| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/23/1998 | US5770833 Laser cutting method including piercing a work piece with a moving processing head |
| 06/23/1998 | US5770476 Passive interposer including at least one passive electronic component |
| 06/23/1998 | US5770347 Photocurable and thermosetting coating composition and method for formation of solder mask for printed circuit board |
| 06/23/1998 | US5770305 Anisotropic conductive film |
| 06/23/1998 | US5770300 Multilayered metallic printed board and molded module |
| 06/23/1998 | US5770096 Forming a plating film on a substrate, a photosensitive film covering the plating film, patternig the resists film by exposure of the film to light using a pattern of photo mask, developing, patterning plating film, etching the substrate |
| 06/23/1998 | US5770032 Metallizing process |
| 06/23/1998 | US5769996 Forming patterned array by magnetic alignment of electroconductive non-magnetic particles dispersed within magnetic ferrofluid carrier |
| 06/23/1998 | US5769989 Integrated circuit device adhesively attached to solder layer on carrier board having solder filled via(s) passing through board beneath mounting site so that solder can be melted from reverse for device detachment |
| 06/23/1998 | US5769987 Post-firing method for integrating passive devices into ceramic electronic packages |
| 06/23/1998 | US5769985 Firing green sheet composed of ceramic layer covered with patterned thin film of first metal and thicker film of second metal whereby photoresist burns away and first metal diffuses into ceramic layer as dielectric oxide |
| 06/23/1998 | US5769962 Cleaning method |
| 06/23/1998 | US5769768 Tool gripping apparatus |
| 06/23/1998 | US5769305 Apparatus for wave soldering printed wiring boards |
| 06/23/1998 | US5769304 SMD soldering apparatus |
| 06/23/1998 | US5768775 Mounting apparatus of conductive balls and mounting method thereof |
| 06/23/1998 | US5768772 Pinstacking process and fixture |
| 06/23/1998 | US5768770 Electronic packaging shaped beam lead fabrication |
| 06/23/1998 | CA2116331C Water-soluble formulation for masking and the like, and method utilizing the same |
| 06/18/1998 | WO1998026641A1 Electronic component and mounting method and device therefor |
| 06/18/1998 | WO1998026639A1 Multilayered printed wiring board |
| 06/18/1998 | WO1998026638A1 Process for reflow soldering of circuit boards fitted with smd components |
| 06/18/1998 | WO1998026637A1 Surface mount pad |
| 06/18/1998 | WO1998026476A1 Electrical connection with inwardly deformable contacts |
| 06/18/1998 | WO1998026305A1 Transmitter/receiver module for a phased array radar |
| 06/18/1998 | WO1998026114A1 Process for the electrolytic deposition of copper layers |
| 06/18/1998 | WO1998025749A1 Injection molding encapsulation for an electronic device directly onto a substrate |
| 06/18/1998 | WO1998025725A1 Soldering/unsoldering arrangement |
| 06/18/1998 | DE19752555A1 Sende/Empfangsmodul für ein phasengesteuertes Radar Transmitting / receiving module for a phased array radar |
| 06/18/1998 | DE19752408A1 Power semiconductor module with cast resin housing |
| 06/18/1998 | DE19653681A1 Verfahren zur elektrolytischen Abscheidung von Kupferschichten mit gleichmäßiger Schichtdicke und guten optischen und metallphysikalischen Eigenschaften Process for the electrolytic deposition of copper layers with uniform thickness and good optical and physical properties of metal |
| 06/18/1998 | DE19652991A1 Selective gold plating of base layer-coated substrate to allow gold and aluminium wire bonding to same substrate |
| 06/18/1998 | DE19652238A1 Surface mounted component for circuit board (PCB) |
| 06/18/1998 | DE19651862A1 Verfahren zum Reflowlöten von mit SMD-Bauelementen bestückten Leiterplatten A method for reflow soldering of SMD components equipped with PCB |
| 06/17/1998 | EP0848587A2 Strap device and method for clamping soldered wires |
| 06/17/1998 | EP0848586A1 Apparatus and method for printing solder paste |
| 06/17/1998 | EP0848585A1 Process for the manufacture of printed circuit boards with plated resistors |
| 06/17/1998 | EP0848584A1 Three-dimensional electrical interconnection system |
| 06/17/1998 | EP0848583A1 Display device |
| 06/17/1998 | EP0848451A2 Device for electrically and mecanically connnecting two printed circuit boards situated at a distance from each other and apparatus comprising two printed circuit boards situated at a distance from each other connected with such a device |
| 06/17/1998 | EP0848449A1 Welded wire termination device and method |
| 06/17/1998 | EP0848447A2 Transmission circuit using strip line in three dimensions |
| 06/17/1998 | EP0847869A1 Barrier layer for laser ablative imaging |
| 06/17/1998 | EP0847829A1 Lead-free solder composition |
| 06/17/1998 | EP0847828A1 Solder material and electronic part using the same |
| 06/17/1998 | EP0847682A2 Screen printing method and screen printing apparatus |
| 06/17/1998 | EP0847596A1 Imaging system and method |
| 06/17/1998 | EP0847314A1 Method of manufacturing a sintered structure on a substrate |
| 06/17/1998 | EP0504411B1 Semiconductor device having many lead pins |
| 06/17/1998 | CN2284482Y Secondary group air knife of horizontal tin sprayer |
| 06/17/1998 | CN1185232A Semiconductor assembly |
| 06/17/1998 | CN1185087A Sheet for heat transfer substrate and method for mfg. the sheet, and heat transfer substrate using same and mfg. method therefor |
| 06/17/1998 | CN1038807C Printing wiring board |
| 06/17/1998 | CN1038806C Process for producing printed wiring board |
| 06/16/1998 | US5768217 Antennas and their making methods and electronic devices or timepieces with the antennas |
| 06/16/1998 | US5768108 Multi-layer wiring structure |
| 06/16/1998 | US5768107 Electric circuit substrate having a multilayer alignment mark structure |
| 06/16/1998 | US5768106 Layered circuit-board designing method and layered circuit-board |
| 06/16/1998 | US5768105 Flexible wiring board having a terminal array extending along a whole edge of its substrate and a connection structure of the flexible wiring board with a circuit board |
| 06/16/1998 | US5767817 Antenna apparatus having chip antenna and capacitance generating device |
| 06/16/1998 | US5767621 Display device having plate with electron guiding passages |
| 06/16/1998 | US5767580 Systems having shaped, self-aligning micro-bump structures |
| 06/16/1998 | US5767576 Snap lines localize cracks and cleavages formed by bending stress to the snap line |
| 06/16/1998 | US5767503 Method for the manufacture of contact-free cards |
| 06/16/1998 | US5767450 Coated conductor and production method of same and electronic components and electronic devices that use it |
| 06/16/1998 | US5767048 Dipping printed circuit board into halogen-free solvent mixture containing hydrocarbon and a metal complexing pyrrolidone, phosphine oxide or sulfoxide compound to dissolve adhered solder flux |
| 06/16/1998 | US5767008 Method for forming a gold plating electrode, a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming method |
| 06/16/1998 | US5766983 Tape automated bonding circuit with interior sprocket holes |
| 06/16/1998 | US5766825 Method of forming a resin laying in a surface laminated circuit |
| 06/16/1998 | US5766819 Donor elements, assemblages, and associated processes with flexible ejection layer(s) for laser-induced thermal transfer |
| 06/16/1998 | US5766808 Process for forming multilayer lift-off structures |
| 06/16/1998 | US5766741 Insulating paste and thick-film multi-layered printed circuit using the paste |
| 06/16/1998 | US5766740 Circuit |
| 06/16/1998 | US5766685 Treatment method and apparatus for printed circuit boards and the like |
| 06/16/1998 | US5766674 Method of producing a printed wiring board |
| 06/16/1998 | US5766670 Via fill compositions for direct attach of devices and methods for applying same |
| 06/16/1998 | US5766516 Silver-based conductive paste and multilayer ceramic circuit substrate using the same |
| 06/16/1998 | US5766515 Aqueous solution containing polythiophene in cationic form with a polystyrene sulfonic acid as polyanion and an organic compound containing hydroxy or polyhydroxy/and carboxy or amide groups or lactams or sugar/sugar derivatives |
| 06/16/1998 | US5766499 Deposition of metallic layer circuit pattern including element which precisely marks position of tool alignment hole and is sacrificed after formation of hole through substrate; simplification |
| 06/16/1998 | US5766497 Etching of dielectrics |
| 06/16/1998 | US5766492 Forming electric circuit on board, copper plating, forming resist coating on surface except for electrodes, subjecting electrodes to electrolytic plating, removing resist, removing copper from surface except on electric circuit |
| 06/16/1998 | US5766022 Electrical assembly |
| 06/16/1998 | US5765744 Production of small metal bumps |
| 06/16/1998 | US5765280 Method for making a carrier based IC packaging arrangement |
| 06/11/1998 | WO1998025443A1 Electronic circuit with a screening case to attenuate high-frequency interference |
| 06/11/1998 | WO1998025306A1 High-power microwave-frequency hybrid integrated circuit |
| 06/11/1998 | WO1998025253A1 Components for electrical and electronic circuits |
| 06/11/1998 | WO1998024860A1 Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
| 06/11/1998 | WO1998024558A1 Grafted thermoplastic elastomer barrier layer |
| 06/10/1998 | EP0847232A2 Method for drying resin-used electronic parts |
| 06/10/1998 | EP0847112A1 Continuous molded plastic components or assemblies |
| 06/10/1998 | EP0847084A2 Electronic modules manufacturing |
| 06/10/1998 | EP0846953A2 Printed circuit board inspecting apparatus, and method of using a universal-type printed circuit board inspecting apparatus |
| 06/10/1998 | EP0846520A1 Solder bump forming method, solder bump forming apparatus, head unit for use therein and soldering method using the head unit |
| 06/10/1998 | EP0846348A1 Ceramic stripline filter |
| 06/10/1998 | EP0846158A1 Cleaning composition containing an aliphatic hydrocarbon compound with at least two aromatic substituents |
| 06/10/1998 | EP0729397B1 Fluxless soldering pretreating system and method using fluorine-containing plasma |
| 06/10/1998 | EP0560861B1 Tacking agent |
| 06/10/1998 | DE19721967A1 Memory component with base platelet and several types of applied unit platelets |
| 06/10/1998 | DE19703058C1 Non-conductive substrate for chip card carrier element |