| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/02/1998 | US5759053 Conductor for connection circuit method of making the same and electric connection device |
| 06/02/1998 | US5759050 Electrical connection construction between electrical connection box and electronic circuit unit |
| 06/02/1998 | US5759047 Flexible circuitized interposer with apertured member and method for making same |
| 06/02/1998 | US5759046 Dendritic interconnection system |
| 06/02/1998 | US5758931 Electric control unit integrated with a hydraulic unit in an anti-lock brake system |
| 06/02/1998 | US5758816 Method for attaching small components to each other |
| 06/02/1998 | US5758815 Solder apparatus and method |
| 06/02/1998 | US5758575 Apparatus for printing an electrical circuit component with print cells in liquid communication |
| 06/02/1998 | US5758413 Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias |
| 06/02/1998 | US5758412 Method of making a printed circuit board |
| 06/02/1998 | US5758409 Conductive ball-placing apparatus |
| 05/28/1998 | WO1998023137A1 A printed circuit board and a method for manufacturing the printed circuit board |
| 05/28/1998 | WO1998023103A1 Filter structure for radio device |
| 05/28/1998 | WO1998023018A1 A transient voltage protection device and method of making same |
| 05/28/1998 | WO1998022406A1 Method of applying a silver layer to a glass substrate |
| 05/28/1998 | WO1998022270A1 Template type cavity-formation device for low temperature cofired ceramic (ltcc) sheets |
| 05/28/1998 | WO1998022252A1 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
| 05/28/1998 | DE19649972A1 Automobile cable tree mfg. method |
| 05/28/1998 | DE19649116A1 Housing or circuit board with conductive structure e.g. for computer housing |
| 05/28/1998 | DE19649109A1 Plastic leadless chip carrier (PLCC)-IC housing simulation method e.g. for manufacture of microcontroller modules |
| 05/28/1998 | DE19648978A1 Low pressure plasma-assisted soldering process for circuit boards |
| 05/28/1998 | DE19648080A1 Prototyping three=dimensional, moulded interconnected devices in polyurethane |
| 05/27/1998 | EP0844811A2 A method and an arrangement for mounting a component on a carrier |
| 05/27/1998 | EP0844809A2 Solder resist composition and printed circuit boards |
| 05/27/1998 | EP0844657A1 Method for mounting semiconductor chip |
| 05/27/1998 | EP0844629A2 Zirconia ceramic members with laser induced electrical conductivity in surfaces thereof |
| 05/27/1998 | EP0844272A2 Prepreg for laminate and process for producing printed wiring-board using the same |
| 05/27/1998 | EP0844090A2 Method of forming a multi-channel array printhead body of a drop-on-demand ink-jet printhead |
| 05/27/1998 | EP0843955A1 Method of forming raised metallic contacts on electrical circuits |
| 05/27/1998 | EP0843894A1 Encapsulant with fluxing properties and method of use |
| 05/27/1998 | EP0843886A1 The provision of color elements on substrates by means of a screen-printing or stencil-printing method |
| 05/27/1998 | EP0843621A1 Conductive via fill inks for ceramic multilayer circuit boards on support substrates |
| 05/27/1998 | EP0843599A1 Vacuum flash evaporated polymer composites |
| 05/27/1998 | EP0771181A4 Sheets with high temperature stable protective coating |
| 05/27/1998 | CN1183081A Control system for an automotive vehicle multi-functional apparatus |
| 05/27/1998 | CN1182957A Structure reinforced spherical grid array semiconductor package and system |
| 05/27/1998 | CN1182660A Anti-welding composition and printed-circuit board |
| 05/27/1998 | CN1038549C Vibration-generating-motor mounting structure and its mounting method |
| 05/27/1998 | CN1038488C Soldering |
| 05/26/1998 | US5757622 Connecting structure for electronic equipment |
| 05/26/1998 | US5757611 Electronic package having buried passive components |
| 05/26/1998 | US5757252 Wide frequency band transition between via RF transmission lines and planar transmission lines |
| 05/26/1998 | US5757079 Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure |
| 05/26/1998 | US5757074 Accuracy, efficiency |
| 05/26/1998 | US5757071 Substrate surface having contact pads coated with layer of nickel-boron and reverse surface with projecting pins having layer of nickel-phosphorous and another of gold, for integrated circuits |
| 05/26/1998 | US5757062 Ceramic substrate for semiconductor device |
| 05/26/1998 | US5756949 Unit structure for hazard switch |
| 05/26/1998 | US5756584 Acrylic ester and unsaturated monomer |
| 05/26/1998 | US5756405 Technique for forming resin-impregnated fiberglass sheets |
| 05/26/1998 | US5756379 Method and apparatus for making an electronic module for cards |
| 05/26/1998 | US5756378 Method of and apparatus for laser processing |
| 05/26/1998 | US5756377 Lead frame and manufacturing method thereof |
| 05/26/1998 | US5756261 A curable photoresists blends comprising a polyetherurethane or a polyesterurethane copolymer with an acrylic copolymer and carboxy group-containing cellulose, a photoinitiator; adhesion, flexibility, elasticity |
| 05/26/1998 | US5756259 With polymer having bound photoabsorber |
| 05/26/1998 | US5756190 Novolak epoxy resin, curing agent, diluent, photopolymerization catalyst |
| 05/26/1998 | US5756146 Inspecting copper or molybdenum lines on a substrate |
| 05/26/1998 | US5755950 Process for removing plating materials from copper-based substrates |
| 05/26/1998 | US5755935 Processing system |
| 05/26/1998 | US5755916 Process for making plastic laminates with metal laminae for printed circuits especially, with endothermic heating |
| 05/26/1998 | US5755903 Forming stress relief pads on substrate surface in vicinity of selected vias during sintering |
| 05/26/1998 | US5755893 High speed cleaning of circuits with aqueous solution including n-alkyl-2-pyrrolidone |
| 05/26/1998 | US5755859 Solution comprising cobalt salt plus tin salt, complexing agent, phosphorus-bearing reducing agent, and buffer |
| 05/26/1998 | US5755157 Solder paste stencil printer |
| 05/26/1998 | US5755027 Manufacturing method for electrical circuit board |
| 05/26/1998 | US5755026 Method of preventing condensation on a surface housing an electronic apparatus |
| 05/26/1998 | CA2222319A1 A method and an arrangement for mounting a component on a carrier |
| 05/22/1998 | WO1998021626A1 Multifunctional microstructures and preparation thereof |
| 05/22/1998 | WO1998021272A2 Manufacture of composites of inorganic powder and polymer materials |
| 05/20/1998 | EP0843509A1 Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil |
| 05/20/1998 | EP0843508A2 Coating circuits to dissipate heat |
| 05/20/1998 | EP0843507A2 Process for manufacturing mixed printed circuits of 105 to 400 and 17 to 105 microns |
| 05/20/1998 | EP0843389A2 Miniature jumper switch with wire contact maker |
| 05/20/1998 | EP0843383A2 High density connector having a ball type of contact surface |
| 05/20/1998 | EP0843358A2 Electronic flat-pack module and chipcard |
| 05/20/1998 | EP0843357A1 Method of manufacturing a grid array semiconductor package |
| 05/20/1998 | EP0843326A2 Chip type electronic part |
| 05/20/1998 | EP0843219A2 Formulation for producing watersoluble deposit upon a substrate |
| 05/20/1998 | EP0842995A1 Thermoplastic adhesive |
| 05/20/1998 | EP0842772A1 Printing method and apparatus |
| 05/20/1998 | EP0842594A1 Controller with a housing made of at least two parts |
| 05/20/1998 | EP0842045A1 Debossable films |
| 05/20/1998 | DE19723847A1 Chip card transponder foil manufacturing method |
| 05/20/1998 | DE19646970A1 Production of electrically conducting bond |
| 05/20/1998 | CN1182345A Multilayer printed circuit board |
| 05/20/1998 | CN1182344A Suppression of silver migration |
| 05/20/1998 | CN1182285A Manufacture of circuit module |
| 05/19/1998 | US5754893 Lens barrel having waterproof coating |
| 05/19/1998 | US5754726 Optical device assembly used for fastening to pc boards |
| 05/19/1998 | US5754621 X-ray inspection method and apparatus, prepreg inspecting method, and method for fabricating multi-layer printed circuit board |
| 05/19/1998 | US5754411 Circuit board having a window adapted to receive a single in-line package module |
| 05/19/1998 | US5754409 Foldable electronic assembly module |
| 05/19/1998 | US5754407 Part holder |
| 05/19/1998 | US5754402 Power amplifying module |
| 05/19/1998 | US5754398 Circuit-carrying automotive component and method of manufacturing the same |
| 05/19/1998 | US5754088 Planar transformer and method of manufacture |
| 05/19/1998 | US5753976 Multi-layer circuit having a via matrix interlayer connection |
| 05/19/1998 | US5753973 Resin seal semiconductor package |
| 05/19/1998 | US5753908 Photoelectric imaging device photosensor array alignment apparatus and method |
| 05/19/1998 | US5753722 Photocurable and thermosetting matte liquid resist composition |
| 05/19/1998 | US5753372 Wiring structures and method of manufacturing the same |