| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/16/1998 | EP0884934A2 Substrate and method for producing it |
| 12/16/1998 | EP0884801A2 Insertion shell for printed circuit board |
| 12/16/1998 | EP0884775A1 Electronic component and manufacturing method therefor |
| 12/16/1998 | EP0884128A1 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
| 12/16/1998 | EP0883980A1 High speed depaneling apparatus and method |
| 12/16/1998 | EP0883862A1 Integrated circuit card comprising a conductor pattern made of a conductive polymer |
| 12/16/1998 | EP0852897A4 Method for surface mounting a heatsink to a printed circuit board |
| 12/16/1998 | EP0766908B1 Method and device for coating printed-circuit boards, in particular for the manufacture of multi-chip-modules |
| 12/16/1998 | EP0583407B1 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards |
| 12/16/1998 | CN1202276A Circuit board for mounting electronic parts |
| 12/16/1998 | CN1202040A Piezoelectric resonator and electronic component device using the same |
| 12/16/1998 | CN1202010A Static electricity removing structure for portable electronic devices |
| 12/16/1998 | CN1201986A Electronic component material containing insect repellent, electronic mail using the material and manufacture thereof |
| 12/15/1998 | US5850171 Process for manufacturing resistor-networks with higher circuit density, smaller input/output pitches, and lower precision tolerance |
| 12/15/1998 | US5850146 Probe apparatus for electrical inspection of printed circuit board assembly |
| 12/15/1998 | US5849857 Production method for photo-sensitive resin and liquid photo-sensitive resin composition |
| 12/15/1998 | US5849808 Organic solvent soluble photoresists which are developable in aqueous alkaline solutions |
| 12/15/1998 | US5849680 Cleaning with limonene, BHT, and acetylacetonate |
| 12/15/1998 | US5849633 Electrically conductive projections and semiconductor processing method of forming same |
| 12/15/1998 | US5849623 Method of forming thin film resistors on organic surfaces |
| 12/15/1998 | US5849609 Semiconductor package and a method of manufacturing thereof |
| 12/15/1998 | US5849460 Photosensitive resin composition and method for using the same in manufacture of circuit boards |
| 12/15/1998 | US5849396 Multilayer electronic structure and its preparation |
| 12/15/1998 | US5849230 Method of manufacturing a card with a built-in electronic part, formed of a plurality of resin layers |
| 12/15/1998 | US5849170 Electroless/electrolytic methods for the preparation of metallized ceramic substrates |
| 12/15/1998 | US5849132 Ball contact for flip-chip devices |
| 12/15/1998 | US5849106 Cleaning process |
| 12/15/1998 | US5848685 Photolithographically patterned spring contact |
| 12/15/1998 | US5848466 Method for forming a microelectronic assembly |
| 12/15/1998 | US5848462 Method for mounting an electronic component on a wiring substrate and an illuminating switch unit using this mounting method |
| 12/15/1998 | CA2154446C Process for the production of plastic laminates with metal laminae especially for printed circuits made from endless bands |
| 12/15/1998 | CA2134257C Ball grid array plastic package |
| 12/10/1998 | WO1998056220A1 Single-sided circuit board and method for manufacturing the same |
| 12/10/1998 | WO1998056219A1 Multilayer printed wiring board and method for manufacturing the same |
| 12/10/1998 | WO1998056218A1 Fine pitch component placement method and apparatus |
| 12/10/1998 | WO1998056216A1 Method and device for producing wire-written printed circuit boards |
| 12/10/1998 | WO1998056074A1 Spiral leaf spring contact |
| 12/10/1998 | WO1998056019A1 Method for making a transponder coil and transponder produced by said method |
| 12/10/1998 | WO1998055669A2 Conductor track structures arranged on a nonconductive support material, especially fine conductor track structures, and method for producing the same |
| 12/10/1998 | WO1998055316A1 Bonding system in an inkjet printer pen and method for providing the same |
| 12/10/1998 | WO1998055108A1 Device and methods for wound treatment |
| 12/10/1998 | DE19824639A1 Finely perforated glass substrate with silver concentration gradient |
| 12/10/1998 | DE19822511A1 Surface fastenable electronic component |
| 12/10/1998 | DE19736352C1 Apparatus for contacting flat items in continuous galvanising installations |
| 12/10/1998 | DE19736208C1 Electromagnetic sealing device for screen housing and circuit board e.g. for communications apparatus |
| 12/10/1998 | DE19724059A1 Installation for galvanizing electronic circuit boards and similar items |
| 12/10/1998 | DE19723734A1 Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial, insbesondere feine Leiterbahnstrukturen, und Verfahren zu ihrer Herstellung Conductor track structures on a non-conductive carrier material, in particular fine conductor track structures, and processes for their preparation |
| 12/10/1998 | CA2281713A1 Fine pitch component placement method and apparatus |
| 12/09/1998 | EP0883332A1 Control device |
| 12/09/1998 | EP0883331A2 Electroplating process |
| 12/09/1998 | EP0883330A1 Circuit board with primary and secondary through holes |
| 12/09/1998 | EP0883329A2 Anisotropic conductive film |
| 12/09/1998 | EP0883182A2 Lattice arrangement of electrodes on a multi-layer circuit board |
| 12/09/1998 | EP0883176A2 Cooling fin with clip for power semiconductor |
| 12/09/1998 | EP0883173A1 Circuit board for mounting electronic parts |
| 12/09/1998 | EP0883029A1 Exposure apparatus |
| 12/09/1998 | EP0882544A1 A lead-free tin-silver-based soldering alloy |
| 12/09/1998 | EP0882384A1 Metal ball grid electronic package |
| 12/09/1998 | EP0882108A1 Polyamide based laminating, coverlay, and bond ply adhesive with heat activated cure component |
| 12/09/1998 | EP0882086A1 Composition exhibiting improved fluorescent response |
| 12/09/1998 | EP0882079A1 Reversible and irreversible water-based coatings |
| 12/09/1998 | EP0606355B1 Method and compositions for diffusion patterning |
| 12/09/1998 | EP0521904B1 Modification of polymer surfaces |
| 12/09/1998 | CN1201586A Multilayer printed circuit board and process for producing same |
| 12/09/1998 | CN1201574A Method and device to fasten a loudspeaker to circuit board |
| 12/09/1998 | CN1201556A Solder-holding clips for applying solder to connectors |
| 12/09/1998 | CN1201367A Multi-layer printed circuit board and mfg. method thereof |
| 12/09/1998 | CN1201365A Electric component and fitting structural assembly |
| 12/09/1998 | CN1201364A Method and apparatus for making circuit assembly and device thereof |
| 12/09/1998 | CN1201361A Loop base |
| 12/09/1998 | CN1201359A Heating head and mfg. method thereof |
| 12/09/1998 | CN1201257A Semiconductor package body and semiconductor module using same |
| 12/09/1998 | CN1201255A Electronic-element assembly having package material and formation method therefor |
| 12/09/1998 | CN1201241A Metal-ceramic composition chip, production method therefor, and soldering material for said method |
| 12/09/1998 | CN1201164A Light-sensitive resin composition and application of its light-sensitivity |
| 12/09/1998 | CN1200967A Metal powder and preparing method thereof |
| 12/09/1998 | CN1041150C Large ceramic article and method of mfg. Same |
| 12/08/1998 | US5847960 Multi-tool positioning system |
| 12/08/1998 | US5847937 Method for contacting high-current connecting elements of an electrical component, and assembly made by such a method |
| 12/08/1998 | US5847936 Optimized routing scheme for an integrated circuit/printed circuit board |
| 12/08/1998 | US5847934 Hybrid integrated circuit |
| 12/08/1998 | US5847930 Edge terminals for electronic circuit modules |
| 12/08/1998 | US5847458 Semiconductor package and device having heads coupled with insulating material |
| 12/08/1998 | US5847456 Semiconductor device |
| 12/08/1998 | US5847451 Multi-layered printed circuit board, and grid array package adopting the same |
| 12/08/1998 | US5847356 Laser welded inkjet printhead assembly utilizing a combination laser and fiber optic push connect system |
| 12/08/1998 | US5847346 Configurable electric switch for vehicle |
| 12/08/1998 | US5847327 Dimensionally stable core for use in high density chip packages |
| 12/08/1998 | US5847326 Low-temperature fired ceramic circuit substrate with improved Ag-Au connection reliability |
| 12/08/1998 | US5847324 High performance electrical cable |
| 12/08/1998 | US5846854 Electrical circuits with very high conductivity and high fineness, processes for fabricating them, and devices comprising them |
| 12/08/1998 | US5846853 Process for bonding circuit substrates using conductive particles and back side exposure |
| 12/08/1998 | US5846665 Method for electroplating high-impact plastics |
| 12/08/1998 | US5846662 Release liners for molded product production |
| 12/08/1998 | US5846615 Direct deposition of a gold layer |
| 12/08/1998 | US5846606 Process for the production of metallized materials |
| 12/08/1998 | US5846366 Method for interconnecting an electronic device using a transferable solder carrying medium |
| 12/08/1998 | US5846361 Lamination process for producing non-planar substrates |
| 12/08/1998 | US5846094 Electrical coupling method and apparatus for printed circuit boards including a method of assembly |
| 12/08/1998 | US5845838 Process for remelting a contact surface metallization |