Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/1998
06/10/1998DE19650881A1 Producing plastic foils which are electrically conductive in the z=direction and non:conductive in the x= and y= directions
06/10/1998DE19650813A1 Foil circuit-board system for easy recycling
06/10/1998DE19650255A1 Selective surface encapsulation of e.g. printed circuit board using simplified method
06/10/1998CN1184502A Azeotrope-like compositions and their use
06/10/1998CN1184342A High frequency circuit device and used electrid element used thereof
06/10/1998CN1184333A Memory device module
06/10/1998CN1184329A Lead frame manufacturing method
06/10/1998CN1184265A One-component optical-imagery liquid soldering inhibitor and its preparation
06/10/1998CN1184260A Tape carrier package and display device using the same
06/10/1998CN1184017A 焊锡膏 Paste
06/09/1998US5765048 Telescoping type of zoom lens and cam mechanism therefor
06/09/1998US5764498 Electronics assembly formed with a slotted coupling device that absorbs mechanical forces, such as vibration and mechanical shock
06/09/1998US5764497 Circuit board connection method and connection structure
06/09/1998US5764485 For connecting an electronic component
06/09/1998US5764390 Holographic method for generating three dimensional conformal photo-lithographic masks
06/09/1998US5764200 Arrangement for price-marking device
06/09/1998US5764119 Wiring board for high-frequency signals and semiconductor module for high-frequency signals using the wiring board
06/09/1998US5764117 Method of manufacturing a dielectric resonant apparatus
06/09/1998US5764071 Method and system for testing an electronic module mounted on a printed circuit board
06/09/1998US5764010 Control system for an automotive vehicle multi-functional apparatus
06/09/1998US5763949 Surface-mount semiconductor package
06/09/1998US5763941 For making a semiconductor assembly
06/09/1998US5763939 Semiconductor device having a perforated base film sheet
06/09/1998US5763854 Machine for laser reflow soldering
06/09/1998US5763824 Lid assembly for shielding electronic components from EMI/RFI interferences
06/09/1998US5763346 Low specific inductive capacity capacitors
06/09/1998US5763297 Integrated circuit carrier having lead-socket array with various inner dimensions
06/09/1998US5763140 Photodefinable dielectric composition useful in the manufacture of printed circuits
06/09/1998US5763123 Method for producing thin-film substrate
06/09/1998US5763093 Aluminum nitride body having graded metallurgy
06/09/1998US5763060 Printed wiring board
06/09/1998US5763059 Circuit board
06/09/1998US5763058 Electrical circuit component formed of a conductive liquid printed directly onto a substrate
06/09/1998US5763016 By etching areas exposed to water-free sulfur trioxidethrough overlaying makk or developing latene image
06/09/1998US5762845 Method of making circuit with conductive and non-conductive raised features
06/09/1998US5762778 Comprising a copper compound, a zinc compound, a polyphosphate, orthophosphate and water; printed circuits; barriers; uniformity, bright yellow; antisoilants
06/09/1998US5762777 Process of directly electroplating onto a nonconductive substrate
06/09/1998US5762749 Apparatus for removing liquid from substrates
06/09/1998US5762716 Methods for wiping a metal contaminated surface with a water soluble fabric
06/09/1998US5762259 Method for forming bumps on a substrate
06/09/1998US5762258 Method of making an electronic package having spacer elements
06/09/1998US5762257 Of printed circuit boards
06/09/1998US5762082 Precision fluid head transport
06/09/1998US5761829 High yield apparatus for drying rigid or flexible printed circuit boards
06/09/1998US5761803 In a printed circuit board
06/09/1998US5761801 Debossed laminate is subjected to near gelation, gelation and cure of attached resin film fixes the retained pattern in the metal foil layer and resin layer of laminate
06/09/1998US5761795 Pressing apparatus for connecting terminals of flexible circuit board
06/09/1998US5761792 Method for making a battery pack
06/09/1998US5761779 Method of producing fine metal spheres of uniform size
06/09/1998CA2139784C Process for producing plastic laminates from continuously fed bands
06/04/1998WO1998024279A1 An apparatus for mounting electronics and a method of manufacturing such an apparatus
06/04/1998WO1998024178A1 Crystal resonator
06/04/1998WO1998024126A1 Alumina multilayer wiring substrate provided with high dielectric material layer
06/04/1998WO1998024099A1 Multiple single layer monolithic passive integrated circuits and method
06/04/1998WO1998023896A1 Method for production of conducting element and conducting element
06/04/1998DE4431605C2 Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten A process for producing a chip card module for contactless chip cards
06/04/1998DE19742839A1 Multi-layered circuit board e.g. for computer motherboard or in camera
06/04/1998DE19742837A1 Multi-layered circuit board e.g. for computer mother-board or in camera
06/04/1998DE19724533A1 Semiconductor component mfg. method with protruding electrodes for ball grid array
06/04/1998DE19713008C1 Method for assembling central electrical module for road vehicle
06/04/1998DE19649848A1 Elektronischer Schaltkreis mit einem hochfrequenzbedämpfenden Schirmgehäuse Electronic circuit with a hochfrequenzbedämpfenden screen housing
06/04/1998DE19649650A1 Radiant surface mount semiconductor device e.g. IR-emitting diode
06/04/1998DE19648464A1 Vertical electrolytic metallisation of plate-shaped products
06/03/1998EP0845807A2 Method for producing electronic circuit device, jig for making solder residue uniform, jig for transferring solder paste, and apparatus for producing electronic circuit device
06/03/1998EP0845728A2 Printed dielectric substrate for microelectromechanical systems
06/03/1998EP0845632A1 Rear lamp for motor vehicles.
06/03/1998EP0845445A1 Photosensitive ceramic green sheet, ceramic package, and process for producing the same
06/03/1998EP0844899A1 Hermetically sealed electrical feedthrough for use with implantable electronic devices
06/03/1998CN1183706A Method and apparatus for producing electronic circuit device, and jig for making solder residue unifrom and transferring solder paste
06/03/1998CN1183656A High density connector having ball type of contact surface
06/03/1998CN1183573A Method for manufacturing fine pattern, and color filter, shading pattern filter and color LCD element formed by using the same
06/02/1998US5761053 Faraday cage
06/02/1998US5761050 Deformable pin connector for multiple PC boards
06/02/1998US5761048 Semiconductor die has a plurality of bond pads formed thereon which are electrically connected to conductive traces on package substrate
06/02/1998US5760997 Flexible cable structure for magnetic disk drives
06/02/1998US5760893 Method and apparatus for inspecting component placement and solder connection in printed circuit board manufacture
06/02/1998US5760666 Dielectric resonant component with resist film on the mount substrate
06/02/1998US5760502 Method of manufacturing devices comprising a base with a conductor pattern of electrical conductors
06/02/1998US5760472 Surface mount semiconductor package
06/02/1998US5760469 Semiconductor device and semiconductor device mounting board
06/02/1998US5760337 Binder consists of crosslinked resin produced by reacting atleast one dienophile having functionality greater than one and atleast one polymer formed by reacting cabon monoxide and aliphatic alpha-olefin and a filler
06/02/1998US5759923 Flowing mist of liquid precursor to form layer on substrate; treating to solidify
06/02/1998US5759737 Multilayer elements with carriers, bonding and applying photoresist patterns, exposure to radiation, screening and connecting pads, development and removal of photoresists
06/02/1998US5759730 Solder joint encapsulation material
06/02/1998US5759683 Holographic document with holographic image or diffraction pattern directly embossed thereon
06/02/1998US5759669 Apparatus and method for screening green sheet with via hole using porous backing material
06/02/1998US5759638 Process for forming electronic circuit
06/02/1998US5759625 Fluoropolymers and overcoating adhesion and photoresists, multilayer, latent images and development then etching
06/02/1998US5759427 Method and apparatus for polishing metal surfaces
06/02/1998US5759422 Patterned metal foil laminate and method for making same
06/02/1998US5759417 Flexible circuit board and production method therefor
06/02/1998US5759416 Ablation using lasers
06/02/1998US5759381 Using organometallic compound
06/02/1998US5759379 Solder method
06/02/1998US5759378 Process for preparing a non-conductive substrate for electroplating
06/02/1998US5759336 Resist removing apparatus
06/02/1998US5759334 Plasma processing apparatus
06/02/1998US5759331 Forming holes using a laser beam on a ceramic layer made by depositing and drying a slurry on a plastic carrier tape, there being two adjoining holes of differing diameters
06/02/1998US5759285 Method and solution for cleaning solder connections of electronic components
06/02/1998US5759269 Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture