Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1999
03/09/1999US5880657 Printed wiring board modified gull wing signal lead connection
03/09/1999US5880520 Low mutual inductance lead frame device
03/09/1999US5880405 Terminal structure for electronic part with stepped offset portions
03/09/1999US5880203 Bonding electronics diene urethane resins
03/09/1999US5880024 Semiconductor device having wiring self-aligned with shield structure and process of fabrication thereof
03/09/1999US5880017 Method of bumping substrates by contained paste deposition
03/09/1999US5880011 Method and apparatus for manufacturing pre-terminated chips
03/09/1999US5879965 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
03/09/1999US5879854 Photoresist layer supporting polyester film and photoresist film laminate
03/09/1999US5879788 Silver-palladium conductor, lead borosilicate glass, gold conductor
03/09/1999US5879787 Method and apparatus for improving wireability in chip modules
03/09/1999US5879761 Method for forming electrically conductive polymer interconnects on electrical substrates
03/09/1999US5879738 Method for fluid transport for the surface treatment of planar substrates
03/09/1999US5879568 For production of hydrogen and oxygen
03/09/1999US5879531 Method of manufacturing an array of electrical conductors
03/09/1999US5879530 Annealing a multilayer film comprising metal and polymer layers
03/09/1999US5879468 Method for the removal of thermoset potting compound from the electronics package of a munitions item
03/09/1999US5879172 Surface mounted adapter using elastomeric conductors
03/09/1999US5878943 Method of fabricating an electronic circuit device and apparatus for performing the method
03/09/1999US5878942 Soldering method and soldering apparatus
03/09/1999US5878941 Method of soldering components on a carrier foil
03/09/1999US5878911 Solder-ball supplying apparatus
03/09/1999US5878661 Self-shearing stencil
03/09/1999US5878487 Method of supporting an electrical circuit on an electrically insulative base substrate
03/09/1999US5878486 Method of burning-in semiconductor devices
03/09/1999US5878485 Method for fabricating a carrier for testing unpackaged semiconductor dice
03/09/1999US5878483 Hammer for forming bulges in an array of compliant pin blanks
03/04/1999WO1999011107A1 Assembly consisting of a substrate for power components and a cooling element and method for the production thereof
03/04/1999WO1999011105A1 Method for producing electroconductive structures
03/04/1999WO1999010926A1 Method for producing electrically conductive cross connections between two layers of wiring on a substrate
03/04/1999WO1999010769A1 Applications for encapsulated electrophoretic displays
03/04/1999WO1999010768A1 Novel addressing schemes for electrophoretic displays
03/04/1999WO1999010767A1 Electrophoretic displays and materials
03/04/1999WO1999010734A1 Method and device for determining a parameter for a metallization bath
03/04/1999WO1999010568A2 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated
03/04/1999WO1999010564A2 Method and device for regulating the concentration of substances in electrolytes
03/04/1999WO1999010186A1 Image forming material, image forming method, lithographic printing plate manufacturing method and apparatus, lithographic printing plate making method, and printed wiring board manufacturing method
03/04/1999WO1998057226A3 Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate
03/04/1999WO1998055669A3 Conductor track structures arranged on a nonconductive support material, especially fine conductor track structures, and method for producing the same
03/04/1999WO1998054545A3 Position transducer and method of manufacture
03/04/1999DE19839645A1 Magnetic field detector
03/04/1999DE19837336A1 Encapsulating integrated circuits assembled on a substrate
03/04/1999DE19738399A1 Verfahren zur Verbindung von elektronischen Bauelementen mit einem Trägersubstrat A method for connection of electronic components to a carrier substrate
03/04/1999DE19737730A1 Electronic control unit and individual components of the unit
03/04/1999DE19737698A1 Electronic control unit and individual components of the unit
03/04/1999DE19737692A1 Electronic control unit and individual components of the unit
03/04/1999DE19736962A1 Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben Arrangement comprising a carrier substrate for power components and a heat sink and method for manufacturing the same
03/04/1999DE19735409A1 Printed circuit board with contact element
03/04/1999DE19731346A1 Wiring trace, especially fine structure, adhering firmly to insulating flat or three-dimensional substrate
03/04/1999CA2301315A1 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated
03/04/1999CA2301299A1 Method and device for regulating the concentration of substances in electrolytes
03/03/1999EP0899992A2 Embedded thin film passive components
03/03/1999EP0899842A1 Multilayer interconnection board and connection pin
03/03/1999EP0899830A2 Circuit card connector with isolation base assembly
03/03/1999EP0899821A2 User interface
03/03/1999EP0899787A2 Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structurs formed thereby
03/03/1999EP0899550A1 Circuit arrangement with an SMD-component, especially a temperature sensor, and method of making a temperature sensor
03/03/1999EP0899053A2 A plated product and a method and apparatus for producing the same
03/03/1999EP0898857A2 Method for connecting area grid arrays to printed wire board
03/03/1999EP0898802A1 Protective device for an electronic circuit
03/03/1999EP0898794A1 Electrical and thermal anisotropically conducting structure
03/03/1999EP0898712A2 Wafer-level burn-in and test
03/03/1999EP0898603A1 Adhesive compositions and methods of use
03/03/1999EP0801883B1 Method and device for the treatment of plate-shaped workpieces having small holes
03/03/1999EP0717443B1 Integrated circuit device
03/03/1999EP0702806B1 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material
03/03/1999EP0698290B1 Power semiconductor device with stress buffer layer
03/03/1999CN1209942A Process for reflow soldering of printed circuit board fitted with SMD-components
03/03/1999CN1209887A Display device and telephone set comprising same
03/03/1999CN1209886A Method and apparatus for bonding adhesive tape of liquid crystal panel
03/03/1999CN1209783A Soft-pack package and dispensing system for liquid photosensitive formed solder mask
03/03/1999CN1209721A Spherical array type packing plate tin-ball electroplating method
03/03/1999CN1209468A Micro-etching agent for copper and copper alloy
03/02/1999US5877943 Clustering adapter for spherical shaped devices
03/02/1999US5877940 Fabrication multilayer combined rigid/flex printed circuit board
03/02/1999US5877937 Encapsulated semiconductor device and electronic circuit board mounting same
03/02/1999US5877669 Flyback transformer having a flexible coil winding structure and manufacturing process thereof
03/02/1999US5877560 Flip chip microwave module and fabrication method
03/02/1999US5877559 Film carrier for fine-pitched and high density mounting and semiconductor device using same
03/02/1999US5877550 Hybrid module and method of manufacturing the same
03/02/1999US5877549 UFBGA package equipped with interface assembly including a photosoluble layer
03/02/1999US5877548 Terminal configuration in semiconductor IC device
03/02/1999US5877545 Encapsulated printed circuit assembly and method and manufacturing the same
03/02/1999US5877543 Device assembly structure with reinforced outer leads
03/02/1999US5877079 Method for manufacturing a semiconductor device and a method for mounting a semiconductor device for eliminating a void
03/02/1999US5876859 Direct metal bonding
03/02/1999US5876842 Modular circuit package having vertically aligned power and signal cores
03/02/1999US5876841 Conductive paste and conductor and ceramic substrate comprising the same
03/02/1999US5876795 Method for producing a low-stress electrolessly deposited nickel layer
03/02/1999US5876789 Curved three dimensional mold for radio frequency device
03/02/1999US5876580 Rough electrical contact surface
03/02/1999US5876549 Method and apparatus for stacking sheets supported by carriers
03/02/1999US5876538 Method for manufacturing a ceramic multilayer substrate for complex electronic circuits
03/02/1999US5876507 Fluid treatment device and method
03/02/1999US5876499 Solder spray leveller
03/02/1999US5876498 Apparatus for preserving solder paste in the manufacturing of printed circuit board assemblies
03/02/1999US5876245 Circuit board electrical connector
03/02/1999US5876221 Surface mount contact assembly for printed circuit board
03/02/1999US5876216 Integrated connector board for disc drive storage systems
03/02/1999US5876215 Separable electrical connector assembly having a planar array of conductive protrusions
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