| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/23/1999 | US5885891 Forming on semiconductor pad electrode high bonding strength first metal layer and second metal barrier layer, selectively etching second metal masked with photoresist and first metal masked with solder |
| 03/23/1999 | US5885723 High polymer epoxy resin, denatured polyamide obtained by reacting epoxy resin and polyamide, polyfunctional epoxy resin, curing agent |
| 03/23/1999 | US5885717 Nontacky crosslinked anionic copolymer comprising (meth)acrylate ester and vinyl acetate monomers, attaching to polyimide with airtight seal; electronic microdevices |
| 03/23/1999 | US5885501 Process for preparing dimensionally stabilized biaxially stretched thermoplastic film |
| 03/23/1999 | US5885476 Composition for microetching copper or copper alloy |
| 03/23/1999 | US5885436 Contacting metal foil with solution containing oxidizer and hydroxide, forming cathodic chromium coating in electrolysis bath, then coating with silane compound coupling agent |
| 03/23/1999 | US5885369 Alloy powder having protective coating of adipic acid reacted with alloy surface; oxidation resistance |
| 03/23/1999 | US5885366 Method for washing oily soil from objects |
| 03/23/1999 | US5885091 Method and apparatus for providing planar and non-planar compliant electrical connections between adjacent circuits |
| 03/23/1999 | US5884398 Mounting spring elements on semiconductor devices |
| 03/23/1999 | US5884397 Method for fabricating chip carriers and printed circuit boards |
| 03/23/1999 | US5884396 Forming single sided circuit, applying photoresist, electroplating with copper, etching |
| 03/18/1999 | WO1999013696A1 Method for metallization of a substrate containing electric non-conductive surface areas |
| 03/18/1999 | WO1999013695A1 Improved stencil or mask for printing fluid material |
| 03/18/1999 | WO1998032213A3 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same |
| 03/18/1999 | DE19737808A1 Structuring and manufacturing circuit boards |
| 03/18/1999 | DE19736113A1 Verfahren und Vorrichtung zur Ermittlung einer Kenngröße für ein Metallisierungsbad Method and apparatus for determining a characteristic quantity for a metallizing |
| 03/17/1999 | EP0902611A2 Recyclable circuit board comprising a foil and support system |
| 03/17/1999 | EP0902610A1 Arrangement of an ordered array of balls of solder alloy on respective pads of a baseplate of a BGA device |
| 03/17/1999 | EP0902609A1 Process for manufacturing a circuit board, circuit board and device for carrying out the process |
| 03/17/1999 | EP0902607A2 Security feature for printed circuit boards |
| 03/17/1999 | EP0902602A1 Device for electrically connecting a printed resistive trace on a support with the mains |
| 03/17/1999 | EP0902330A1 Photomask and alignment method |
| 03/17/1999 | EP0902297A2 Adapter devices for testing printed circuit boards |
| 03/17/1999 | EP0902296A1 Adapter devices for testing printed circuit boards |
| 03/17/1999 | EP0902048A1 High dielectric constant flexible polyimide film and process of preparation |
| 03/17/1999 | EP0901904A1 Screen printing machine with improved device for aspirating excess ink |
| 03/17/1999 | EP0901745A1 A method of selectively metallizing a substrate using a hot foil embossing technique |
| 03/17/1999 | EP0901695A1 Connectors for microelectronic elements |
| 03/17/1999 | EP0806128B1 Method of selectively removing a metallic layer from a non-metallic substrate |
| 03/17/1999 | EP0729645B1 A high density integrated circuit assembly combining leadframe leads with conductive traces |
| 03/17/1999 | CN1211160A Wiring board and its producing method |
| 03/17/1999 | CN1211159A Method for etching and thining copper foil with sulfuric acid and hydrogen peroxide solution |
| 03/17/1999 | CN1210886A Washing liquid |
| 03/17/1999 | CN1210772A Flux composition |
| 03/16/1999 | US5884105 Zoom compact camera |
| 03/16/1999 | US5883791 Electronic circuit unit and method of mounting the same |
| 03/16/1999 | US5883789 Method of mounting a PC board to a hybrid |
| 03/16/1999 | US5883780 Ceramic electronic part |
| 03/16/1999 | US5883432 Connection structure between electrode pad on semiconductor device and printed pattern on printed circuit board |
| 03/16/1999 | US5883425 Circuit device |
| 03/16/1999 | US5883335 Electrical connection substrate having a through hole for connecting a chip to an opposite surface of the substrate |
| 03/16/1999 | US5883149 Tackified pressure sensitive adhesives |
| 03/16/1999 | US5883060 Hydrogen fluoride, hydrogen peroxide, alcohol |
| 03/16/1999 | US5882957 Without drilling through-holes and filling the holes with conductive paste. |
| 03/16/1999 | US5882954 Method for adhering a metallization to a substrate |
| 03/16/1999 | US5882720 Shape classification for pads |
| 03/16/1999 | US5882572 Method for producing a line-shaped weakening by means of lasers |
| 03/16/1999 | US5882467 Organosiloxane compositions yielding cured products exhibiting adhesion and reduced flammability |
| 03/16/1999 | US5882459 Method for aligning and laminating substrates to stiffeners in electrical circuits |
| 03/16/1999 | US5882455 Apparatus and method for forming isotropic multilayer ceramic substrates |
| 03/16/1999 | US5882451 Method and apparatus for applying an electronic component adhesive |
| 03/16/1999 | US5882286 Drilling unit for printed circuit boards having two operating heads |
| 03/16/1999 | US5881947 Method for soldering |
| 03/16/1999 | US5881455 Method of fabricating through-holed wiring board |
| 03/16/1999 | US5881453 Method for mounting surface mount devices to a circuit board |
| 03/11/1999 | WO1999012404A1 Flexible circuits and carriers and process for manufacture |
| 03/11/1999 | WO1999012223A1 A method and an arrangement in an electronics system |
| 03/11/1999 | WO1999012198A1 Method for connecting electronic components with a carrier substrate |
| 03/11/1999 | WO1999011727A1 Printable adhesive composition and methods of preparation |
| 03/11/1999 | WO1998057357A3 Multiple board package employing solder balls and fabrication method and apparatus |
| 03/11/1999 | WO1998049876A3 Capacitive device on a circuit board |
| 03/11/1999 | WO1998042529A3 Control device for a vehicle and method for the production thereof |
| 03/11/1999 | DE19828489A1 Semiconductor component has a multilayer plastic substrate |
| 03/11/1999 | DE19828386A1 Semiconductor component with laminated ball grid array (BGA) substrate |
| 03/11/1999 | DE19823615A1 New flux composition |
| 03/11/1999 | DE19809509A1 Semiconductor component with ball grid array (BGA) |
| 03/11/1999 | DE19740790C1 Manufacturing ceramic film based components |
| 03/11/1999 | CA2297212A1 Flexible circuits and carriers and process for manufacture |
| 03/10/1999 | EP0901317A1 Surface mounted electrical connector for tuner |
| 03/10/1999 | EP0901308A2 Integral holder-connector for capacitor microphone |
| 03/10/1999 | EP0901188A2 Electric press-fit component ,especially press-fit connectors, for solderless connection with plated through-holes of a circuit board |
| 03/10/1999 | EP0901187A2 Connector for Connecting a printed circuit board to a flat flexible circuit |
| 03/10/1999 | EP0901165A1 Housing for integrated circuit and method for mounting integrated circuit |
| 03/10/1999 | EP0901155A1 Semiconductor mounting assembly for applying an adhesive on a substrate |
| 03/10/1999 | EP0901101A2 Noncontact IC device |
| 03/10/1999 | EP0900132A1 Method employing uv laser pulses of varied energy density to form blind vias in multilayered targets |
| 03/10/1999 | EP0812258A4 Electrical feedthroughs for ceramic circuit board support substrates |
| 03/10/1999 | EP0790892B1 Stencil holder |
| 03/10/1999 | EP0676456B1 Heat-resistant adhesive film for printed board and method of use thereof |
| 03/10/1999 | CN2310438Y Multi-layer circuit board with holeless conductive blind hole |
| 03/10/1999 | CN2310437Y Opening machine head for printed circuit board welding machine |
| 03/10/1999 | CN2310436Y Circuit board conveying device between developing trough and washing trough |
| 03/10/1999 | CN1210614A Anisotropic conductive composition |
| 03/10/1999 | CN1210602A Method and apparatus for bonding wire conductor |
| 03/10/1999 | CN1210480A Grafted thermoplastic elastomer barrier layer |
| 03/10/1999 | CN1210440A Method for preventing gold plate connector on PCB from being contaminated |
| 03/10/1999 | CN1210368A Method for automatically welding package of ball array integrated circuit by coil belt |
| 03/10/1999 | CN1210367A Method for automatically welding package of ball array integrated circuit by coil belt |
| 03/10/1999 | CN1210363A Method for automatically welding package of ball array integrated circuit by coil belt |
| 03/10/1999 | CN1210352A Multilayer interconnection board and connection pin |
| 03/10/1999 | CN1210343A Elexible electric cable and its application |
| 03/10/1999 | CN1210304A Laminated substrate board and data inputting device using the same board |
| 03/09/1999 | US5880969 Method and apparatus for deciding a wiring route and for detecting a critical cut |
| 03/09/1999 | US5880935 Device for using in an electronic controller |
| 03/09/1999 | US5880926 Electronic device with mounting structure |
| 03/09/1999 | US5880925 Surface mount multilayer capacitor |
| 03/09/1999 | US5880820 Light exposure installation of a double-sided printed circuit plate through artworks |
| 03/09/1999 | US5880795 Liquid crystal display module and projection-type liquid crystal display device |
| 03/09/1999 | US5880705 Mounting structure for a tessellated electronic display having a multilayer ceramic structure and tessellated electronic display |