| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/19/1999 | US5860585 Substrate for transferring bumps and method of use |
| 01/19/1999 | US5860582 Inert atmosphere soldering apparatus |
| 01/19/1999 | US5860575 Stability enhancement of molten solder droplets as ejected from a nozzle of droplet pump |
| 01/19/1999 | US5860361 Screen plate cleaning station |
| 01/19/1999 | US5860212 Method of coating a conductive substance on a transparent electrode formed on a substrate and method of mounting a semiconductor device or film substrate on the substrate |
| 01/14/1999 | WO1999002022A1 Printed circuit board with a leaded component and method of securing the component |
| 01/14/1999 | WO1999002021A1 Process and device for generating test patterns when applying solder paste by a screen printing process on printed circuit boards |
| 01/14/1999 | WO1999001913A1 Miniature filament lamp |
| 01/14/1999 | WO1999001892A2 Captured-cell solder printing and reflow methods and apparatuses |
| 01/14/1999 | WO1999001879A1 Thermal release for fixing on a circuit substrate |
| 01/14/1999 | WO1999001876A1 Resistor and method of producing the same |
| 01/14/1999 | WO1999001796A2 Pattern-forming methods |
| 01/14/1999 | WO1999001795A2 Pattern-forming methods and radiation sensitive materials |
| 01/14/1999 | WO1999001772A1 Printed circuit board testing device |
| 01/14/1999 | WO1999001250A1 Method for soft soldering metals and soft solder for carrying said method |
| 01/14/1999 | DE19729891A1 Equipment modifying plastic surfaces using accelerated silicon carbide grit blaster followed by plasma treatment |
| 01/14/1999 | DE19729587A1 Solder application onto circuit board contact pads |
| 01/14/1999 | DE19729486A1 Combined punching and injection moulding tool, especially for printed circuit boards and manufacturing process |
| 01/14/1999 | DE19729215A1 Drilling device for printed circuit boards |
| 01/14/1999 | DE19729073A1 Verfahren zur Herstellung einer Klebeverbindung zwischen einem elektronischen Bauelement und einem Trägersubstrat A process for producing an adhesive connection between an electronic component and a carrier substrate |
| 01/14/1999 | CA2264900A1 Miniature filament lamp |
| 01/14/1999 | CA2240184A1 Method and apparatus for attaching electronic components to substrates |
| 01/13/1999 | EP0891127A2 TAB circuit protective coating |
| 01/13/1999 | EP0891126A2 Drilling unit for printed circuit boards having two operating heads individually movable |
| 01/13/1999 | EP0891125A1 Reworkable circuit board assembly including a flip chip |
| 01/13/1999 | EP0891124A2 Three-dimensional electrical interconnection system |
| 01/13/1999 | EP0890660A1 Microetching agent for copper or copper alloys |
| 01/13/1999 | EP0890623A1 Coating fluid for low-permittivity silica coating and substrate provided with low-permittivity coating |
| 01/13/1999 | EP0890297A1 Solder bonded electronic module |
| 01/13/1999 | EP0890198A1 Arrangement of two disconnectable flat conductors and a connection unit for connecting a flat conductor |
| 01/13/1999 | EP0890197A1 Bidirectional non-solid impedance controlled reference plane |
| 01/13/1999 | EP0890137A1 Articulated platform mechanism for laser pattern generation on a workpiece |
| 01/13/1999 | EP0588978B1 A composition and a process for removing rosin solder flux with terpene and hydrocarbons |
| 01/13/1999 | EP0569528B1 Electrical connector assembly |
| 01/13/1999 | CN1204941A Connecting structure of frame and printed circuit board |
| 01/13/1999 | CN1204940A Metal backed printed circuit board assemblies |
| 01/13/1999 | CN1204850A Production processes of printed substrate, electron-emitting element, electron source and image-forming apparatus |
| 01/12/1999 | US5859539 For testing multiple semiconductor devices |
| 01/12/1999 | US5859474 Reflow ball grid array assembly |
| 01/12/1999 | US5859473 Duplexer package |
| 01/12/1999 | US5859472 Microelectronic lead assembly to connect microelectronic elements |
| 01/12/1999 | US5859470 Chemical resistant solder connector containing bismuth, lead, tin, cadmium and indium; solid at room temperature, will liquify at temperature when interconnections during use, not react with copper |
| 01/12/1999 | US5859407 Connecting board for connection between base plate and mounting board |
| 01/12/1999 | US5859181 Reacting diaminopolysiloxane, alicyclic diamine, aromatic tetracarboxylic acid, imidating resulting polyamic acid |
| 01/12/1999 | US5859155 Adhesive of epoxy resin, carboxylated rubber aromatic amine and dicyandiamide |
| 01/12/1999 | US5859086 Adding solution containing reactive species to fluoropolymer surface, exposing to ultraviolet radiation in the presence of ozone; prevents discoloration |
| 01/12/1999 | US5859085 Preparing pyrrole-silver complex; precipitation to form a white polycrystalline photosensitive powder; dissolving; casting onto surface; photopolymerizing to form a metal-loaded polymer film of low electroconductivity |
| 01/12/1999 | US5858816 Method for producing circuit board, for semiconductor package, having cavity for accommodating semiconductor element |
| 01/12/1999 | US5858806 Method of bonding IC component to flat panel display |
| 01/12/1999 | US5858618 Photopolymerizable resinous composition |
| 01/12/1999 | US5858615 Containing triazine compound |
| 01/12/1999 | US5858591 Improving the quality of photoresist images by separating cell descriptions (where line density is high) from peripheral areas (where line density is low) into two subfiles; applying a suitable bias and merging to one file |
| 01/12/1999 | US5858550 Multilayer; coextrusion, casting, molecular orientation |
| 01/12/1999 | US5858517 Electrodeposited copper foil for printed wiring board and method of manufacturing the same |
| 01/12/1999 | US5858496 Optically transparent article with embedded mesh |
| 01/12/1999 | US5858481 Seal is formed of polyphenylene sulfide or liquid crystal polymer having high heat resistance and low thermal expansion cofficient |
| 01/12/1999 | US5858461 Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing |
| 01/12/1999 | US5858257 Method for wet etching and device used therein |
| 01/12/1999 | US5858255 Printed circuit plates |
| 01/12/1999 | US5858254 Multilayered circuitized substrate and method of fabrication |
| 01/12/1999 | US5858198 Electroplating process |
| 01/12/1999 | US5858145 Method to control cavity dimensions of fired multilayer circuit boards on a support |
| 01/12/1999 | US5858074 Organic solderability preservative compositions |
| 01/12/1999 | US5857858 Electrical interconnection |
| 01/12/1999 | US5857767 Thermal management system for L.E.D. arrays |
| 01/12/1999 | US5857610 Process and apparatus for forming ball bumps |
| 01/12/1999 | US5857397 Sheet machining apparatus |
| 01/12/1999 | US5857257 Method of manufacturing magnetic head suspension having circuit wiring pattern |
| 01/12/1999 | US5857251 Machine for machining sheet-like articles |
| 01/08/1999 | CA2210063A1 Method of manufacturing wire segments of homogeneous composition |
| 01/07/1999 | WO1999000877A1 Display mounting assembly |
| 01/07/1999 | WO1999000874A1 Circuit connector |
| 01/07/1999 | WO1999000844A2 Sockets for semiconductor devices with spring contact elements |
| 01/07/1999 | WO1999000842A1 Substrate for mounting semiconductor chips |
| 01/07/1999 | WO1999000807A1 Surface mount multilayer capacitor |
| 01/07/1999 | EP0889680A2 Method of removing and/or applying conductive material |
| 01/07/1999 | EP0889679A1 Printed circuit contact pad for pinch connector |
| 01/07/1999 | EP0889678A1 Compressible elastomeric contact and mechanical assembly therewith |
| 01/07/1999 | EP0889512A2 Method for controlling solder bump shape and stand-off height |
| 01/07/1999 | EP0889363A1 Near IR sensitive photoimageable/photopolymerizable compositions, media, and associated processes |
| 01/07/1999 | EP0888701A1 Thin film fabrication technique for implantable electrodes |
| 01/07/1999 | EP0888228A1 Control unit |
| 01/07/1999 | EP0888227A1 Ignition device for release of restraining means in a motor vehicle |
| 01/07/1999 | EP0815591A4 Microcircuit via interconnect |
| 01/07/1999 | EP0664016B1 Method for preparing and using a screen printing stencil having raised edges |
| 01/07/1999 | DE19824139A1 Metal coating article of elastomeric material dispersed in poly:phthalamide |
| 01/07/1999 | DE19749832A1 Conductive material application to and-or removal from circuit board |
| 01/07/1999 | DE19732680A1 Multiple contact surfaces wetting device e.g. for ball-grid array housings |
| 01/07/1999 | DE19728625A1 Kleinglühlampe Miniature incandescent lamp |
| 01/07/1999 | DE19728144A1 Verfahren und Vorrichtung zum Erzeugen von Testpattern Method and apparatus for generating test pattern |
| 01/07/1999 | DE19728014A1 Verfahren zum Weichlöten von Metallen und Weichlot zur Ausführung dieses Verfahrens A method for soft soldering and solder to complete this procedure |
| 01/07/1999 | DE19727804A1 Process control system for SMD production line |
| 01/06/1999 | CN2302863Y Multi-point flowing type solder melting oven |
| 01/06/1999 | CN1204450A Solder mask for manufacture of printed circuit board |
| 01/05/1999 | US5856912 Microelectronic assembly for connection to an embedded electrical element, and method for forming same |
| 01/05/1999 | US5856911 Attachment assembly for integrated circuits |
| 01/05/1999 | US5856699 Photoelectric conversion apparatus with level photoreceiving surface |
| 01/05/1999 | US5856636 Electronic circuit prototype wiring board with visually distinctive contact pads |
| 01/05/1999 | US5856235 Heat resistance |
| 01/05/1999 | US5856068 Method for fabricating a printed circuit board by curing under superatmospheric pressure |