Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/1998
05/19/1998US5753349 Simplified method of incorporating a hologram into a credit card or other document
05/19/1998US5753309 Composition and method for reducing copper oxide to metallic copper
05/19/1998US5753299 Method and apparatus for forming termination stripes
05/19/1998US5753135 Apparatus and method for recovering photoresist developers and strippers
05/19/1998US5752851 Circuit clip connector
05/19/1998US5752797 Automated chamfering apparatus and method
05/19/1998US5752446 Alignment systems
05/14/1998WO1998020720A1 Heater in a conveyor system
05/14/1998WO1998020716A1 Electrical means for extracting layer to layer registration
05/14/1998WO1998020715A1 Interconnected multi-layer circuit boards
05/14/1998WO1998020714A1 Foldable electronic assembly module
05/14/1998WO1998020713A1 Dimensionally stable solder mask material and method of application
05/14/1998WO1998020712A1 Method for structuring synthetic surfaces, specially for producing data carriers to store data
05/14/1998WO1998020559A1 Dimensionally stable core for use in high density chip packages and a method of fabricating same
05/14/1998WO1998020545A1 Method for manufacturing high tolerance cavities in chip packages
05/14/1998WO1998020542A1 Electronic parts device
05/14/1998WO1998020541A1 Method for forming bump and semiconductor device
05/14/1998WO1998020540A1 Method and apparatus for improving wireability in chip modules
05/14/1998WO1998020539A1 Method for preparing vias for subsequent metallization
05/14/1998WO1998020538A1 Multiple pulse space processing to enhance via entrance formation at 355 nm
05/14/1998WO1998020537A1 Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation
05/14/1998WO1998020536A1 Method for using ultrasonic treatment in combination with uv-lasers to enable plating of high aspect ratio micro-vias
05/14/1998WO1998020535A2 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
05/14/1998WO1998020534A1 Method for using fiducial schemes to increase nominal registration
05/14/1998WO1998020533A2 Method for using photoabsorptive coatings to enhance both blind and through micro-via entrance quality
05/14/1998WO1998020532A1 Method and apparatus for coining solder balls on an electrical circuit package
05/14/1998WO1998020531A2 Method for forming a through-via in a laminated substrate
05/14/1998WO1998020530A1 Method to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniques
05/14/1998WO1998020529A1 Method for minimizing pink ring in blind laser vias
05/14/1998WO1998020528A1 METHOD FOR IMPROVING RELIABILITY OF THIN CIRCUIT SUBSTRATES BY INCREASING THE Tg OF THE SUBSTRATE
05/14/1998WO1998020527A1 Multiple frequency processing to improve electrical resistivity of blind micro-vias
05/14/1998WO1998020523A2 Method for selectively plating an organic substrate
05/14/1998WO1998020488A2 Data processing of a bitstream signal
05/14/1998WO1998020395A1 Method of applying dry film photoresist
05/14/1998WO1998019938A2 Conveyor system with lifting mechanism
05/14/1998WO1998019863A1 Method and apparatus for aligning and laminating substrates to stiffeners in electrical circuits
05/14/1998WO1998019858A1 Circuit comprising microstrip conductor and method for making the same
05/14/1998DE19739073A1 Forming electrode coupling metal bumps on electronic device
05/14/1998DE19701854C1 Electronic module housing for use in automobile
05/14/1998DE19646774A1 High frequency circuit equalisation method for television tuner
05/14/1998DE19646513A1 Printed circuit device e.g. for foil keyboard
05/14/1998DE19646369A1 Manufacturing ceramic multilayer circuit of green ceramic foils
05/14/1998DE19645854A1 High structure density circuit board production
05/14/1998CA2270993A1 Conveyor system with lifting mechanism
05/14/1998CA2270539A1 Heater in a conveyor system
05/13/1998EP0841840A1 Method for the manufacture of micro solder bumps on copper pads
05/13/1998EP0841839A1 Process for structuring plastic surfaces, particularly for the manufacture of means for irreversible information storage
05/13/1998EP0841728A2 Sockle for electrical and electronical components
05/13/1998EP0841719A2 Contact pin
05/13/1998EP0841559A2 Solder testing apparatus
05/13/1998EP0841189A1 Laser-imageable element having a stablising infrared-absorbing dye
05/13/1998EP0841117A1 Process and apparatus for the wave soldering of circuit boards
05/13/1998EP0840994A1 Process and device for producing through-connected printed circuit boards and multilayered printed circuit boards
05/13/1998EP0840676A1 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
05/13/1998EP0840660A1 Fluxless contacting of components
05/13/1998EP0619935B1 Multi-layer circuit construction methods and structures with customization features and components for use therein
05/13/1998CN1181688A Covered copper plate fast printing method
05/13/1998CN1181629A Semiconductor chip-mounting board and mounting method for semiconductor chip
05/13/1998CN1181619A Flip chip attach on flexible circuit carrier using chip with metallic cap on solder
05/13/1998CN1181618A External terminal fabrication method for ball grid array package
05/13/1998CN1181506A Printed circuit board test apparatus and method
05/13/1998CN1181397A Heat resistant resin composition and adhesive sheet using the same
05/12/1998US5752182 Hybrid IC
05/12/1998US5751910 Neural network solder paste inspection system
05/12/1998US5751594 Aperture control system for printed circuit board fabrication
05/12/1998US5751588 Multi-wavelength programmable laser processing mechanisms and apparatus utilizing vaporization detection
05/12/1998US5751585 High speed, high accuracy multi-stage tool positioning system
05/12/1998US5751577 Production data preparing system for producing a metal mask plate
05/12/1998US5751557 Printed circuit board having a triple pattern footprint for receiving one of three component packages
05/12/1998US5751556 Method and apparatus for reducing warpage of an assembly substrate
05/12/1998US5751555 Electronic component having reduced capacitance
05/12/1998US5751256 Resonant tag labels and method of making same
05/12/1998US5751068 Tape with solder forms for semiconductor devices
05/12/1998US5750997 Method and apparatus for observing wiring patterns of printed circuit board
05/12/1998US5750968 System and apparatus for reducing arcing and localized heating during microwave processing
05/12/1998US5750956 Methods of manufacturing perforated foils
05/12/1998US5750935 Mounting device for attaching a component through an aperture in a circuit board
05/12/1998US5750926 Hermetically sealed electrical feedthrough for use with implantable electronic devices
05/12/1998US5750422 Method for making integrated circuit packaging with reinforced leads
05/12/1998US5750417 Method of manufacturing a device having a support bar with conductor tracks for electrically contacting a semiconductor element
05/12/1998US5750375 Methods of producing secreted receptor analogs and biologically active dimerized polypeptide fusions
05/12/1998US5750291 Image-forming process
05/12/1998US5750271 Applying tacky solution to powdered solder; heating to melt
05/12/1998US5750212 Masking; exposure to activating lasers; reductive copper bath contacting backside; integrated circuits
05/12/1998US5750199 Apparatus and method for mounting soldering balls onto surfaces of electronic components
05/12/1998US5750087 Process for the reduction of copper oxide
05/12/1998US5749737 Motor mounting bracket for PCB
05/12/1998US5749614 Vacuum pickup tool for placing balls in a customized pattern
05/12/1998US5749458 Miniature jumper switch with wire contact maker
05/12/1998US5749143 Process for forming a module
05/12/1998CA2098589C Coating for printed substrate
05/12/1998CA2027570C Method and composition for protecting and enhancing the solderability of metallic surfaces
05/12/1998CA2019046C Method of printing fine patterns
05/07/1998WO1998019505A1 Solder bonded electronic module
05/07/1998WO1998019393A1 Method for producing an electrical component and resulting component
05/07/1998WO1998019371A1 Vehicle power distribution box
05/07/1998WO1998019354A1 Battery connector and battery holder for printed circuit boards
05/07/1998WO1998019316A1 Method of securing an electric contact to a ceramic layer as well as a resistance element thus manufactured
05/07/1998WO1998018615A1 Conductive elastomers and methods for fabricating the same
05/07/1998WO1998014040A3 A method and a device for shielding an electrical component
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