| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 03/02/1999 | US5876156 Printed-circuit board holding device |
| 03/02/1999 | US5875546 Method of forming solder-holding clips for applying solder to connectors |
| 03/02/1999 | CA2113752C Inspection system for cross-sectional imaging |
| 02/25/1999 | WO1999009795A1 Process for the formation of composite films |
| 02/25/1999 | WO1999009794A1 The production of three-dimensional printed-circuit boards |
| 02/25/1999 | WO1999009590A1 Method for forming bump electrode and method for manufacturing semiconductor device |
| 02/25/1999 | WO1999009103A1 Dual curing silicone compositions |
| 02/25/1999 | WO1999009101A1 Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods |
| 02/25/1999 | WO1999008879A1 Method of making masks and electronic parts |
| 02/25/1999 | DE19831876A1 Producing contact between flexible conductor and substrate |
| 02/25/1999 | DE19736273A1 Protective lacquer coating device for printed circuit board |
| 02/25/1999 | DE19736093A1 Production of conductive metallized three-dimensional polymer article |
| 02/25/1999 | CA2302685A1 Dual curing silicone compositions |
| 02/24/1999 | EP0898443A1 Reflow soldering device |
| 02/24/1999 | EP0898340A1 Electrical connector having reduced cross-talk |
| 02/24/1999 | EP0898326A2 Method of fabricating electronic device employing a flat flexible circuit and including the device itself |
| 02/24/1999 | EP0898311A2 Surface mounting type semiconductor package mounted on a multilayer mounting substrate |
| 02/24/1999 | EP0898309A2 An integrated circuit anti-bridging leads design |
| 02/24/1999 | EP0898172A1 Testing printed circuit assemblies |
| 02/24/1999 | EP0897975A1 Cleaning solution |
| 02/24/1999 | EP0897938A2 Epoxy group-containing resin compositions |
| 02/24/1999 | EP0897654A1 Process for establishing electrically conducting connections between two or more conductor structures |
| 02/24/1999 | EP0897653A1 A circuit board |
| 02/24/1999 | EP0897351A1 Overlay substrate for securing electronic devices in a vehicle |
| 02/24/1999 | EP0706678B1 Method of photolithographically producing a copper pattern on a plate of an electrically insulating material |
| 02/24/1999 | EP0705484B1 Method of manufacturing a device whereby a support bar is provided with conductor tracks for electrically contacting a semiconductor element |
| 02/24/1999 | CN1208961A Surface mounting type semiconductor package mounted on multiplayer mounting substrate |
| 02/24/1999 | CN1208959A High-frequency integrated circuit device and mfr. method thereof |
| 02/24/1999 | CN1208955A IC-mounted structre, liquid crystal device and electronic device |
| 02/23/1999 | US5875102 Eclipse via in pad structure |
| 02/23/1999 | US5875100 High-density mounting method and structure for electronic circuit board |
| 02/23/1999 | US5875011 Liquid crystal display tile interconnected to a tile carrier and method |
| 02/23/1999 | US5874983 Thermal print head |
| 02/23/1999 | US5874776 Chip carrier |
| 02/23/1999 | US5874770 Flexible interconnect film including resistor and capacitor layers |
| 02/23/1999 | US5874516 Nonfunctionalized poly(arylene ethers) |
| 02/23/1999 | US5874370 Substrate comprising sheet of cloth coated with partly cured first thermosettting resin having better adhesion to cloth, b-stage cured second resin having better adhesion to metal, laminated between two sheets of metal and fully cured |
| 02/23/1999 | US5874199 Method of forming oversized solder bumps |
| 02/23/1999 | US5874197 Thermal assisted photosensitive composition and method thereof |
| 02/23/1999 | US5874190 Using alignment marks on back of workpiece, positioning of the mask to the workpiece by means of light from light radiation device without the workpiece being in place, positioning marks relative to marks of workpiece, projecting pattern, exposing |
| 02/23/1999 | US5874175 Brazed bonding layer being microscopically void-free |
| 02/23/1999 | US5874174 Conductor film and its forming method |
| 02/23/1999 | US5874162 Weighted sintering process and conformable load tile |
| 02/23/1999 | US5874154 For subsequent plating of metals from an electroless plating bath, improved adhesion and etchability, for electronic components |
| 02/23/1999 | US5874152 Method of making a composite laminate and a PWB substrate so made |
| 02/23/1999 | US5874125 Activating catalytic solution for electroless plating and method of electroless plating |
| 02/23/1999 | US5874043 High solidus temperature, high strength, nontoxic solder for joining microelectronic structures |
| 02/23/1999 | US5874009 Forming through holes by etching copper and insulating adhesive layers |
| 02/23/1999 | US5873939 Dual track stencil/screen printer |
| 02/23/1999 | US5873742 Board-to-board connector assembly |
| 02/23/1999 | US5873512 Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier |
| 02/23/1999 | US5873511 Apparatus and method for forming solder bonding pads |
| 02/23/1999 | US5873162 Technique for attaching a stiffener to a flexible substrate |
| 02/23/1999 | US5873161 Method of making a Z axis interconnect circuit |
| 02/23/1999 | CA2074648C Polyimide multilayer wiring substrate and method for manufacturing the same |
| 02/20/1999 | CA2245317A1 Circuit card connector with isolation base assembly |
| 02/18/1999 | WO1999008498A1 Contact arrangement linking two substrates and method for the production of said contact arrangement |
| 02/18/1999 | WO1999008496A1 Circuit board mount |
| 02/18/1999 | WO1999008495A2 Method of manufacturing surface-mountable sil hybrid circuit |
| 02/18/1999 | WO1999008494A1 Temperature measuring type outside connecting mechanism for printed wiring board |
| 02/18/1999 | WO1999008320A1 Resin-sealed surface mounting type electronic parts |
| 02/18/1999 | WO1999008297A2 Method of manufacturing a plurality of electronic components |
| 02/18/1999 | WO1998036624A3 Laminated multilayer substrates |
| 02/18/1999 | WO1998032159A3 Mounting structure and mounting process from semiconductor devices |
| 02/18/1999 | DE19743251C1 SMT-type electrical connector for circuit board |
| 02/18/1999 | DE19735426A1 Printed circuit board coupling element |
| 02/18/1999 | DE19732845C1 Multiple stacking structure for pressing multilayer circuit boards |
| 02/18/1999 | DE19730865A1 Heat sink for an electronic component especially a ceramic circuit board |
| 02/18/1999 | DE19727230C1 Low viscose adhesive droplets assessment |
| 02/18/1999 | CA2283821A1 Circuit board mount |
| 02/17/1999 | EP0897204A2 Electrical connections |
| 02/17/1999 | EP0896971A1 Curable resin composition for overcoat of flexible circuit |
| 02/17/1999 | EP0896898A2 Supporting means for vehicle lights and method for mounting electronic parts on it particularly LEDs |
| 02/17/1999 | EP0896787A1 A multi-layer moulded electronic device and method for manufacturing same |
| 02/17/1999 | EP0896752A1 Process and arrangement for establishing an electric connection |
| 02/17/1999 | EP0896706A1 Resonant tag and method of manufacturing the same |
| 02/17/1999 | EP0896673A1 Methods and systems for increased numbers of test points on printed circuit boards |
| 02/17/1999 | CN1208506A Circuit board clip connector |
| 02/17/1999 | CN1208368A Fabricating interconnects and tips using sacrificial substrates |
| 02/17/1999 | CN1208362A Method of filtering the organic solutions arising in the production of circuit boards |
| 02/17/1999 | CN1208318A Connection apparatus between circuit boards |
| 02/17/1999 | CN1042187C Wire dispensing board for electric test and manufacture of same |
| 02/16/1999 | US5872935 Method and apparatus for providing a remotely located outrigger card electrically coupled to a control card |
| 02/16/1999 | US5872719 Method of wiring semiconductor integrated circuit and semiconductor integrated circuit |
| 02/16/1999 | US5872701 Blind alignment method and apparatus for circuit boards |
| 02/16/1999 | US5872404 Interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating |
| 02/16/1999 | US5872400 High melting point solder ball coated with a low melting point solder |
| 02/16/1999 | US5872399 Solder ball land metal structure of ball grid semiconductor package |
| 02/16/1999 | US5872338 For supporting one or more electronic components |
| 02/16/1999 | US5872337 Chip carrier and cable assembly reinforced at edges |
| 02/16/1999 | US5872333 Connector fixing construction |
| 02/16/1999 | US5872051 Process for transferring material to semiconductor chip conductive pads using a transfer substrate |
| 02/16/1999 | US5871868 Lamination a dielectric layer on surface, forming a protective layer with photolithographic mask, machining to shape dielectric layer onto a surface of a substrate to form a laminate structure; |
| 02/16/1999 | US5871842 For preventing contaminants from permeating through the substrate silicon rubber keypad |
| 02/16/1999 | US5871840 Nickel powder containing a composite oxide of La and Ni and process for preparing the same |
| 02/16/1999 | US5871822 Low emissions method for spray application of conformal coating to electronic assemblies |
| 02/16/1999 | US5871819 Two step coating; partially curing thermosetting resin/solvent mixture; filling, covering, curing again; printed circuits |
| 02/16/1999 | US5871808 Method for preserving solder paste in the manufacturing of printed circuit board assemblies |
| 02/16/1999 | US5871672 Polypyrroles, polyanilines or polythiophenes with silver salts and ionic conducting exchange polymers |
| 02/16/1999 | US5871592 Solder and soldering method |