| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/28/1998 | US5744284 Method for fabricating resilient z-axis contacts for electrically interconnecting integrated circuits on a plurality of stacked carriers |
| 04/28/1998 | US5744283 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material |
| 04/28/1998 | US5744244 Tamper-proof electronic coatings |
| 04/28/1998 | US5744171 System for fabricating conductive epoxy grid array semiconductor packages |
| 04/28/1998 | US5743990 Thin laminate removal process tooling and method |
| 04/28/1998 | US5743936 Removing electronics from printed wiring boards, polishing surfaces, milling, separating milled portions |
| 04/28/1998 | US5743747 Dimpled connector |
| 04/28/1998 | US5743457 Controlled zone solder dispensing |
| 04/28/1998 | US5743009 For mounting other boards or electronic parts on a main board |
| 04/28/1998 | US5743007 Method of mounting electronics component |
| 04/28/1998 | US5743004 Method of forming electronic multilayer printed circuit boards or cards |
| 04/28/1998 | CA2134377C Solder paste mixture |
| 04/28/1998 | CA2031549C Electroless plating of nickel onto surfaces such as copper or fused tungsten |
| 04/23/1998 | WO1998016973A1 Electrical connector assembly |
| 04/23/1998 | WO1998016900A1 Chip card with a contact zone and method of producing such a chip card |
| 04/23/1998 | WO1998016387A1 Process and apparatus for the deposition of a viscous product on a substrate via a stencil |
| 04/23/1998 | WO1998016383A1 Method to control cavity dimensions of fired multilayer circuit boards on a support |
| 04/23/1998 | DE19712065A1 Duplex unit using surface wave bandpass filter |
| 04/23/1998 | DE19700846C1 Electrical switching device for connections on printed circuit board |
| 04/23/1998 | DE19643217A1 Method of manufacturing resistive elements on circuit board |
| 04/22/1998 | EP0837623A1 Method for the manufacture of printed circuit boards with plated resistors |
| 04/22/1998 | EP0836892A2 Transfer sheet, and pattern-forming method |
| 04/22/1998 | EP0836796A1 Process for assembling electronics using microwave irradiation |
| 04/22/1998 | EP0836795A1 Method for making a debossed conductive film composite |
| 04/22/1998 | EP0805722A4 Roughening of metal surfaces |
| 04/22/1998 | EP0748176B1 Method for increasing the gloss of a surface |
| 04/22/1998 | EP0730787B1 Electrical interconnects |
| 04/22/1998 | EP0686073B1 No-clean, low-residue, volatile organic compound free soldering flux and method of use |
| 04/22/1998 | CN1179636A High density connector and method of manufacture |
| 04/22/1998 | CN1179445A Adhesive resin composition and adhesive sheet |
| 04/21/1998 | US5742850 Lens shutter type of camera |
| 04/21/1998 | US5742484 Flexible connector for circuit boards |
| 04/21/1998 | US5742483 Method for producing circuit board assemblies using surface mount components with finely spaced leads |
| 04/21/1998 | US5742480 Optical module circuit board having flexible structure |
| 04/21/1998 | US5742479 Card-type electronic device with plastic frame sandwiched between printed circuit board and metal panel |
| 04/21/1998 | US5742362 Process for forming a photosensitive material and an exposure apparatus used for the process |
| 04/21/1998 | US5742100 Electronic component |
| 04/21/1998 | US5742025 Laser reflow soldering process with lead-tin solder pads |
| 04/21/1998 | US5742005 Electrical connection box |
| 04/21/1998 | US5741729 Ball grid array package for an integrated circuit |
| 04/21/1998 | US5741622 Comprising copolymer having unsaturated compound and free carboxyl group, polyfunctional unsaturated compond diluent, solvent, photoinitiator, vinyltriazine compound, inorganic filler |
| 04/21/1998 | US5741597 Bond for tacking an electronic part |
| 04/21/1998 | US5741575 Adhesive for printed circuit board |
| 04/21/1998 | US5741557 Method for depositing metal fine lines on a substrate |
| 04/21/1998 | US5741432 Stabilized nitric acid compositions |
| 04/21/1998 | US5741430 Conductive adhesive bonding means |
| 04/21/1998 | US5741410 Apparatus for forming spherical electrodes |
| 04/21/1998 | US5741405 Sputtering metal onto printed circuit substrate in successive partial layers with intermittent cooling times between sputtering times |
| 04/21/1998 | US5741361 Method for fluid transport |
| 04/21/1998 | US5741148 Electrical connector assembly with interleaved multilayer structure and fabrication method |
| 04/21/1998 | US5740954 Apparatus for attaching/detaching a land grid array component to a circuit board |
| 04/21/1998 | US5740730 Apparatus for depositing solder and adhesive materials onto a printed circuit board |
| 04/21/1998 | US5740729 Printing apparatus and method for inspecting printed materials |
| 04/21/1998 | US5740605 Bonded z-axis interface |
| 04/21/1998 | US5740603 Mixing lead, zinc, boron glass powders, casting to form sheet, heat sealing sheet, firing |
| 04/21/1998 | CA2089822C Photosensitive laminate having dual intermediate layers |
| 04/16/1998 | WO1998015991A1 High density connector and method of manufacture |
| 04/16/1998 | WO1998015990A1 Low profile connector |
| 04/16/1998 | WO1998015989A1 High density connector and method of manufacture |
| 04/16/1998 | WO1998015872A1 A display device and a telephone set comprising such a display device |
| 04/16/1998 | WO1998015410A1 Inverted stamping process |
| 04/16/1998 | DE19707709C1 Relay modules circuit board e.g. for automobile |
| 04/16/1998 | DE19642488A1 Thin-layer circuit board for e.g. chip card |
| 04/15/1998 | EP0836370A1 Method and system for etching substrates for printed circuit boards |
| 04/15/1998 | EP0836249A1 Electrical grounding shroud |
| 04/15/1998 | EP0836243A2 High density connector and method of manufacture |
| 04/15/1998 | EP0836229A2 Method and structure for integration of passive components on flexible film layers |
| 04/15/1998 | EP0836113A2 Lens-fitted film unit with electronic flash |
| 04/15/1998 | EP0835600A1 Perimeter matrix ball grid array circuit package with a populated center |
| 04/15/1998 | EP0835522A1 Process for producing a ceramic multilayer substrate |
| 04/15/1998 | EP0800755A4 Dual air knife for hot air solder levelling |
| 04/15/1998 | EP0780028B1 Ball grid array socket |
| 04/15/1998 | EP0765534A4 High impact digital crash data recorder |
| 04/15/1998 | CN1179129A Laminate for sealing capsules |
| 04/15/1998 | CN1178993A Sheet element |
| 04/14/1998 | US5739887 Liquid crystal display device with reduced frame portion surrounding display area |
| 04/14/1998 | US5739743 Asymmetric resistor terminal |
| 04/14/1998 | US5739586 Heat sink assembly including a printed wiring board and a metal case |
| 04/14/1998 | US5739476 Reduced board thickness without reduction in the thickness of core material; higher trace resolution, higher signal velocity with reduced distortion |
| 04/14/1998 | US5739463 Sealed electronic packaging for environmental protection of active electronics |
| 04/14/1998 | US5739268 Preparation of cyanate ester polymers and composites for metal plating |
| 04/14/1998 | US5739055 Method for preparing a substrate for a semiconductor package |
| 04/14/1998 | US5738977 Forming copper layer on substrate surface, forming layer of nickel-boron, cataphoretically coating with photosensitive lacquer, exposing, developing, removing uncovered layers, stripping lacquer, sealing with nickel-phosphorus layer |
| 04/14/1998 | US5738931 Electronic device and magnetic device |
| 04/14/1998 | US5738916 Ultraviolet-curing composition, pattern forming method making use of the same, printed-wiring board and its production |
| 04/14/1998 | US5738904 Method and apparatus for variable speed material deposition |
| 04/14/1998 | US5738797 Etching metal foil to undercut; forming air bridges |
| 04/14/1998 | US5738776 Electroplating process |
| 04/14/1998 | US5738744 Method and apparatus for continuously supplying a continuous film in a film applying apparatus |
| 04/14/1998 | US5738531 Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer |
| 04/14/1998 | US5738530 Contact pad having metallically anchored elastomeric electrical contacts |
| 04/14/1998 | US5738269 Method for forming a solder bump |
| 04/14/1998 | US5737837 Manufacturing method for magnetic head junction board |
| 04/14/1998 | US5737834 Process and apparatus for automatically assembling the tops and bottoms of circuitboards with SMDS |
| 04/14/1998 | US5737833 Selective forming electroconductive metal bumps by photolithography |
| 04/14/1998 | CA2029090C Electroless copper plating process and apparatus |
| 04/14/1998 | CA2010662C Lensless multifiber output coupler |
| 04/14/1998 | CA1339810C Process for the preparation of noble metal coated non-noble metal substrates, coated materials produced in accordance therewith and compositions utilizing the coated materials |
| 04/09/1998 | WO1998015160A1 Apparatus and method for automated manufacture of multi-layer electrical and electronic devices |
| 04/09/1998 | WO1998015159A1 Method for building at least two wiring levels on electrically insulated supports |