Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1998
11/24/1998US5841074 For distributing power from a power source
11/24/1998US5840627 Method of customizing integrated circuits using standard masks and targeting energy beams for single resist development
11/24/1998US5840417 A multiplicity of electrically conductive adhesive members, each being separated from each other by means of a non-electrically conductive adhesive; useful in the assembly of multi-chip modules and multilayer electronic devices
11/24/1998US5840402 Metallized laminate material having ordered distribution of conductive through holes
11/24/1998US5840382 Ceramic substrate, glass adhesive layer; nonwarping, noncracking; capacitors, resistors
11/24/1998US5840369 Screen printing polyimide precursor ink on substrate, removing solvent, thermally curing ink to form polyimide relief pattern film
11/24/1998US5840363 Directly depositing monomer on substrate without oxidative pretreatment, polymerizing using acidic oxidative solution, removing any polymer bonded to metal-clad locations
11/24/1998US5840215 Anisotropic conductive adhesive compositions
11/24/1998US5840170 Contacting plating composition with a macroreticular resin
11/24/1998US5840126 Washing material in aqueous solution containing water repellent surfactant, applying sonication to remove contaminants, allowing monomolecular layer of surfactant to form on surface, rinsing with pure water, drying
11/24/1998US5839916 Device for connecting a flat cable to a wiring board
11/24/1998US5839641 Apparatus for placing and aligning solder balls onto solder pads on a substrate for manufacturing IC devices
11/24/1998US5839363 Method and apparatus for separating a silk screen from a printed object
11/24/1998US5839193 Method of making laminated structures for a disk drive suspension assembly
11/24/1998US5839191 Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package
11/24/1998US5839190 Methods for fabricating solderless printed wiring devices
11/24/1998US5839189 Bracket for attaching pin-in-hole components to a surface mount board
11/24/1998US5839188 Method of manufacturing a printed circuit assembly
11/24/1998CA2142611C A multiple layer printed circuit board
11/24/1998CA2064784C Capacitor laminate for printed circuit board
11/19/1998WO1998052393A1 Surface mount power supply device
11/19/1998WO1998052392A1 An interconnection system and pin for double faced printed circuits by double process, wave and refusion
11/19/1998WO1998052391A1 Methods of fixturing flexible circuit substrates and a processing carrier, and processing a flexible circuit
11/19/1998WO1998052224A1 Lithographically defined microelectronic contact structures
11/19/1998WO1998051998A1 Measuring system
11/19/1998WO1998051756A1 Adhesive, method for bonding, and assemblies of mounted boards
11/19/1998WO1998051485A1 Very ultra thin conductor layers for printed wiring boards
11/19/1998DE19821702A1 Instrument panel for vehicle
11/19/1998DE19746408A1 Electronic component mounting method for laser diode
11/19/1998DE19740946A1 Semiconductor chip and housing arrangement for memory device
11/19/1998DE19734110C1 Electrical device with heat sink mat for electronic component board
11/19/1998DE19720196A1 Messwerk Measuring equipment
11/19/1998CA2289733A1 Adhesive, method for bonding, and assemblies of mounted boards
11/19/1998CA2289628A1 Very ultra thin conductor layers for printed wiring boards
11/18/1998EP0878987A1 Printed circuit board
11/18/1998EP0878986A1 Interconnection system and pin for double-faced printed circuits by double process, wave and reflow soldering
11/18/1998EP0878985A2 Electronic part for mounting on a substrate
11/18/1998EP0878984A1 Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg
11/18/1998EP0878875A2 Circuit board mounted connector and contact used in the same
11/18/1998EP0878355A2 Method and apparatus for dispensing fluid on a non-planar substrate
11/18/1998EP0878265A1 Solder, solder paste and soldering method
11/18/1998EP0877762A1 Dual-curing coating formulation and method
11/18/1998EP0877713A1 Ultrasonic mixing of through hole treating compositions
11/18/1998EP0877709A1 Soft pack package and dispensing system for liquid photoimageable solder mask
11/18/1998EP0811245A4 Microelectronic assemblies including z-axis conductive films
11/18/1998EP0780006B1 Process for producing a smart card module for contactless smart cards
11/18/1998EP0780005B1 Ic support element
11/18/1998EP0662256B1 An electrical connecting structure and a method for electrically connecting terminals to each other
11/18/1998CN1199538A Magnetic prepreg, its mfg. method and printed wiring board employing said prepreg
11/18/1998CN1199319A Print board assembly producing system and method
11/17/1998US5838567 Computer-based method
11/17/1998US5838549 Memory module and an IC card
11/17/1998US5838546 Mounting structure for a semiconductor circuit
11/17/1998US5838532 Chip type aluminum electrolytic capacitor
11/17/1998US5838519 Printed circuit board, magnetic disk apparatus with the printed circuit board, and method for connecting the printed circuit board
11/17/1998US5838412 Liquid crystal display device assembled by flip chip technology comprising a folded multi-layered flexible driving circuit substrate
11/17/1998US5838409 Uv resin
11/17/1998US5838400 Liquid crystal display device with reduced frame portion surrounding display area
11/17/1998US5838070 Apparatus having a substrate and electronic circuit solder-connected with the substrate
11/17/1998US5838069 Ceramic substrate having pads to be attached to terminal members with Pb-Sn solder and method of producing the same
11/17/1998US5838064 For cooling an electronic device
11/17/1998US5837978 For controlling an application of radiation to a workpiece in a cavity
11/17/1998US5837624 Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom
11/17/1998US5837609 Fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part
11/17/1998US5837607 Method of making a laser synthesized ceramic electronic devices and circuits
11/17/1998US5837566 Vertical interconnect process for silicon segments
11/17/1998US5837427 Sequestering stacking dielectric and conductors
11/17/1998US5837380 Multilayer structures and process for fabricating the same
11/17/1998US5837368 Insulating film with improved punching characteristics and lead frame using the same
11/17/1998US5837355 Multilayer printed circuit board and process for producing and using the same
11/17/1998US5837155 Insulating resin composition for build-up by copper foil lamination and method for production of multilayer printed circuit board using the composition
11/17/1998US5837154 Method of manufacturing double-sided circuit tape carrier
11/17/1998US5837119 Plating surfaces, growing copper dendrites with current density, nucleation, removal and heat treatment
11/17/1998US5837067 Fluid treatment of printed circuit including etching, washing, cleaning by an apparatus having a plurality of drive rod receiving passage, inserted drive rods, fluid injection passage; controlling, maintaining the fluid velocity
11/17/1998US5836520 Apparatus for dispensing fluid in an array pattern
11/17/1998US5836244 Rotation system for circuit board screener
11/17/1998US5836226 Apparatus for progressively feeding and machining sheet material
11/17/1998US5836084 Stencil dryer
11/15/1998CA2232172A1 Method and apparatus for dispensing fluid on a non-planar substrate
11/12/1998WO1998051137A1 Method for mounting a cooling element on an apparatus and such a cooling element
11/12/1998WO1998051136A1 Method for metallizing at least one printed circuit board or at least one pressed screen and at least one hybrid
11/12/1998WO1998051135A1 Improvements in the manufacturing processes of service boxes and their parts
11/12/1998WO1998050954A1 Stacked semiconductor devices, particularly memory chips
11/12/1998WO1998050953A1 Electronic component having resilient contact elements at areas remote from corresponding terminals
11/12/1998WO1998050952A1 Ball grid array semiconductor package and method for making the same
11/12/1998WO1998050950A1 Semiconductor device and its manufacture
11/12/1998WO1998050255A2 Sensor circuit, specially for an automobiles
11/12/1998WO1998050218A1 Extruded core laminates for circuit boards
11/12/1998WO1998050189A1 Apparatus and method for forming solder bonding pads
11/12/1998WO1998020533A3 Method for using photoabsorptive coatings to enhance both blind and through micro-via entrance quality
11/12/1998DE19819217A1 Electronic component base plate
11/12/1998DE19818751A1 Multi-layer electric circuit board
11/12/1998DE19740431C1 Metallising non-conductive substrate regions especially circuit board hole walls
11/12/1998DE19719763A1 Micro-hybrid circuit using multi-chip module
11/12/1998DE19719700A1 Blind hole production in circuit board
11/12/1998DE19719455A1 Sensorschaltung, insbesondere für Kraftfahrzeuge Sensor circuit, especially for motor vehicles
11/12/1998DE19719449A1 Electrical connection method for circuit boards
11/12/1998DE19719235A1 Verfahren zur Kontaktierung wenigstens einer Leiterplatte oder wenigstens eines Stanzgitters und wenigstens eines Hybrids A process for contacting at least a printed circuit board or at least one punched grid and at least a hybrid
11/12/1998DE19718835A1 Electrohydraulic pressure regulating device
11/12/1998DE19718169A1 Anti-lock braking controller for motor vehicles