04/07/1998 | US5735696 Right-angle board to board connector with anti-wicking characteristics and terminal for same |
| 04/07/1998 | US5735452 Ball grid array by partitioned lamination process |
| 04/07/1998 | US5735451 Surface treatment; oxidation, reduction and etching using oxygen, air, rare gases, nitrogen and fluoro compounds; improved wettability |
| 04/07/1998 | US5735203 Apparatus for printing solder paste to a printed circuit board and separating a screen mask plate from the printed circuit board |
| 04/07/1998 | US5735040 Method of making IC card |
| 04/02/1998 | WO1998014040A2 A method and a device for shielding an electrical component |
| 04/02/1998 | WO1998014039A1 Passive component |
| 04/02/1998 | WO1998014038A1 Device for mounting hybrid connections on printed circuit boards |
| 04/02/1998 | WO1998013875A1 Hybrid microwave-frequency integrated circuit |
| 04/02/1998 | WO1998013870A1 Chip module and manufacturing process |
| 04/02/1998 | WO1998013833A1 Electrical conductors and method of manufacture |
| 04/02/1998 | WO1998013394A1 Water soluble and oxygen-impermeable polymeric layers |
| 04/02/1998 | WO1998013206A1 Thermal head |
| 04/02/1998 | DE19743013A1 Ceramic circuit substrate arrangement |
| 04/02/1998 | DE19705568C1 Battery contacting and retaining device e.g. for compact battery designs |
| 04/02/1998 | DE19640285A1 Solder paste transfer apparatus for Ball Grid Array device contacts |
| 04/02/1998 | DE19640255A1 Electronic module manufacturing method for contactless motor vehicle pedal switch contg. Hall sensor |
| 04/02/1998 | DE19640192A1 Verfahren zur Flip-Chip-Montage A method for flip-chip mounting |
| 04/02/1998 | DE19639898A1 Surface treatment of surfaces requiring metal coating to make e.g. automotive parts or circuit boards |
| 04/02/1998 | DE19639897A1 Wasserlösliche und sauerstoffsperrende Polymerschichten und deren Verwendung für lichtempfindliche Materialien And water-soluble oxygen-impermeable polymer layers and the use thereof for photosensitive materials |
| 04/02/1998 | DE19639704A1 System of contacts especially for chip-card-reading equipment |
| 04/02/1998 | DE19639646A1 Carrier element for semiconductor chip |
| 04/02/1998 | DE19639025A1 Chipmodul und Verfahren zur Herstellung eines Chipmoduls Chip module and method of producing a chip module, |
| 04/02/1998 | DE19638629A1 Two-layer conductive coating of ceramic body before electroplating |
| 04/02/1998 | DE19638195A1 Lead-free dielectric paste |
| 04/01/1998 | EP0833550A2 Circuit board with strain relief for connecting cable, process for manufacturing and connecting the same as well as its use |
| 04/01/1998 | EP0833442A1 High frequency noise and impedance matched integrated circuits |
| 04/01/1998 | EP0833406A2 Press-fit pin with elastic press-fit portion |
| 04/01/1998 | EP0833383A2 Power module circuit board and a process for the manufacture thereof |
| 04/01/1998 | EP0832994A1 Process for preparing a non-conductive substrate for electroplating |
| 04/01/1998 | EP0832918A1 Resin etching solution and etching process |
| 04/01/1998 | EP0832907A1 Adhesive resin composition and adhesive sheet |
| 04/01/1998 | EP0832859A1 Dielectric material with low temperature coefficient and high unloaded quality, process for producing the same, and single/multilayer circuit board containing the same |
| 04/01/1998 | EP0832546A1 Ground plane routing |
| 04/01/1998 | EP0832545A2 Process and device for treating holes or recesses in workpieces with liquid treatment agents |
| 04/01/1998 | EP0832448A1 Method of manufacturing passive elements using conductive polypyrrole formulations |
| 04/01/1998 | EP0831981A1 Epoxy-based, voc-free soldering flux |
| 04/01/1998 | EP0831980A1 Material-irradiation device and process for operation of material-irradiation devices |
| 04/01/1998 | EP0495035B1 Method of applying metallized contacts to a solar cell |
| 04/01/1998 | CN1177986A Currentless metallisation process for non electro conductive substrates |
| 04/01/1998 | CN1177902A Circuit board assembly and heat conducting device thereof |
| 04/01/1998 | CN1177901A Method for mfg. of printed wiring base plate and printed wiring plate |
| 04/01/1998 | CN1177751A Resin etching solution and etching method thereof |
| 03/31/1998 | US5734936 Lens shutter type of camera |
| 03/31/1998 | US5734560 Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap |
| 03/31/1998 | US5734523 Conductive film connectors for use on head assemblies in drives |
| 03/31/1998 | US5734394 Kinematically fixing flex circuit to PWA printbar |
| 03/31/1998 | US5734327 For a resonance detection system |
| 03/31/1998 | US5734196 Electronic packaging shaped beam lead fabrication |
| 03/31/1998 | US5734000 Silicon based lacquer, its use as a substrate coating and substrates thus obtained |
| 03/31/1998 | US5733640 Thin film wiring |
| 03/31/1998 | US5733639 Circuit board assembly with foam substrate and method of making same |
| 03/31/1998 | US5733599 Immersion plating with first metal which is more noble than surface, then plating with second metal more noble than first, for printed circuits |
| 03/31/1998 | US5733598 Printed circuits |