Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/1998
05/07/1998DE19735904A1 Lead frame for discrete component or integrated circuit mounting
05/07/1998DE19715926A1 Ball grid array component external connection production
05/07/1998DE19644253A1 Vorrichtung zum Behandeln von Substraten Apparatus for processing substrates
05/06/1998EP0840543A2 AC coupled termination of a printed circuit board power plane in its characteristic impedance
05/06/1998EP0840443A1 High-frequency amplifier
05/06/1998EP0840424A1 Small-sized motor and motor driver
05/06/1998EP0840408A2 Cover for an edge mounted printed circuit board connector
05/06/1998EP0840374A1 A semiconductor package having mechanically and electrically bonded supportive elements
05/06/1998EP0840368A2 Product and method for placing particles on contact pads of electronic devices
05/06/1998EP0840198A2 Method and apparatus for increasing computer memory capacity
05/06/1998EP0840131A2 Loaded-board guided-probe test fixture
05/06/1998EP0840130A2 Standard- and limited-access hybrid test fixture
05/06/1998EP0839868A1 Heat resistant resin composition and adhesive sheet using the same
05/06/1998EP0839598A2 Processes for producing metal-ceramics composite substrates and brazing materials for use in such processes
05/06/1998EP0839440A1 Copper foil for the manufacture of printed circuits and method of producing same
05/06/1998EP0839439A1 Method for forming fiducial mark in resin stencil and stencil formed thereby
05/06/1998EP0839341A1 Heterogeneous photo-initiators, photopolymerisable compositions and their use
05/06/1998EP0839323A1 Microelectronic spring contact elements
05/06/1998EP0839322A1 Microelectronic contact structure and method of making same
05/06/1998EP0839321A1 Contact tip structures for microelectronic interconnection elements and methods of making same
05/06/1998EP0839166A1 Polymeric composition
05/06/1998EP0839091A1 Apparatus for supporting and tensioning a stencil
05/06/1998EP0811308A4 Board matched nested support fixture
05/06/1998EP0633822B1 Methods of manufacturing perforated foils
05/06/1998CN2281055Y Capacity socket structure
05/06/1998CN1181102A Melt-flowable materials and method of sealing surfaces
05/06/1998CN1181100A Polymeric composition y
05/06/1998CN1180932A Coaxial Interconnect devices and methods of making the same
05/06/1998CN1038295C Process for producing plastic laminates with metal laminate, especially for printed circuits
05/06/1998CN1038290C Electrical Interconnection apparatus
05/05/1998US5748997 Control method of a zoom lens camera
05/05/1998US5748450 BGA package using a dummy ball and a repairing method thereof
05/05/1998US5748388 Lens barrel having a rotating barrel and linear moving barrel
05/05/1998US5748305 Method and apparatus for particle inspection
05/05/1998US5748209 Thermal ink jet tab circuit having a plurality of trace groups wherein adjacent traces in each group are staggered
05/05/1998US5748006 High-frequency-transmission printed wiring board, probe card, and probe apparatus
05/05/1998US5747877 Semiconductor chip package with enhanced thermal conductivity
05/05/1998US5747875 Semiconductor power module with high speed operation and miniaturization
05/05/1998US5747743 Coil-shaped flexible printed circuit board
05/05/1998US5747740 Helical surface-mounted test point
05/05/1998US5747437 Cleaning compositions based on 1,1,1,2,2,4,4-heptafluorobutane and C1 -C3 alcohols
05/05/1998US5747358 Method of forming raised metallic contacts on electrical circuits
05/05/1998US5747223 Composition for photoimaging
05/05/1998US5747222 Multi-layered circuit substrate and manufacturing method thereof
05/05/1998US5747102 Method and apparatus for dispensing small amounts of liquid material
05/05/1998US5747098 Process for the manufacture of printed circuit boards
05/05/1998US5747095 Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages
05/05/1998US5746929 High-speed, uniform etching using a flowing gas mixture heated by microwaves while monitoring the surface temperature of the film and the power density of the microwave energy
05/05/1998US5746927 Forming around holes of second circuit board a photosensitive polymer, etching
05/05/1998US5746903 Wet chemical processing techniques for plating high aspect ratio features
05/05/1998US5746868 Multilevel interconnections are connected through vias
05/05/1998US5746813 Surface protection material for printed circuit board and process of forming surface protection films
05/05/1998US5746809 Zinc oxalate and copper oxalate with palladium salt in alkaline medium for electroless deposition of metals
05/05/1998US5746626 Electrical connector assembly
05/05/1998US5746368 Molten solder dispensing system
05/05/1998US5746267 Monolithic metal matrix composite
05/05/1998US5746127 Electroformed squeegee blade for surface mount screen printing
05/05/1998US5745989 Method of preparation of an optically transparent article with an embedded mesh
05/05/1998US5745987 Method for bonding circuit boards to pallets
05/05/1998US5745986 Method of planarizing an array of plastically deformable contacts on an integrated circuit package to compensate for surface warpage
05/05/1998US5745984 Method for making an electronic module
05/05/1998CA1339852C Platinum and rhodium calalysis of low temperature formation multilayer ceramics
04/1998
04/30/1998WO1998018302A1 Means and method for mounting electronics
04/30/1998WO1998018301A1 Optical/electrical hybrid wiring board and its manufacturing method
04/30/1998WO1998018168A1 Photointerruptor
04/30/1998WO1998018162A1 Film carrier tape and semiconductor device, method for manufacturing them, and circuit board
04/30/1998WO1998018161A1 Semiconductor device, method of its manufacture, circuit substrate, and film carrier tape
04/30/1998WO1998018155A1 Substrate treatment device
04/30/1998WO1998018034A1 Optoelectronic device, holder suitable for use in such a device and method of manufacturing such a device
04/30/1998WO1998018015A1 Apparatus for testing of printed circuit boards
04/30/1998WO1998017483A1 Apparatus and method for recovering photoresist developers and strippers
04/30/1998DE19644273A1 Separation device for pre-scribed circuit board blanks
04/30/1998DE19642627A1 Electronic component soldering requiring no specialist training
04/30/1998CA2213589A1 Multi-lane board transport system for electronic assembly
04/29/1998EP0838981A2 Laser machining of molded assemblies
04/29/1998EP0838980A2 Glass circuit substrate and fabrication method thereof
04/29/1998EP0838979A1 Printing mask cleaning apparatus and method
04/29/1998EP0838978A2 Low-loss electrical interconnects
04/29/1998EP0838884A1 Method for inserting an electric contact pin with an compliant attachment zone into a hole in a printed circuit board
04/29/1998EP0838854A2 Wired board with improved bonding pads
04/29/1998EP0838688A2 Device and procedure for testing printed circuit boards
04/29/1998EP0838136A1 Conductive connection and process for producing it
04/29/1998EP0838134A1 Procedure and device for the chemical and electrolytic treatment of printed circuit boards and films
04/29/1998EP0838133A1 Device for mounting electrical components on printed-circuit boards
04/29/1998EP0838100A1 Separable electrical connector assembly having a planar array of conductive protrusions
04/29/1998EP0837918A1 Adhesives containing electrically conductive agents
04/29/1998EP0692178B1 Structuring of printed circuit boards
04/29/1998CN1180433A Method of producing smart card
04/29/1998CN1180368A Adhesive, adhesive film and adhesive-backed metal foll
04/28/1998US5745426 Memory card and circuit board used therefor
04/28/1998US5745371 System and method for mounting components and layout for printed boards
04/28/1998US5745339 Packing element including a foam plastic body and a device relating to this packing element
04/28/1998US5745334 Capacitor formed within printed circuit board
04/28/1998US5745333 Laminar stackable circuit board structure with capacitor
04/28/1998US5745150 Laser drawing apparatus having drawing beams in a common place aligned with a lens meridian
04/28/1998US5745149 Thermal printing head
04/28/1998US5744862 Reduced thickness semiconductor device with IC packages mounted in openings on substrate
04/28/1998US5744759 Circuit boards that can accept a pluggable tab module that can be attached or removed without solder
04/28/1998US5744758 Multilayer circuit board and process of production thereof
04/28/1998US5744285 Multilayer; electroconductive and dielectric layers