Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/1998
12/08/1998US5845572 Circuit board screener spot suppressor
12/08/1998CA2166177C Polymers and use in photoimageable compositions
12/05/1998CA2232238A1 Method of soldering materials supported on low-melting substrates
12/03/1998WO1998054936A1 Rigid/flex printed circuit board using angled prepreg
12/03/1998WO1998054761A1 Copper circuit junction substrate and method of producing the same
12/03/1998WO1998054738A1 Capacitor connector, especially for an electrolytic power capacitor
12/03/1998WO1998054733A2 Low profile pin-less planar magnetic devices and method of making same
12/03/1998WO1998054618A1 Liquid crystal display and its manufacture and electronic apparatus
12/03/1998WO1998054545A2 Position transducer and method of manufacture
12/03/1998WO1998054375A1 Vacuum deposition system including mobile source
12/03/1998WO1998042167A3 Method and device for measuring a device for producing electrical components
12/03/1998DE19801493A1 Semiconductor component housing with numerous electrodes
12/03/1998DE19755408A1 Electrical assembly for electrical appliance
12/03/1998DE19738589A1 Circuit board with insulating carrier-substrate e.g. for chip-card manufacture
12/03/1998DE19722910A1 Kondensatoranschluß, insbesondere für einen Elektrolyt-Kondensator Capacitor connection, in particular for an electrolytic capacitor
12/03/1998DE19722648A1 Method of aligning and mounting an electrical or electronic component
12/03/1998CA2289558A1 Rigid/flex printed circuit board using angled prepreg
12/03/1998CA2239388A1 Cooling plate connecting clip for power semiconductors
12/02/1998EP0881866A1 Control device
12/02/1998EP0881719A2 Electrical connection between a movable electrical component and a flexible, elastic strip conductor carrier
12/02/1998EP0881119A2 Control device for the reflector of a vehicle headlamp
12/02/1998EP0881078A2 Thermal head and its fabrication method
12/02/1998EP0880754A2 Method and device for bonding a wire conductor
12/02/1998EP0880526A1 Heterocycle-condensed morphinoid derivatives (ii)
12/02/1998EP0760873B1 Electrolytic method and device for the continuous and uniform metallization or etching of metal surfaces
12/02/1998CN1200647A Product and method for placing particles on contact pads of electronic devices
12/02/1998CN1200316A Solder and electronic elements utilizing same
12/02/1998CN1200312A Nickel powder and process for preparing same
12/02/1998CN1041035C Multi-chip module
12/01/1998USRE35975 Cleaning and drying of electronic assemblies
12/01/1998US5844782 Printed wiring board and electronic device using same
12/01/1998US5844779 Semiconductor package, and semiconductor device using the same
12/01/1998US5844776 Static memory device having compatibility with a disk drive installed in an electronic apparatus
12/01/1998US5844762 Electronic circuit device having a function of inhibiting resonance in power wiring
12/01/1998US5844753 Magnetic head junction board and manufacturing method for the same
12/01/1998US5844751 Laminated structures for a disk drive suspension assembly
12/01/1998US5844468 Chip network electronic component
12/01/1998US5844418 Carrier having interchangeable substrate used for testing of semiconductor dies
12/01/1998US5844330 Discharge of capacitor component
12/01/1998US5844320 Semiconductor unit with semiconductor device mounted with conductive adhesive
12/01/1998US5844319 Microelectronic assembly with collar surrounding integrated circuit component on a substrate
12/01/1998US5844316 Fixture for handling and attaching conductive spheres to a substrate
12/01/1998US5844315 Low-profile microelectronic package
12/01/1998US5844314 Liquid crystal display
12/01/1998US5844308 Electronic package
12/01/1998US5844216 System and apparatus for reducing arcing and localized heating during microwave processing
12/01/1998US5844173 Collector terminal for contact with a battery supplying an electronic circuit, and an electronic circuit and a radio remote control emitter incorporating such a terminal
12/01/1998US5844018 Tooth restoration composition, structure and methods
12/01/1998US5843807 Method of manufacturing an ultra-high density warp-resistant memory module
12/01/1998US5843806 Methods for packaging tab-BGA integrated circuits
12/01/1998US5843621 Process and apparatus for coating printed circuit boards
12/01/1998US5843550 Adhesive tape for tape automated bonding
12/01/1998US5843517 Composition and method for selective plating
12/01/1998US5843371 Lead-free soldering material having superior solderability
12/01/1998US5843363 Ablation patterning of multi-layered structures
12/01/1998US5843287 Method for recovering metals from waste
12/01/1998US5843251 Process for connecting circuits and adhesive film used therefor
12/01/1998US5842877 Shielded and impedance-matched connector assembly, and associated method, for radio frequency circuit device
12/01/1998US5842627 Soldering apparatus and a method thereof
12/01/1998US5842626 Method for coupling surface mounted capacitors to semiconductor packages
12/01/1998US5842275 Reflow soldering to mounting pads with vent channels to avoid skewing
12/01/1998US5842274 Method of forming discrete solder portions on respective contact pads of a printed circuit board
12/01/1998US5842273 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
11/1998
11/30/1998CA2236609A1 Thermal head and its fabrication method
11/26/1998WO1998053651A1 A system and method for packaging integrated circuits
11/26/1998WO1998053499A1 Substrate for electronic packaging, pin jig fixture
11/26/1998WO1998053498A1 Improved solder ball joint
11/26/1998WO1998053494A1 Method of manufacturing a patterned array of solder bumps
11/26/1998WO1998053493A1 A system and method for packaging integrated circuits
11/26/1998WO1998052851A1 A device for holding and carrying objects
11/26/1998DE19738208A1 Adhesive premixture for flexible printed lead plate
11/26/1998CA2295541A1 A system and method for packaging integrated circuits
11/26/1998CA2290819A1 Substrate for electronic packaging, pin jig fixture
11/26/1998CA2290396A1 A system and method for packaging integrated circuits
11/26/1998CA2289079A1 Improved solder ball joint
11/26/1998CA2288912A1 Method of manufacturing a patterned array of solder bumps
11/25/1998EP0880179A2 Venting hole designs for multilayer conductor-dielectric structures
11/25/1998EP0880157A2 Electrical part and mounting structure therefor
11/25/1998EP0880146A1 Anisotropic conductive composition
11/25/1998EP0879489A1 Circuit board clip connector
11/25/1998EP0879465A2 Data processing of a bitstream signal
11/25/1998EP0879439A1 A display device and a telephone set comprising such a display device
11/25/1998EP0879304A2 Production of bevelled galvanic structures
11/25/1998EP0879112A1 Fluxless soldering method
11/25/1998EP0788727B1 Process for manufacturing electrical circuit bases
11/25/1998EP0707746A4 Flex circuit connector
11/25/1998CN1200186A Screen printing method and screen printing apparatus
11/25/1998CN1200010A Printed circuit board with integrated twisted pair conductor
11/25/1998CN1199956A High frequency amplifier with guard circuit and radio wave transmission apparatus including the same
11/25/1998CN1199910A Printed circuit transformer hybrids for mixers
11/25/1998CN1199874A Positive-tone photoimageable crosslinkable coating
11/25/1998CN1040868C Partially crystallizable low temperature melting glass
11/24/1998US5842057 Camera with lens barrier apparatus
11/24/1998US5841414 Liquid crystal display device
11/24/1998US5841340 Solderless RF power film resistors and terminations
11/24/1998US5841198 Ball grid array package employing solid core solder balls
11/24/1998US5841190 High density multi-layered printed wiring board, multi-chip carrier and semiconductor package
11/24/1998US5841183 Chip resistor having insulating body with a continuous resistance layer and semiconductor device
11/24/1998US5841102 Multiple pulse space processing to enhance via entrance formation at 355 nm
11/24/1998US5841099 Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
1 ... 894 895 896 897 898 899 900 901 902 903 904 905 906 907 908 909 910 911 912 913 914 ... 1185